M
Litton
Kester Solder
TSF-6522
No-Clean Tacky Soldering Flux
Product Description
Kester formula TSF-6522 is a no-clean tacky
soldering flux formula designed to be used
with a rotating disc, a doctor blade, or a drum
fluxer. The TSF-6522 can also be used in
dot dispensing for BGA/PGA sites or in a
rework application for surface mount
packages. TSF-6522 maintains its activity
and dispensing characteristics for up to 8
hours and can be used in a wide range of
temperature and humidity conditions. Kester
maintains the highest standards by
manufacturing the TSF-6522 under a
vacuum environment.
•
•
•
•
High tack values and long tack life
Leaves bright/shiny solder joints after
reflow
ANSI/J-STD-004 flux designator ROL0
Can reflow in air or nitrogen environments
•
Copper Mirror Corrosion:
Low
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
•
Corrosion Test:
Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
•
pH 5% Solution:
7.7
Kester Method #1W-QC-G-15
Qualitative Halide Tests:
•
Silver Chromate:
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
•
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
•
Typical S.I.R., IPC:
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3, (B-24 coupon)
10
Blank at 24 hours: 3.08 x 10 ohms
Blank at 96 hours: 1.27 x 10
10
ohms
Blank at 168 hours: 8.79 x 10
9
ohms
Physical Properties (typical)
•
Viscosity:
285 poise
Kester Method #1W-QC-3-09
Uncleaned at 24 hours: 2.56 x 10
8
ohms
Uncleaned at 96 hours: 4.17 x 10
8
ohms
Uncleaned at 168 hours: 6.38 x 10
8
ohms
•
Typical S.I.R., Bellcore:
Blank at 24 hours: 1.44 x 10 ohms
Blank at 96 hours: 1.38 x 10
13
ohms
Uncleaned at 24 hours: 2.19 x 10
13
ohms
Uncleaned at 96 hours: 1.56 x 10
13
ohms
Tested to TR-NWT-000078, IPC B-24 coupon
12
•
Tackiness (grams-force):
100
Kester Method #1W-QC-03-04
•
Acid Number:
75.4
Kester Method #1W-QC-G-01
•
Color:
Yellow to Light Amber
Kester Method #1W-QC-G-18
Reliability Properties (typical)
KESTER SOLDER
515 East Touhy Ave.
Des Plaines, IL 60018-2675
847 297 1600
847 390 9338 FAX
1-800-2-KESTER
www.kester.com
The data and recommendations presented are based on tests which we consider reliable. Because Kester Solder has no control
over the conditions of use, we disclaim any responsibility connected with the use of any of our products or the information
presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are
aware of the potential hazards involved and the necessity for reasonable care in their handling.
BRANCHES: ANAHEIM, CA
•
JAMESTOWN, NY
BRANTFORD, ONTARIO, CANADA
•
SINGAPORE
•
GERMANY
•
TAIWAN
Standard Applications:
•
Works on flip chip, chip scale package and flip chip bumping sites assemblies as a soldering flux.
•
Tacky solder flux formulations are designed for pin transfer, dot dispensing and/or syringe applications.
•
Tacky solder flux formulations can be used as a tack and flux vehicle for soldering components to a solid solder
deposit (SSD), or precision pad technology (PPT) board surfaces.
•
Great for rework applications on all PCB packages.
•
Can be used in BGA/PGA sphere/pin attachment vehicle or for repair and reballing/repinning.
Application Notes
Reflow Profiles:
Plastic Ball Grid Array vs.Standard Kester Reflow Profile
TSF-6522 No-Clean Tacky Soldering Flux
Temperature (°C)
240
220
200
180
180
160
140
120
100
80
60
40
20
0
0
1.75°C/sec.
0.50°C/sec.
0.33°C/sec.
160
140
120
100
TSF-6522 No-Clean Tacky Soldering Flux Reflow Profile
Standard Surface Mount Packages
Temperature (°C)
240
Standard Reflow Profile
BGA Reflow Profile
Peak Temp.
210°C max.
220
200
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
1.3 - 1.6°C/Sec
Peak Temp.
210 - 235°C
.
.
.
.
.
Primary
Pre-heat Zone
(45-55sec.)
30
60
Secondary
Pre-heat Zone
(60-75 sec.)
80
Soak Zone (~120 sec.)
Reflow Zone
(45-60 sec.)
60
40
20
. . . . . . . . .
.
Soaking Zone
.
.
( 2.0 min. max. )
~ 60 - 90 sec. ideal
.
<2.5° C/ Sec
.
.
Pre-heating Zone
.
.
( 2.0 - 4.0 min. max.)
.
.
.
0
30
60
90
120
150
0.5 - 0.6 °C/ Sec
. . . . . .
.
.
.
.
.
Reflow Zone
.
.
(30 - 90 sec. max.)
.
~40 - 60 sec. ideal
.
.
.
.
.
.
.
.
.
210
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
240
270
300
90
120
150
180
210
240
270
300
330
0
180
Time (Seconds)
Time (Seconds)
Printing Parameters:
•
Temperature/Humidity -- Optimal ranges for production are 21-25°C (70-77°F) and 35-65% R.H.
Activation Parameters:
in diagrams above.
•
Temperature -- Optimal activation temperatures are 130°-185°C (266-365°F). See “Soak Zone”
Cleaning:
•
Formula TSF-6522 is a no-clean formula. The residues do not need to be removed for typical applications.
•
Although formula TSF-6522 is designed for no-clean applications, its residues can be easily removed using
automated cleaning equipment (in-line or batch) with the aid of Kester Bio-Kleen #5768 saponifier in a 10-12%
concentration in de-ionized water at approximately 140°F (60°C).
Available Packaging:
•
Syringes -- 10 gram (10cc) and 30 gram (30cc) syringes available.
•
Cartridges -- 150 gram and 300 gram cartridges available.
•
Jars -- 50 gram and 100 gram jars available.
Storage, Handling, and Shelf Life:
•
Storage & Handling -- should be kept at standard refrigeration temperatures and humidity conditions, 0-10°C
(32-50°F) and 35-55% R.H. respectively.
•
Shelf life -- 4 months from date of manufacture when held at 0-10°C (32-50°F).
Health & Safety:
•
This product, during handling or use, may be hazardous to health or the environment.
•
Read the Material Safety Data Sheet and warning label before using this product.
Attention Specification Writers:
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