ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP24,.3 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 5 V |
| 最小模拟输入电压 | |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.3906% |
| 模拟输入通道数量 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | -20 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 20 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 最大压摆率 | 30 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| TMC1175N2C20 | TMC1175N2C50 | TMC1175N2C40 | TMC1175N2C30 | TMC1175R3C30 | |
|---|---|---|---|---|---|
| 描述 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PQCC28 |
| 包装说明 | DIP, DIP24,.3 | DIP, | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | S-PQCC-J28 |
| 最大线性误差 (EL) | 0.3906% | 0.3906% | 0.3906% | 0.3906% | 0.3906% |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 28 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 20 MHz | 50 MHz | 40 MHz | 30 MHz | 30 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK |
| 最大压摆率 | 30 mA | 48 mA | 40 mA | 35 mA | 35 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 封装等效代码 | DIP24,.3 | - | DIP24,.3 | DIP24,.3 | LDCC28,.5SQ |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | - | 5 V | 5 V | 5 V |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | - | Fairchild | Fairchild | Fairchild | Fairchild |
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