05192
ULLC0402FC3.3C*
thru
Only One Name Means ProT
ek’Tion™
ULLC0402FC24C*
UNBUMPED LOW CAPACIT
ANCE FLIP CHIP ARRA
Y
APPLICA
TIONS
✔
Cellular Phones
✔
Personal Digital Assistant (PDA)
✔
Notebook Computers
✔
SMART Cards
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
ESD Protection > 25 kilovolts
✔
Available in Six Voltage Types Ranging From 3.3V to 24V
✔
Low ESD Overshoot Voltage
✔
Bidirectional Configuration & Monolithic Structure
✔
Protects 1 Line
✔
LOW CAPACITANCE: 6pF
✔
LOW LEAKAGE CURRENT
✔
RoHS Compliant
MECHANICAL CHARACTERISTICS
✔
Standard EIA Chip Size: 0402
✔
Weight 0.73 milligrams (Approximate)
✔
Solder Reflow Temperature:
Tin-Lead - Sn/Pb: 240-245°C
Lead-Free: 260-270°C
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
U0402
PIN CONFIGURA
TION
*U.S. Patent No. 6,867,436
05192.R1 3/05
1
www.protekdevices.com
ULLC0402FC3.3C*
thru
ULLC0402FC24C*
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Operating Temperature
Storage Temperature
SYMBOL
T
J
T
STG
VALUE
-55°C to 150°C
-55°C to 150°C
UNITS
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
TYPICAL
CAPACITANCE
V
WM
VOLTS
ULLC0402FC3.3C
ULLC0402FC05C
ULLC0402FC08C
ULLC0402FC12C
ULLC0402FC15C
ULLC0402FC24C
Note 1:
All devices are bidirectional.
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
@V
WM
I
D
µA
75
1.0
0.1
0.1
0.1
0.1
@0V, 1 MHz
C
pF
6
6
6
6
6
6
3.3
5.0
8.0
12.0
15.0
24.0
*U.S. Patent No. 6,867,436
05192.R1 3/05
2
www.protekdevices.com
ULLC0402FC3.3C*
thru
ULLC0402FC24C*
GRAPHS
FIGURE 2
OVERSHOOT & CLAMPING VOLTAGE FOR ULLC0402FC05C
35
25
5 Volts per Division
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 3
CAPACITANCE VS REVERSE VOLTAGE FOR ULLC0402FC05C
10
8
C
j
- Capacitance - pF
6
4
2
0
0
1
2
3
4
5
6
V
R
- Reverse Voltage - Volts
*U.S. Patent No. 6,867,436
05192.R1 3/05
3
www.protekdevices.com
ULLC0402FC3.3C*
thru
ULLC0402FC24C*
APPLICA
TION INFORMA
TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
*U.S. Patent No. 6,867,436
05192.R1 3/05
4
www.protekdevices.com
ULLC0402FC3.3C*
thru
ULLC0402FC24C*
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
U0402
TOP
SIDE
A
C
B
PACKAGE DIMENSIONS
DIM
A
B
C
D
E
F
I
MILLIMETERS
0.46 NOM
0.86 NOM
0.99 ± 0.0254
0.10 NOM
0.35 NOM
0.483 ± 0.0254
0.406 NOM
INCHES
0.018 NOM
0.034 NOM
0.039 ± 0.001
0.004 NOM
0.014 NOM
0.019 ± 0.001
0.016 NOM
E
F
Metalized Die Contacts
D
END
I
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx ± 0.05mm (± 0.002”).
3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”).
MOUNTING PAD
DIM
C
B
A
D
PAD DIMENSIONS
MILLIMETERS
0.23
0.48
0.69
0.46
0.99
0.20
0.20
0.66
0.13
INCHES
0.009
0.019
0.027
0.018
0.039
0.008
0.008
0.026
0.005
SOLDER PAD
DIE
CONTACTS
A
B
C
D
E
F
G
H
I
DIE
H
E
NOTE:
1. Top view of tape. Metal contacts are face down in tape
package.
F
I
T
APE & REEL ORIENT TION
A
SOLDER PRINT
DIAMETER 0.010” -
0.012”
G
Single Die - 0402
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULLC0402FC05C-T75-1).
3.
8mm Paper Tape:
7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., ULLC0402FC05C-T710-2).
NOTE:
1.
Preferred:
Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 3 - 11/02, 06020
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
*U.S. Patent No. 6,867,436
05192.R1 3/05
5
www.protekdevices.com
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