2KX8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.300 INCH, PLASTIC, SOP-14
| 参数名称 | 属性值 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | HARDWARE WRITE PROTECT FOR UPPER BLOCK; DATA RETENTION > 40 YEARS |
| 最大时钟频率 (fCLK) | 0.8 MHz |
| 数据保留时间-最小值 | 40 |
| JESD-30 代码 | R-PDSO-G14 |
| 长度 | 9 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| 最长写入周期时间 (tWC) | 15 ms |
| Base Number Matches | 1 |
| NM24C17LMX | NM24C17LEM | NM24C17LM | 2170539-4 | NM24C09LEM | |
|---|---|---|---|---|---|
| 描述 | 2KX8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.300 INCH, PLASTIC, SOP-14 | 2KX8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.300 INCH, PLASTIC, SOP-14 | 2KX8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.300 INCH, PLASTIC, SOP-14 | Connector Accessory | 1KX8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.300 INCH, PLASTIC, SOP-14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| 零件包装代码 | SOIC | SOIC | SOIC | - | SOIC |
| 包装说明 | SOP, | SOP, SOP14,.4 | SOP, SOP14,.4 | - | SOP, SOP14,.4 |
| 针数 | 14 | 14 | 14 | - | 14 |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 其他特性 | HARDWARE WRITE PROTECT FOR UPPER BLOCK; DATA RETENTION > 40 YEARS | HARDWARE WRITE PROTECT FOR UPPER BLOCK; DATA RETENTION > 40 YEARS | HARDWARE WRITE PROTECT FOR UPPER BLOCK; DATA RETENTION > 40 YEARS | - | HARDWARE WRITE PROTECT FOR UPPER BLOCK; DATA RETENTION > 40 YEARS |
| 最大时钟频率 (fCLK) | 0.8 MHz | 0.8 MHz | 0.8 MHz | - | 0.8 MHz |
| 数据保留时间-最小值 | 40 | 40 | 40 | - | 40 |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | - | R-PDSO-G14 |
| 长度 | 9 mm | 9 mm | 9 mm | - | 9 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | - | 8192 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | - | EEPROM |
| 内存宽度 | 8 | 8 | 8 | - | 8 |
| 功能数量 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 14 | 14 | 14 | - | 14 |
| 字数 | 2048 words | 2048 words | 2048 words | - | 1024 words |
| 字数代码 | 2000 | 2000 | 2000 | - | 1000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | - | 85 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 | - | 1KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | - | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | - | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | - | 2.65 mm |
| 串行总线类型 | I2C | I2C | I2C | - | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | YES | YES | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | - | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL |
| 宽度 | 7.5 mm | 7.5 mm | 7.5 mm | - | 7.5 mm |
| 最长写入周期时间 (tWC) | 15 ms | 15 ms | 15 ms | - | 15 ms |
| Base Number Matches | 1 | 1 | 1 | - | - |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 |
| 耐久性 | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles |
| I2C控制字节 | - | 1010MMMR | 1010MMMR | - | 1010DMMR |
| JESD-609代码 | - | e0 | e0 | - | e0 |
| 封装等效代码 | - | SOP14,.4 | SOP14,.4 | - | SOP14,.4 |
| 电源 | - | 3/5 V | 3/5 V | - | 3/5 V |
| 最大待机电流 | - | 0.0001 A | 0.0001 A | - | 0.0001 A |
| 最大压摆率 | - | 0.003 mA | 0.003 mA | - | 0.003 mA |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 写保护 | - | HARDWARE | HARDWARE | - | HARDWARE |
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