IC 512 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.300 INCH, PLASTIC, SOP-14, Programmable ROM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | SOP, SOP14,.4 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | 2 WIRE I2C INTERFACE; 16 BYTE PAGE WRITE; AUTOMATIC WRITE; DATA RETENTION > 40 YEARS |
| 最大时钟频率 (fCLK) | 0.1 MHz |
| 数据保留时间-最小值 | 40 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDMR |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e0 |
| 长度 | 9 mm |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 512X8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP14,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| Base Number Matches | 1 |
| NM24C04MM | NM24C02MM | NM24C08MM | NM24C02MM8 | NM24C02MN | 2213230-4 | NM24C16MN | NM24C04MM8 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC 512 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.300 INCH, PLASTIC, SOP-14, Programmable ROM | IC 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.300 INCH, PLASTIC, SOP-14, Programmable ROM | IC 1K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO14, 0.300 INCH, PLASTIC, SOP-14, Programmable ROM | IC 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8, Programmable ROM | IC 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, MINI, PLASTIC, DIP-8, Programmable ROM | THIS DRAWING IS A CONTROLLED DOCUMENT. | IC 2K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, MINI, PLASTIC, DIP-8, Programmable ROM | IC 512 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOP-8, Programmable ROM |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 包装说明 | SOP, SOP14,.4 | SOP, SOP14,.4 | SOP, SOP14,.4 | 0.150 INCH, PLASTIC, SOP-8 | 0.300 INCH, MINI, PLASTIC, DIP-8 | - | DIP, DIP8,.3 | SOP, SOP8,.25 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | compliant | - | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | 2 WIRE I2C INTERFACE; 16 BYTE PAGE WRITE; AUTOMATIC WRITE; DATA RETENTION > 40 YEARS | 2 WIRE I2C INTERFACE; 16 BYTE PAGE WRITE; AUTOMATIC WRITE; DATA RETENTION > 40 YEARS | 2 WIRE I2C INTERFACE; 16 BYTE PAGE WRITE; AUTOMATIC WRITE; DATA RETENTION > 40 YEARS | 2 WIRE I2C INTERFACE; 16 BYTE PAGE WRITE; AUTOMATIC WRITE; DATA RETENTION > 40 YEARS | 2 WIRE I2C INTERFACE; 16 BYTE PAGE WRITE; AUTOMATIC WRITE; DATA RETENTION > 40 YEARS | - | 2 WIRE I2C INTERFACE; 16 BYTE PAGE WRITE; AUTOMATIC WRITE; DATA RETENTION > 40 YEARS | 2 WIRE I2C INTERFACE; 16 BYTE PAGE WRITE; AUTOMATIC WRITE; DATA RETENTION > 40 YEARS |
| 最大时钟频率 (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | - | 0.1 MHz | 0.1 MHz |
| 数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | - | 40 | 40 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 100000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDMR | 1010DDDR | 1010DMMR | 1010DDDR | 1010DDDR | - | 1010MMMR | 1010DDMR |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G8 | R-PDIP-T8 | - | R-PDIP-T8 | R-PDSO-G8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 |
| 长度 | 9 mm | 9 mm | 9 mm | 4.9 mm | 9.817 mm | - | 9.817 mm | 4.9 mm |
| 内存密度 | 4096 bit | 2048 bit | 8192 bit | 2048 bit | 2048 bit | - | 16384 bit | 4096 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 8 | 8 | - | 8 | 8 |
| 字数 | 512 words | 256 words | 1024 words | 256 words | 256 words | - | 2048 words | 512 words |
| 字数代码 | 512 | 256 | 1000 | 256 | 256 | - | 2000 | 512 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 组织 | 512X8 | 256X8 | 1KX8 | 256X8 | 256X8 | - | 2KX8 | 512X8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | DIP | - | DIP | SOP |
| 封装等效代码 | SOP14,.4 | SOP14,.4 | SOP14,.4 | SOP8,.25 | DIP8,.3 | - | DIP8,.3 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | IN-LINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 1.75 mm | 5.08 mm | - | 5.08 mm | 1.75 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | - | I2C | I2C |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | - | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | - | 0.003 mA | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | - | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 3.9 mm | 7.62 mm | - | 7.62 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | - | 10 ms | 10 ms |
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