Fast Page DRAM Module, 2MX36, 80ns, CMOS, SIMM-72
参数名称 | 属性值 |
零件包装代码 | SIMM |
包装说明 | SIMM, SSIM72 |
针数 | 72 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE |
最长访问时间 | 80 ns |
其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-XSMA-N72 |
内存密度 | 75497472 bit |
内存集成电路类型 | FAST PAGE DRAM MODULE |
内存宽度 | 36 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 72 |
字数 | 2097152 words |
字数代码 | 2000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2MX36 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | SIMM |
封装等效代码 | SSIM72 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 1024 |
座面最大高度 | 31.75 mm |
最大待机电流 | 0.024 A |
最大压摆率 | 1.064 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | SINGLE |
Base Number Matches | 1 |
KMM5362000A-8 | KMM5362000A-7 | KMM5362000A-10 | KMM5362000AG-8 | KMM5362000AG-10 | KMM5362000AG-7 | |
---|---|---|---|---|---|---|
描述 | Fast Page DRAM Module, 2MX36, 80ns, CMOS, SIMM-72 | Fast Page DRAM Module, 2MX36, 70ns, CMOS, SIMM-72 | Fast Page DRAM Module, 2MX36, 100ns, CMOS, SIMM-72 | Fast Page DRAM Module, 2MX36, 80ns, CMOS, SIMM-72 | Fast Page DRAM Module, 2MX36, 100ns, CMOS, SIMM-72 | Fast Page DRAM Module, 2MX36, 70ns, CMOS, SIMM-72 |
零件包装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
包装说明 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
针数 | 72 | 72 | 72 | 72 | 72 | 72 |
Reach Compliance Code | unknown | unknow | unknown | compliant | compliant | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 80 ns | 70 ns | 100 ns | 80 ns | 100 ns | 70 ns |
其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 |
内存密度 | 75497472 bit | 75497472 bi | 75497472 bit | 75497472 bit | 75497472 bit | 75497472 bi |
内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 72 | 72 | 72 | 72 | 72 | 72 |
字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 2MX36 | 2MX36 | 2MX36 | 2MX36 | 2MX36 | 2MX36 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
封装等效代码 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
座面最大高度 | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm |
最大待机电流 | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
最大压摆率 | 1.064 mA | 1.184 mA | 0.944 mA | 1.064 mA | 0.944 mA | 1.184 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved