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CAT25640LI

产品描述8KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 646AA-01, MS-001, DIP-8
产品类别存储    存储   
文件大小185KB,共19页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
标准  
下载文档 详细参数 选型对比 全文预览

CAT25640LI概述

8KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 646AA-01, MS-001, DIP-8

CAT25640LI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码DIP
包装说明DIP, DIP8,.3
针数8
制造商包装代码CASE 646AA-01
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性100 YEAR DATA RETENTION
最大时钟频率 (fCLK)5 MHz
数据保留时间-最小值100
耐久性1000000 Write/Erase Cycles
JESD-30 代码R-PDIP-T8
JESD-609代码e3
长度9.27 mm
内存密度65536 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数8192 words
字数代码8000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织8KX8
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP8,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行SERIAL
峰值回流温度(摄氏度)260
电源2/5 V
认证状态Not Qualified
座面最大高度5.33 mm
串行总线类型SPI
最大待机电流0.000001 A
最大压摆率0.003 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.8 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子面层MATTE TIN
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
宽度7.62 mm
最长写入周期时间 (tWC)5 ms
写保护HARDWARE/SOFTWARE
Base Number Matches1

文档预览

下载PDF文档
CAT25640
64-Kb SPI Serial CMOS
EEPROM
Description
The CAT25640 is a 64−Kb Serial CMOS EEPROM device
internally organized as 8Kx8 bits. This features a 64−byte page write
buffer and supports the Serial Peripheral Interface (SPI) protocol. The
device is enabled through a Chip Select (CS) input. In addition, the
required bus signals are clock input (SCK), data input (SI) and data
output (SO) lines. The HOLD input may be used to pause any serial
communication with the CAT25640 device. The device features
software and hardware write protection, including partial as well as
full array protection.
Features
http://onsemi.com
SOIC−8
V SUFFIX
CASE 751BD
UDFN−8*
HU3 SUFFIX
CASE 517AX
TDFN−8*
VP2 SUFFIX
CASE 511AK
20 MHz (5 V) SPI Compatible
1.8 V to 5.5 V Supply Voltage Range
SPI Modes (0,0) & (1,1)
64−byte Page Write Buffer
Self−timed Write Cycle
Hardware and Software Protection
Block Write Protection
Protect
1
/
4
,
1
/
2
or Entire EEPROM Array
Low Power CMOS Technology
1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Range
PDIP, SOIC, TSSOP 8−lead, TDFN and UDFN 8−pad Packages
This Device is Pb−Free, Halogen Free/BFR Free, and RoHS
Compliant
V
CC
PDIP−8
L SUFFIX
CASE 646AA
UDFN−8
HU4 SUFFIX
CASE 517AZ
TSSOP−8
Y SUFFIX
CASE 948AL
PIN CONFIGURATION
CS
SO
WP
V
SS
1
V
CC
HOLD
SCK
SI
PDIP (L), SOIC (V), TSSOP (Y),
TDFN* (VP2), UDFN* (HU3), UDFN (HU4)
* Not recommended for new designs
PIN FUNCTION
SI
CS
WP
HOLD
SCK
V
SS
CAT25640
SO
Pin Name
CS
SO
WP
V
SS
SI
SCK
HOLD
V
CC
Function
Chip Select
Serial Data Output
Write Protect
Ground
Serial Data Input
Serial Clock
Hold Transmission Input
Power Supply
Figure 1. Functional Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 19 of this data sheet.
©
Semiconductor Components Industries, LLC, 2012
May, 2012
Rev. 10
1
Publication Order Number:
CAT25640/D

CAT25640LI相似产品对比

CAT25640LI CAT25640YI CAT25640VIT3 CAT25640VP2I CAT25640VP2I-G CAT25640LE CAT25640VP2IT3 CAT25640YIT3
描述 8KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 646AA-01, MS-001, DIP-8 8KX8 SPI BUS SERIAL EEPROM, PDSO8, GREEN, MO-153, TSSOP-8 8KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, CASE 751BD-01, MS-012, SOIC-8 8KX8 SPI BUS SERIAL EEPROM, DSO8, 2 X 3 MM, GREEN, MO-229, TDFN-8 8KX8 SPI BUS SERIAL EEPROM, DSO8, 2 X 3 MM, GREEN, MO-229, TDFN-8 8KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 646AA-01, MS-001, DIP-8 8KX8 SPI BUS SERIAL EEPROM, PBCC8, 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, CASE 511AK-01, MO-229, TDFN-8 8KX8 SPI BUS SERIAL EEPROM, PDSO8, 4.40 X 3.00 MM, HALOGEN FREE AND ROHS COMPLIANT, CASE 948AL-01, MO-153, TSSOP-8
零件包装代码 DIP TSSOP SOIC SON SON DIP SON TSSOP
包装说明 DIP, DIP8,.3 TSSOP, TSSOP8,.25 SOP, HVSON, SOLCC8,.11,20 HVSON, SOLCC8,.11,20 DIP, HVQCCN, TSSOP,
针数 8 8 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant unknown compliant compliant
最大时钟频率 (fCLK) 5 MHz 10 MHz 5 MHz 10 MHz 10 MHz 5 MHz 5 MHz 5 MHz
JESD-30 代码 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-XDSO-N8 R-XDSO-N8 R-PDIP-T8 R-PBCC-N8 R-PDSO-G8
JESD-609代码 e3 e3 e3 e3 e4 e3 e3 e3
长度 9.27 mm 4.4 mm 4.9 mm 3 mm 3 mm 9.27 mm 3 mm 4.4 mm
内存密度 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit 65536 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8 8
字数 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words 8192 words
字数代码 8000 8000 8000 8000 8000 8000 8000 8000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 125 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8 8KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP TSSOP SOP HVSON HVSON DIP HVQCCN TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.33 mm 1.2 mm 1.75 mm 0.8 mm 0.8 mm 5.33 mm 0.8 mm 1.2 mm
串行总线类型 SPI SPI SPI SPI SPI SPI SPI SPI
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 2.5 V 1.8 V 1.8 V
标称供电电压 (Vsup) 5 V 2.5 V 5 V 2.5 V 2.5 V 5 V 5 V 5 V
表面贴装 NO YES YES YES YES NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE INDUSTRIAL INDUSTRIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN NICKEL PALLADIUM GOLD MATTE TIN MATTE TIN MATTE TIN
端子形式 THROUGH-HOLE GULL WING GULL WING NO LEAD NO LEAD THROUGH-HOLE NO LEAD GULL WING
端子节距 2.54 mm 0.65 mm 1.27 mm 0.5 mm 0.5 mm 2.54 mm 0.5 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL BOTTOM DUAL
宽度 7.62 mm 3 mm 3.9 mm 2 mm 2 mm 7.62 mm 2 mm 3 mm
最长写入周期时间 (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 - 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 - 符合 符合
制造商包装代码 CASE 646AA-01 - CASE 751BD-01 - - CASE 646AA-01 CASE 511AK-01 CASE 948AL-01
ECCN代码 EAR99 EAR99 - EAR99 EAR99 EAR99 - -
其他特性 100 YEAR DATA RETENTION - 100 YEAR DATA RETENTION - - 100 YEAR DATA RETENTION 100 YEAR DATA RETENTION 100 YEAR DATA RETENTION
数据保留时间-最小值 100 100 - 100 100 100 - -
峰值回流温度(摄氏度) 260 260 260 260 260 - 260 260
处于峰值回流温度下的最长时间 40 40 40 40 40 - 40 40
厂商名称 - ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美) ON Semiconductor(安森美)
湿度敏感等级 - 1 - 1 1 - 1 1

 
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