IC IC,MICROCONTROLLER,4-BIT,T4X CPU,QFP,100PIN,PLASTIC, Microcontroller
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QFP |
| 包装说明 | QFP, QFP100,.7X.9 |
| 针数 | 100 |
| Reach Compliance Code | unknown |
| 位大小 | 4 |
| CPU系列 | T4X |
| JESD-30 代码 | R-PQFP-G100 |
| JESD-609代码 | e0 |
| 端子数量 | 100 |
| 最高工作温度 | 40 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP100,.7X.9 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 3 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 256 |
| ROM(单词) | 16384 |
| ROM可编程性 | MROM |
| 最大压摆率 | 1.5 mA |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | QUAD |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| TMP04CH01FA33F3 | TMP04CH01FA11F3 | TMP04CH01FA32F1 | TMP04CH01FA32F3 | TMP04CH01FA33F0 | |
|---|---|---|---|---|---|
| 描述 | IC IC,MICROCONTROLLER,4-BIT,T4X CPU,QFP,100PIN,PLASTIC, Microcontroller | IC IC,MICROCONTROLLER,4-BIT,T4X CPU,QFP,100PIN,PLASTIC, Microcontroller | IC IC,MICROCONTROLLER,4-BIT,T4X CPU,QFP,100PIN,PLASTIC, Microcontroller | IC IC,MICROCONTROLLER,4-BIT,T4X CPU,QFP,100PIN,PLASTIC, Microcontroller | IC IC,MICROCONTROLLER,4-BIT,T4X CPU,QFP,100PIN,PLASTIC, Microcontroller |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | QFP, QFP100,.7X.9 | QFP, QFP100,.7X.9 | QFP, QFP100,.7X.9 | QFP, QFP100,.7X.9 | QFP, QFP100,.7X.9 |
| 针数 | 100 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 4 | 4 | 4 | 4 | 4 |
| CPU系列 | T4X | T4X | T4X | T4X | T4X |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 100 | 100 | 100 | 100 | 100 |
| 最高工作温度 | 40 °C | 40 °C | 40 °C | 40 °C | 40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QFP | QFP | QFP | QFP |
| 封装等效代码 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.7X.9 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 电源 | 3 V | 1.5 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 256 | 256 | 256 | 256 | 256 |
| ROM(单词) | 16384 | 16384 | 16384 | 16384 | 16384 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 最大压摆率 | 1.5 mA | 0.077 mA | 1.5 mA | 1.5 mA | 1.5 mA |
| 标称供电电压 | 3 V | 1.5 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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