TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC16
参数名称 | 属性值 |
功能数量 | 1 |
端子数量 | 16 |
最小工作温度 | -40 Cel |
最大工作温度 | 85 Cel |
加工封装描述 | 3 X 3 MM, ROHS COMPLIANT, QFN-16 |
each_compli | Yes |
欧盟RoHS规范 | Yes |
状态 | Active |
通信类型 | RF AND BASEBAND CIRCUIT |
jesd_30_code | S-XQCC-N16 |
moisture_sensitivity_level | 1 |
包装材料 | UNSPECIFIED |
ckage_code | HVQCCN |
包装形状 | SQUARE |
包装尺寸 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
eak_reflow_temperature__cel_ | NOT SPECIFIED |
qualification_status | COMMERCIAL |
seated_height_max | 0.9000 mm |
额定供电电压 | 2.75 V |
表面贴装 | YES |
工艺 | BICMOS |
温度等级 | INDUSTRIAL |
端子涂层 | NOT SPECIFIED |
端子形式 | NO LEAD |
端子间距 | 0.5000 mm |
端子位置 | QUAD |
ime_peak_reflow_temperature_max__s_ | NOT SPECIFIED |
length | 3 mm |
width | 3 mm |
RF2861_1 | RF2861 | |
---|---|---|
描述 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC16 | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC16 |
功能数量 | 1 | 1 |
端子数量 | 16 | 16 |
最小工作温度 | -40 Cel | -40 Cel |
最大工作温度 | 85 Cel | 85 Cel |
加工封装描述 | 3 X 3 MM, ROHS COMPLIANT, QFN-16 | 3 X 3 MM, ROHS COMPLIANT, QFN-16 |
each_compli | Yes | Yes |
欧盟RoHS规范 | Yes | Yes |
状态 | Active | Active |
通信类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
jesd_30_code | S-XQCC-N16 | S-XQCC-N16 |
moisture_sensitivity_level | 1 | 1 |
包装材料 | UNSPECIFIED | UNSPECIFIED |
ckage_code | HVQCCN | HVQCCN |
包装形状 | SQUARE | SQUARE |
包装尺寸 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
eak_reflow_temperature__cel_ | NOT SPECIFIED | NOT SPECIFIED |
qualification_status | COMMERCIAL | COMMERCIAL |
seated_height_max | 0.9000 mm | 0.9000 mm |
额定供电电压 | 2.75 V | 2.75 V |
表面贴装 | YES | YES |
工艺 | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL |
端子涂层 | NOT SPECIFIED | NOT SPECIFIED |
端子形式 | NO LEAD | NO LEAD |
端子间距 | 0.5000 mm | 0.5000 mm |
端子位置 | QUAD | QUAD |
ime_peak_reflow_temperature_max__s_ | NOT SPECIFIED | NOT SPECIFIED |
length | 3 mm | 3 mm |
width | 3 mm | 3 mm |
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