DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE
(unless otherwise specified)
Limits
Symbol
V
IH
V
IL
V
IK
V
OH
V
OL
Parameter
Input HIGH Voltage
Input LOW Voltage
Input Clamp Diode Voltage
Output HIGH Voltage
2.7
−0.65
3.5
0.25
0.35
0.4
0.5
20
0.1
−0.4
−20
−100
27
Min
2.0
0.8
−1.5
Typ
Max
Unit
V
V
V
V
V
V
μA
mA
mA
mA
mA
Test Conditions
Guaranteed Input HIGH Voltage for
All Inputs
Guaranteed Input LOW Voltage for
All Inputs
V
CC
= MIN, I
IN
=
−
18 mA
V
CC
= MIN, I
OH
= MAX, V
IN
= V
IH
or V
IL
per Truth Table
I
OL
= 4.0 mA
I
OL
= 8.0 mA
V
CC
= V
CC
MIN,
V
IN
= V
IL
or V
IH
per Truth Table
Output LOW Voltage
I
IH
I
IL
I
OS
I
CC
Input HIGH Current
Input LOW Current
Short Circuit Current (Note 2)
Power Supply Current
V
CC
= MAX, V
IN
= 2.7 V
V
CC
= MAX, V
IN
= 7.0 V
V
CC
= MAX, V
IN
= 0.4 V
V
CC
= MAX
V
CC
= MAX
2. Not more than one output should be shorted at a time, nor for more than 1 second.
AC CHARACTERISTICS
(T
A
= 25°C, V
CC
= 5.0 V)
Limits
Symbol
t
PLH
t
PHL
t
PLH
t
PHL
Parameter
Propagation Delay, Data to Output
ΣEVEN
Propagation Delay, Data to Output
ΣODD
Min
Typ
33
29
23
31
Max
50
45
35
50
Unit
ns
C
L
= 15 pF
ns
Test Conditions
http://onsemi.com
2
SN74LS280
PACKAGE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 646−06
ISSUE M
14
8
B
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10
_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
18.80
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10
_
0.38
1.01
A
F
N
−T−
SEATING
PLANE
L
C
H
G
D
14 PL
K
M
J
M
DIM
A
B
C
D
F
G
H
J
K
L
M
N
0.13 (0.005)
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A−03
ISSUE F
−A−
14
8
−B−
1
7
P
7 PL
0.25 (0.010)
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0
_
7
_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0
_
7
_
0.228
0.244
0.010
0.019
G
C
R
X 45
_
F
−T−
SEATING
PLANE
D
14 PL
0.25 (0.010)
K
M
M
S
J
T B
A
S
http://onsemi.com
3
SN74LS280
PACKAGE DIMENSIONS
M SUFFIX
SOEIAJ PACKAGE
CASE 965−01
ISSUE O
14
8
L
E
Q
1
E H
E
M
_
L
DETAIL P
1
7
Z
D
e
A
VIEW P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A
1
b
c
D
E
e
H
E
0.50
L
E
M
Q
1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10
_
0
_
0.70
0.90
−−−
1.42
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10
_
0
_
0.028
0.035
−−−
0.056
c
b
0.13 (0.005)
M
A
1
0.10 (0.004)
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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