Micro-ACE
®
, Micro-ACE-TE, and
PCI Micro-ACE-TE
Product Brief
Models: BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3
DDC's Micro-ACE series of MIL-STD-1553 terminals with 1553 protocol, memory, and either +3.3V or +5V transceiver, in
a small plastic BGA. This series is ideal for use in mixed voltage applications where PC board space is limited.
Key Features
• 1 Dual Redundant MIL-STD-1553 Channel
- BC, RT, MT or RT/MT Functionality
- Supports MIL-STD-1553 A/B
- Supports MIL-STD-1760
- Supports STANAG 3838
- Supports MacAir
• Tx Inhibit Pin for MT Only Applications
• RT Only Version Available
• Small Plastic Package
- 128-ball or 324-ball BGA Package
- 0.815" x 0.815" (20.7 mm x 20.7 mm) Package
- 0.120" (3.05 mm) Max Height
• Extended Temperature Range
- -40ºC to +100ºC for Micro-ACE-TE versions
- -40°C to +85°C for Micro-ACE version
• DO-254 Certifiable
• 4K or 64K x 16 RAM
• +3.3V, +5V, or Mixed Voltage Operation
• Generic Processor or PCI Interface
Benefits
• Field Proven and Reliable Technology with over 62 Million
Hours of In-Service History
• Small Footprint
- Saves Board Space
- Decreases Weight
• Software Compatible with ACE
®
, Mini-ACE
®
, Enhanced
Mini-ACE
®
, Mini-ACE
®
Mark3, and Total-ACE
®
• Multiple Thermal Balls Improve Heatsinking
Applications
• Digital Flight Data Recorders
• Telemetry/Instrumentation Recorders
• Mission Computers
• Small Avionics Displays
• Line Replaceable Units (LRU’s)
• Radar Systems/Situational Awareness
• Munitions
• Ground Vehicles
• Commercial Aerospace
For more information:
www.ddc-web.com/BU-6474XB | www.ddc-web.com/BU-6174XB
© 2002, 2010 Data Device Corporation. All trademarks are the property of their respective owners.
Printed on recycled paper.
Product Overview
Micro-ACE, Micro-ACE-TE, and PCI Micro-ACE-TE
Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE are
MIL-STD-1553 terminals with an extended temperature range.
With a BGA package body of 0.66 in² (428.5 mm²), the Micro-
ACE TE and PCI Micro-ACE TE are ideal for extended tem-
perature range applications where PC board space is at a
premium. The Micro-ACE TE and PCI Micro-ACE TE can be
powered entirely by 3.3 volts, or they can be ordered with 5V
transceivers for mixed 3.3V/5V operation.
The Micro-ACE version is available in a 128-ball BGA
package, rated for -40°C to +85°C operation. The Micro-ACE
TE version is rated for -40°C to +100°C operation.
The Micro-ACE
®
, Micro-ACE TE, and PCI Micro-ACE TE are
fully software compatible with DDC's ACE
®
, Mini-ACE
®,
Enhanced Mini-ACE
®
, Mini-ACE
®
Mark3, and Total-ACE
®
series of devices. They integrate dual transceivers, protocol
engine and up to 64K words of internal RAM. The PCI Micro-
ACE TE makes it simple to connect to 32 Bit / 33 MHz PCI
buses while the Micro-ACE TE's flexible generic processor
interface allows direct connection with little or no glue logic
to a variety of 8, 16 and 32-bit processors.
Advanced architecture is the key to the Micro-ACE series’
high performance. Advanced bus controller architecture
gives the Micro-ACE, Micro-ACE TE, and PCI Micro-ACE TE a
high degree of flexibility and autonomy. This creates
advantages in a number of areas: improving message
scheduling control, minimizing host overhead for
asynchronous message insertion, facilitating bulk data
transfers and double buffering, message retry and bus
switching strategies, and data logging and fault reporting. In
addition, its remote terminal architecture provides flexibility in
meeting all common MIL-STD-1553 protocols. RT data
buffering and interrupt options offer robust support for
synchronous and asynchronous messaging, ensure data
sample consistency, and support bulk data transfers.
Product Specifications
1553 Bus Monitor (MT)
•
•
•
•
Filter based on RT Address, T/R bit, Subaddress
50% and 100% Rollover Interrupts
Command/Data Stack
32-Entry Interrupt Status Queue
1553 Bus Controller (BC)
• Message Control Engine Offloads Host Processor
• Minor/Major Frame Scheduling to Control Timing of 1553
Messages
• High and Low Priority Asynchronous Message Insertion
• Control/Status Block for Each Message
• Programmable Interrupt Conditions
1553 Remote Terminal (RT)
•
•
•
•
•
•
•
•
•
•
•
Multiprotocol: MIL-STD-1553 A/B, STANAG 3838
Multiple Buffering Techniques
Programmable Command Illegalization
Programmable Busy by Subaddress
Hardware/Software Programmable RT Address
RT AUTO Boot
Protocol Self-Test*
RAM Self-Test
Online Loopback Test
Capability for CH. A-to-CH. B Wraparound Test
Capability to Test Transmitter Timeout Function
Autonomous Built-In Self-Test
Processor or PCI Interface Flexibility
• Direct Interface to 8,16, or 32-bit Microprocessor or
Microcontrollers
• Support DMA Interface to External RAM*
• PCI Micro-ACE-TE includes 33 MHz, 32-bit PCI target
interface.
• Supports 3.3 Volt Logic Interface
* Not available for PCI Micro-ACE TE
Micro-ACE
BOTTOM VIEW
.815 [20.70]
(MAX)
SQUARE
.670 [17.02]
(TYP)
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
V U T R P N M L K J H G F E D C B A
Micro-ACE-TE
BOTTOM VIEW
.815 [20.70]
(MAX)
SQUARE
.670 [17.02]
(TYP)
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
V U T R P N M L K J H G F E D C B A
17 EQ.SP.
.0394 [1.00] = .670 [17.02]
(TOL NONCUM)
(TYP)
17 EQ. SP. @
.0394 [1.00] = .670 [17.02]
(TOL NONCUM)
(TYP)
.065 [1.65]
(TYP)
.0394 [1.00]
(TYP)
.065 [1.65]
(TYP)
.065 [1.65]
(TYP)
.065 [1.65]
(TYP)
.0394 [1.00]
(TYP)
Triangle denotes
Ball A1
SIDE VIEW
0.140 [3.58]
(MAX)
.025 [0.64] DIA
Sn/Pb BALL
(127 PLACES)
SIDE VIEW
0.120 [3.05]
(MAX)
.022 [0.56] DIA
Sn/Pb BALL
(324 PLACES)
0.032 [0.81]
(REF)
0.015 [0.38]
(REF)
Notes:
1) Dimensions are in inches (mm).
Notes:
1) Dimensions are in inches (mm).
Data Device Corporation
www.ddc-web.com
2
PB-BU-6474XB-11
07/11
Technical Data
PARAMETER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage
Logic +5 V or +3.3 V
RAM +5V
Transceiver +5V
Logic
POWER SUPPLY REQUIREMENTS
Voltages/Tolerance
Logic +3.3V
Logic +5V
RAM +5V
Transceiver +3.3V
Transceiver +5V
POWER DISSIPATION (Notes 1 and 2)
Micro-ACE TE with 64K RAM
Idle with Transceiver SLEEPIN Enable
25% Transmitter Duty Cycle
50% Transmitter Duty Cycle
THERMAL (Mirco-ACE-TE)
Thermal Resistance, Junction-to-Ball, Hottest Die (
q
JB
)
Operating Temperature
Storage Temperature
PHYSICAL CHARACTERISTICS
BGA Package Body Size (L x W x H)
in
mm
0.815 x 0.815 x 0.120
20.7 x 20.7 x 3.05
°C/W
°C
–
-40
-65
–
–
–
15
+100
+150
W
–
–
–
0.3
0.7
1.0
–
–
–
V
3.0
4.5
4.5
3.14
4.75
3.3
5.0
5.0
3.3
5.0
3.6
5.5
5.5
3.46
5.25
+3.3V / +5V Logic Input Range
V
-0.3
-0.3
-0.3
-0.3
–
–
–
–
6.0
6.0
7.0
6.0
MIN
TYP
MAX
Notes:
1. Use BETA Transformer Technology Corp., “LVB” Series of isolation transformers (Refer to BETA's WEB page www.bttc-beta.com)
2. For full specifications and additional information refer to the BU-6474X/6484X/6486X Mini-ACE Mark3/Micro-ACE-TE Data Sheet (DS-BU-6474X) and the
BU-6174X/61846X/6186X Enhanced Mini-ACE/Micro-ACE Data Sheet (DS-BU-6174X) available on the DDC web site, www.ddc-web.com.
Micro-ACE / Micro-ACE-TE
CH. A
TX/RX_A
SHARED
RAM
(1)
TRANSCEIVER
A
DATA BUS
DUAL
ENCODER /
DECODER,
MULTIPROTOCOL
AND
MEMORY
MANAGEMENT
DATA
BUFFERS
D15-D0
PROCESSOR
DATA BUS
TX/RX_A
TX/RX_B
ADDRESS BUS
ADDRESS
BUFFERS
A15-A0
PROCESSOR
ADDRESS BUS
CH. B
TRANSCEIVER
B
TX/RX_B
PROCESSOR
AND
MEMORY
INTERFACE
LOGIC
TRANSPARENT/BUFFERED, STRBD, SELECT,
RD/WR, MEM/REG, TRIGGER_SEL/MEMENA-IN,
MSB/LSB/DTGRT
IOEN, READYD
ADDR_LAT/MEMOE, ZERO_WAIT/MEMWR,
8/16-BIT/DTREQ, POLARITY_SEL/DTACK
INT
PROCESSOR
AND
MEMORY
CONTROL
RT ADDRESS
RTAD4-RTAD0, RTADP
INCMD/MCRST, INCMD(2), MCRST(2)
NOTES:
MISCELLANEOUS
1. See Ordering Information for Available Memory Options.
2. Indicates signals brought out only on Mirco-ACE version.
CLK_IN, TAG_CLK(2),
MSTCLR, SSFLAG/EXT_TRG, TX-INH_A, TX-INH_B,
UPADDREN, RSBITEN(2)
INTERRUPT
REQUEST
PCI Micro-ACE-TE
CH. A
TX/RX_A
4K X 16
OR
64K X 17
SHARED
RAM
TRANSCEIVER
A
32 X 32
WRITE
FIFO
AD31-AD0
TX/RX_A
TX_INH A/B
•
TX/RX_B
DUAL
ENCODER /
DECODER,
MULTIPROTOCOL
AND
MEMORY
MANAGEMENT
DATA BUS
33 MHZ,
32-BIT
PCI SLAVE
INTERFACE
PAR
C/BE#3 - C/BE#0
PCI Address/Data,
Parity and Bus
Command/Byte Enable
ADDRESS BUS
•
CH. B
TRANSCEIVER
B
FRAME#, IRDY#,IDSEL
TRDY#, STOP#, DEVSEL#,
PERR#, SERR#
PCI Control
TX/RX_B
(PCI) CLK
RT ADDRESS AND
ADDRESS LATCH
RTAD4-RTAD0, RTADP
RT-AD4-LAT
INCMD/MCRST
MISCELLANEOUS
1553_CLK, SSFLAG/EXT_TRIG,TAG_CLK
BOOT_L,CLK_SEL_0/1 (
MSTCLR (RST#)
INT A #
PCI Interrupt
PCI CLK
Data Device Corporation
www.ddc-web.com
3
PB-BU-6474XB-11
07/11
Ordering Information
Micro-ACE-TE/PCI Micro-ACE TE:
BU-6XXX3 X8-E 0 2
Test Criteria:
2 = MIL-STD-1760 Amplitude
Process Requirements:
0 = Standard DDC Processing, no Burn-In
Temperature Grade:
E = -40°C to +100°C
Voltage/Transceiver Option:
3 = +5V, rise/fall times = 100 to 300ns
(-1553B)
8 = +3.3V, rise/fall times =100 to 300ns
(1553B) (Not recommended for new
designs)
C = +3.3V, recommended for new designs
Package Type:
B = 324 Ball BGA
R = Lead Free 324 Ball BGA
Logic/RAM Voltage:
0 = 3.3V or 5V Logic/5V RAM (5V RAM in
BU-64860B(R)3 ONLY) (note 1)
3 = 3.3 V Logic/RAM
4 = 3.3V Logic/5V RAM (note 2)
Product Type:
BU-6474 = RT Only with 4K X 16 RAM
BU-6484 = BC/RT/MT with 4K X 16 RAM
BU-6486 = BC/RT/MT with 64K X 17 RAM
BU-6584 = PCI BC/RT/MT with 4K X 16 RAM
BU-6586 = PCI BC/RT/MT with 64K X 17 RAM
Micro-ACE:
BU-61XX0 X3-20 2
Test Criteria:
2 = MIL-STD-1760 Amplitude Compliant
Process Requirements:
0 = Standard DDC Processing, no Burn-In
Temperature Grade
2 = -40°C to +85°C
Voltage/Transceiver Option:
3 = +5 volt, rise/fall times = 100 to 300 ns
(-1553B)
Package Type:
B = 128 Ball BGA
R = Lead Free 128 Ball BGA
Logic/RAM Voltage:
0 = 3.3 V or 5.0V Logic
Product Type:
BU-6174 = RT-only with 4K X 16 RAM
BU-6184 = BC/RT/MT with 4K X 16 RAM
BU-6186 = BC/RT-MT with 64K X 17 RAM
Included Software:
1553 C Software Development Kit (SDK)
Windows 2000/XP/Vista/7, Linux, and VxWorks support
Notes:
1. Micro-ACE TE version only.
2. PCI Micro-ACE TE version only.
3. See Application Note AN/B-37 for SSRT Implementation, available on the DDC web site.
Mechanical Daisy Chain:
BU-64863B8-600
Micro-ACE TE 324 Ball BGA Daisy Chain
Mechanical Sample, ball pairs internally
wired, fully populated with silicon die.
BU-61860B3-601
Micro-ACE (128-ball BGA) mechanical
sample, with “daisy chain” connections of
alternating balls for use in environmental
(mechanical/thermal) integrity of testing.
Standard DDC Processing for BGA Products
TEST TYPE
INSPECTION
TEMPERATURE CYCLE
MIL-STD-1553
METHOD(S)
2010, 2017, and 2032
1010
CONDITIONS
—
B
Unless otherwise specified these products contain tin lead solder
Optional Software:
Data Bus Analyzer and Monitor Software
Generate or monitor live MIL-STD-1553 data without writing any code
Saves time and reduces development costs
Program in minutes with one-click ANSI 'C' source code generation
Rapid creation and setup of custom applications
Model: BU-69066S0-XX0
For ordering assistance and technical support,
Call:
1-800-DDC-5757
E-mail:
service@ddc-web.com
Visit:
www.ddc-web.com
IST
E
RED
F
IR
M
U
®
The information in this Product Brief is believed to be accurate; however, no responsibility
is assumed by Data Device Corporation for its use, and no license or rights are granted
by implication or otherwise in connection therewith. Specifications are subject to change
without notice.
DATA DEVICE CORPORATION
REGISTERED TO ISO 9001:2008
REGISTERED TO AS9100:2004-01
FILE NO. A5976
Data Device Corporation
www.ddc-web.com
RE
G
Headquarters, N.Y., U.S.A.
- Tel: (631) 567-5600, Fax: (631) 567-7358
United Kingdom
- Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
France
- Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425
Germany
- Tel: +49-(0)89-1500-12-11, Fax:+49(0)89-1500 12-22
Japan
- Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689
Asia
- Tel: +65-6489-4801
4
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