Optically Coupled 20 mA
Current Loop Receiver
Technical Data
HCPL-4200
Description
The HCPL-4200 optocoupler is
designed to operate as a receiver
in equipment using the 20 mA
Current Loop. 20 mA current
loop systems conventionally sig-
nal a logic high state by transmit-
ting 20 mA of loop current
(MARK), and signal a logic low
state by allowing no more than a
few milliamperes of loop current
(SPACE). Optical coupling of the
signal from the 20 mA current
loop to the logic output breaks
ground loops and provides for a
very high common mode
rejection. The HCPL-4200 aids in
the design process by providing
Features
• Data Output Compatible
with LSTTL, TTL and CMOS
• 20 K Baud Data Rate at 1400
Metres Line Length
• Guaranteed Performance
over Temperature (0
°
C to
70
°
C)
• Guaranteed On and Off
Thresholds
• LED is Protected from
Excess Current
• Input Threshold Hysteresis
• Three-State Output Compat-
ible with Data Buses
• Internal Shield for High
Common Mode Rejection
• Safety Approval
UL Recognized -2500 V rms,
for 1 Minute
CSA Approved
• Optically Coupled 20 mA
Current Loop Transmitter,
HCPL-4100, Also Available
guaranteed thresholds for logic
high state and logic low state for
the current loop, providing an
LSTTL, TTL, or CMOS compatible
logic interface, and providing
guaranteed common mode
rejection. The buffer circuit on
the current loop side of the
HCPL-4200 provides typically 0.8
mA of hysteresis which increases
the immunity to common mode
and differential mode noise. The
buffer also provides a controlled
amount of LED drive current
which takes into account any
LED light output degradation.
The internal shield allows a
guaranteed 1000 V/µs common
mode transient immunity.
Functional Diagram
Applications
• Isolated 20 mA Current
• Loop Receiver in:
Computer Peripherals
Industrial Control Equipment
Data Communications
Equipment
A 0.1
µF
bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
Ordering Information
Specify part number followed by Option Number (if desired).
HCPL-4200# XXX
300 = Gull Wing Surface Mount Lead Option
500 = Tape/Reel Package Option (1 K min)
Option data sheets available. Contact your Agilent sales representative or authorized distributor for
information.
Package Outline Drawings –
8 Pin DIP Package (HCPL-4200)
9.65 ± 0.25
(0.380 ± 0.010)
8
7
A XXXX
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
DATE CODE
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
8 Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4200)
PAD LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
1.194 (0.047)
4.826 TYP.
(0.190)
6.350 ± 0.25
(0.250 ± 0.010)
9.398 (0.370)
9.906 (0.390)
1
2
3
4
1.194 (0.047)
1.778 (0.070)
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.381 (0.015)
0.635 (0.025)
1.19
(0.047)
MAX.
4.19 MAX.
(0.165)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
3
Thermal Profile (Option #300)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
∆T
= 100°C, 1.5°C/SEC
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
TIME – MINUTES
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
Regulatory Information
The HCPL-4200 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Symbol
L(IO1)
L(IO2)
Value Units
7.1
mm
7.4
0.08
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air
Measured from input terminals to output
terminals, shortest distance path along body
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
200
IIIa
volts
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
4
Absolute Maximum Ratings
(No Derating Required up to 70°C)
Storage Temperature .................................................. -55°C to +125°C
Operating Temperature ................................................. -40°C to +85°C
Lead Solder Temperature .... 260°C for 10 s (1.6 mm below seating plane)
Supply Voltage – V
CC
.............................................................. 0 V to 20 V
Average Input Current - I
I
........................................... -30 mA to 30 mA
Peak Transient Input Current - I
I
............................................... 0.5 A
[1]
Enable Input Voltage – V
E
................................................ -0.5 V to 20 V
Output Voltage – V
O
........................................................ -0.5 V to 20 V
Average Output Current – I
O
....................................................... 25 mA
Input Power Dissipation – P
I
................................................... 90 mW
[2]
Output Power Dissipation – P
O
............................................. 210 mW
[3]
Total Power Dissipation – P .................................................. 255 mW
[4]
Infrared and Vapor Phase Reflow Temperature
(Option #300) .......................................... see Fig. 1, Thermal Profile
Recommended Operating Conditions
Parameter
Power Supply Voltage
Forward Input Current
(SPACE)
Forward Input Current
(MARK)
Operating Temperature
Fan Out
Logic Low Enable
Voltage
Logic High Enable
Voltage
Symbol
V
CC
I
SI
I
MI
T
A
N
V
EL
V
EH
Min.
4.5
0
14
0
0
0
2.0
Max.
20
2.0
24
70
4
0.8
20
Units
Volts
mA
mA
°C
TTL Loads
Volts
Volts
5
DC Electrical Specifications
For 0°C
≤
T
A
≤
70°C, 4.5 V
≤
V
CC
≤
20 V, V
E
= 0.8 V, all typicals at T
A
= 25°C and V
CC
= 5 V unless otherwise
noted. See note 13.
Parameter
Symbol
Mark State Input
I
MI
Current
Mark State Input
V
MI
Voltage
Space State Input
I
SI
Current
Space State Input
V
SI
Voltage
Input Hysteresis
I
HYS
Current
Logic Low Output
V
OL
Voltage
Logic High Output
V
OH
Voltage
Output Leakage
I
OHH
Current (V
OUT
> V
CC
)
Logic High Enable
Voltage
Logic Low Enable
Voltage
Logic High Enable
Current
Logic Low Enable
Current
Logic Low Supply
Current
Logic High Supply
Current
High Impedance
State Output
Current
Logic Low Short
Circuit Output
Current
Logic High Short
Circuit Output
Current
Input Capacitance
V
EH
V
EL
I
EH
Min. Typ. Max. Units
12
mA
2.52
2.75 Volts
3
1.6
0.3
0.8
0.5
2.4
100
500
2.0
0.8
20
100
0.004 250
-0.32
4.5
5.25
2.7
3.1
6.0
7.5
4.5
6.0
-20
20
100
500
2.2
mA
Volts
mA
Volts
Volts
µA
µA
Volts
Volts
µA
µA
µA
mA
mA
mA
mA
mA
µA
µA
µA
µA
mA
mA
mA
mA
120
pF
V
E
= 2.7 V
V
E
= 5.5 V
V
E
= 20 V
V
E
= 0.4 V
V
CC
= 5.5 V I
I
= 0 mA
V
CC
= 20 V V
E
= Don’t Care
V
CC
= 5.5 V I
I
= 20 mA
V
CC
= 20 V V
E
= Don’t Care
V
O
= 0.4 V
V
E
= 2 V,
I
I
= 20 mA
V
O
= 2.4 V
V
O
= 5.5 V
V
O
= 20 V
V
O
= V
CC
= 5.5 V I
I
= 0 mA
V
O
= V
CC
= 20 V
V
CC
= 5.5 V
V
CC
= 20 V
I
I
= 20 mA
V
O
= GND
5
5
I
OL
= 6.4 mA
(4 TTL Loads)
I
OH
= -2.6 mA,
V
O
= 5.5 V
V
O
= 20 V
I
I
= 0.5 to 2.0 mA
Test Conditions
Fig. Note
2, 3,
4
4, 5
I
I
= 20 mA
V
E
= Don’t Care
2, 3,
4
V
E
= Don’t 2, 4
Care
2
6
7
I
I
= 3 mA
I
I
= 12 mA
I
I
= 20 mA
V
CC
= 4.5 V
I
EL
I
CCL
I
CCH
I
OZL
I
OZH
I
OSL
25
40
I
OSH
-10
-25
C
IN
f = 1 MHz, V
I
= 0 V dc,
Pins 1 and 2
stm32/stm8
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