256KX16 OTPROM, 120ns, PQCC44, 1.25 MM PITCH, PLASTIC, LCC-44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | LCC |
包装说明 | QCCJ, LDCC44,.7SQ |
针数 | 44 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 120 ns |
I/O 类型 | COMMON |
JESD-30 代码 | S-PQCC-J44 |
长度 | 16.5862 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | OTP ROM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256KX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC44,.7SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大待机电流 | 0.0001 A |
最大压摆率 | 0.05 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 16.5862 mm |
Base Number Matches | 1 |
TMS27PC240-12FNE | TMS27PC240-120FNL | TMS27PC240-150FNL | TMS27PC240-10FNL | TMS27PC240-10FNE | TMS27PC240-15FNE | TMS27PC240-100FNL | TMS27PC240-80FNL | TMS27PC240-8FNL | |
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描述 | 256KX16 OTPROM, 120ns, PQCC44, 1.25 MM PITCH, PLASTIC, LCC-44 | 256KX16 OTPROM, 120ns, PQCC44 | 256KX16 OTPROM, 150ns, PQCC44 | 256KX16 OTPROM, 100ns, PQCC44, 1.25 MM PITCH, PLASTIC, LCC-44 | 256KX16 OTPROM, 100ns, PQCC44, 1.25 MM PITCH, PLASTIC, LCC-44 | 256KX16 OTPROM, 150ns, PQCC44, 1.25 MM PITCH, PLASTIC, LCC-44 | 256KX16 OTPROM, 100ns, PQCC44 | 256KX16 OTPROM, 80ns, PQCC44 | 256KX16 OTPROM, 80ns, PQCC44 |
包装说明 | QCCJ, LDCC44,.7SQ | QCCJ, | QCCJ, | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QCCJ, | QCCJ, |
Reach Compliance Code | not_compliant | unknown | unknown | not_compliant | not_compliant | not_compliant | not_compliant | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 120 ns | 120 ns | 150 ns | 100 ns | 100 ns | 150 ns | 100 ns | 80 ns | 80 ns |
JESD-30 代码 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 |
长度 | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V |
最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm |
是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
I/O 类型 | COMMON | - | - | COMMON | COMMON | COMMON | COMMON | - | - |
封装等效代码 | LDCC44,.7SQ | - | - | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | - | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
电源 | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | - | - |
最大待机电流 | 0.0001 A | - | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | - | - |
最大压摆率 | 0.05 mA | - | - | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | - | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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