Flash Module, 512KX8, 120ns,
参数名称 | 属性值 |
Reach Compliance Code | unknown |
最长访问时间 | 120 ns |
其他特性 | HARDWARE & SOFTWARE DATA PROTECTION; CONFIGURABLE AS 128K X 32 |
JESD-30 代码 | S-XQMA-C68 |
内存密度 | 4194304 bit |
内存集成电路类型 | FLASH MODULE |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 68 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512KX8 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装形状 | SQUARE |
封装形式 | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL |
编程电压 | 5 V |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | C BEND |
端子位置 | QUAD |
Base Number Matches | 1 |
EDI7F32128C120BAC | EDI7F232128C150BNC | 3XF0106A-VO | EDI7F32128C100BNC | EDI7F32128C100BAC | EDI7F232128C100BNC | EDI7F32128C150BAC | EDI7F32128C120BNC | |
---|---|---|---|---|---|---|---|---|
描述 | Flash Module, 512KX8, 120ns, | Flash Module, 256KX32, 150ns, | Toroid Inductor | Flash Module, 128KX32, 100ns, | Flash Module, 512KX8, 100ns, | Flash Module, 256KX32, 100ns, | Flash Module, 512KX8, 150ns, | Flash Module, 128KX32, 120ns, |
Reach Compliance Code | unknown | unknown | - | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 120 ns | 150 ns | - | 100 ns | 100 ns | 100 ns | 150 ns | 120 ns |
其他特性 | HARDWARE & SOFTWARE DATA PROTECTION; CONFIGURABLE AS 128K X 32 | HARDWARE & SOFTWARE DATA PROTECTION | - | HARDWARE & SOFTWARE DATA PROTECTION | HARDWARE & SOFTWARE DATA PROTECTION; CONFIGURABLE AS 128K X 32 | HARDWARE & SOFTWARE DATA PROTECTION | HARDWARE & SOFTWARE DATA PROTECTION; CONFIGURABLE AS 128K X 32 | HARDWARE & SOFTWARE DATA PROTECTION |
JESD-30 代码 | S-XQMA-C68 | R-XSMA-N80 | - | R-XSMA-N80 | S-XQMA-C68 | R-XSMA-N80 | S-XQMA-C68 | R-XSMA-N80 |
内存密度 | 4194304 bit | 8388608 bit | - | 4194304 bit | 4194304 bit | 8388608 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | FLASH MODULE | FLASH MODULE | - | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
内存宽度 | 8 | 32 | - | 32 | 8 | 32 | 8 | 32 |
功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 80 | - | 80 | 68 | 80 | 68 | 80 |
字数 | 524288 words | 262144 words | - | 131072 words | 524288 words | 262144 words | 524288 words | 131072 words |
字数代码 | 512000 | 256000 | - | 128000 | 512000 | 256000 | 512000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | - | - | 70 °C | 70 °C | - | 70 °C | 70 °C |
组织 | 512KX8 | 256KX32 | - | 128KX32 | 512KX8 | 256KX32 | 512KX8 | 128KX32 |
输出特性 | 3-STATE | - | - | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | SQUARE | RECTANGULAR | - | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | - | NO | YES | NO | YES | NO |
技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | - | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
端子形式 | C BEND | NO LEAD | - | NO LEAD | C BEND | NO LEAD | C BEND | NO LEAD |
端子位置 | QUAD | SINGLE | - | SINGLE | QUAD | SINGLE | QUAD | SINGLE |
厂商名称 | - | - | - | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
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