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PF38F5566MMY0C0

产品描述Memory Circuit, Flash+PSRAM, 64MX16, CMOS, PBGA107, 8 X 11 MM, 1.40 MM HEIGHT, LEAD FREE, SCSP-107
产品类别存储    存储   
文件大小2MB,共126页
制造商Intel(英特尔)
官网地址http://www.intel.com/
标准
下载文档 详细参数 全文预览

PF38F5566MMY0C0概述

Memory Circuit, Flash+PSRAM, 64MX16, CMOS, PBGA107, 8 X 11 MM, 1.40 MM HEIGHT, LEAD FREE, SCSP-107

PF38F5566MMY0C0规格参数

参数名称属性值
是否Rohs认证符合
零件包装代码BGA
包装说明LFBGA, BGA107,9X12,32
针数107
Reach Compliance Codecompliant
其他特性PSEUDO SRAM IS ORGANIZED AS 16M X 16
JESD-30 代码R-PBGA-B107
JESD-609代码e1
长度11 mm
内存密度1073741824 bit
内存集成电路类型MEMORY CIRCUIT
内存宽度16
混合内存类型FLASH+PSRAM
湿度敏感等级3
功能数量1
端子数量107
字数67108864 words
字数代码64000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-30 °C
组织64MX16
封装主体材料PLASTIC/EPOXY
封装代码LFBGA
封装等效代码BGA107,9X12,32
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度)260
电源1.8 V
认证状态Not Qualified
座面最大高度1.4 mm
最大待机电流0.00012 A
最大供电电压 (Vsup)2 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级OTHER
端子面层TIN SILVER COPPER
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间40
宽度8 mm
Base Number Matches1

文档预览

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Intel StrataFlash
®
Cellular Memory (M18)
Datasheet
Product Features
High Performance Read, Program and Erase
— 96 ns initial access for reads
— 512-Mbit device: 108 MHz with zero wait-state
synchronous burst reads: 7 ns clock-to-data
output
— 256-Mbit device: 133 MHz with zero wait-state
synchronous burst reads: 5.5 ns clock-to-data
output
— 8-, 16-, and continuous-word synchronous-
burst
— Programmable WAIT configuration
— Customer-configurable output driver
impedance
— Buffered Enhanced Factory Programming
(BEFP): 2.1
μs/byte
(typ)
— 1.8 V low-power buffered programming:
2.1
μs/byte
(typ)
— Block Erase: 0.9 s per block (typ)
Power
— Core voltage: 1.7 V - 2.0 V
— I/O voltage: 1.7 V - 2.0 V
— Standby current: 50
μA
(typ)
— Deep Power-Down mode: 2
μA
(typ)
— Automatic Power Savings mode
— 16-word synchronous-burst read current: 23
mA (typ)
Software
— 20
μs
(typ) program suspend
— 20
μs
(typ) erase suspend
— Intel® Flash Data Integrator optimized
— Basic Command Set (BCS) and Extended
Command Set (ECS) compatible
— Common Flash Interface (CFI)
Security
— OTP Registers:
— 64 unique pre-programmed bits
— 64 user-programmable bits
— Additional 2048 user-programmable bits
— Absolute write protection with V
PP
= GND
— Power-transition erase/program lockout
— Individual zero-latency block locking
— Individual block lock-down
Architecture
— 16-bit wide data bus
— Multi-Level Cell Technology
— Symmetrically Blocked Array Architecture
— 256-Kbyte Erase Blocks
— 512-Mb device: Eight 64-Mbit partitions
— 256-Mb device: Eight 32-Mbit partitions
— Four additional 8-Kbyte Extended Flash Array
(EFA) Blocks
— Read-While-Program and Read-While-Erase
— Status register for partition and device status
— Blank Check feature
Density and Packaging
— Density: 512 Mbit, 256 Mbit
— Address-data multiplexed and non-multiplexed
— x16D (105-ball) Flash SCSP package
— x16C (107-ball) Flash SCSP package
— 0.8 mm solder-ball pitch lead-free
Quality and Reliability
— Expanded temperature: –30° C to +85° C
— Minimum 100,000 erase cycles per block
— ETOX™ IX Process Technology (90 nm)
The Intel StrataFlash
®
Cellular Memory (M18) is the 5
th
generation Intel StrataFlash
®
memory
with multi-level cell (MLC) technology. It provides high performance, low-power synchronous-
burst read mode and asynchronous read mode at 1.8 V. It features flexible, multi-partition read-
while-program and read-while-erase capability, enabling background programming or erasing in
one partition simultaneously with code execution or data reads in another partition. This dual
operation architecture also allows two processors to interleave code operations while program
and erase operations take place in the background. The eight partitions allow flexibility for
system designers to choose the size of the code and data segments. The Intel StrataFlash
®
Cellular Memory (M18) is manufactured using Intel 90 nm ETOX™ IX process technology and
is available in industry-standard chip-scale packaging.
Order Number: 309823, Revision: 003
23-Feb-2006

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