ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68
| 参数名称 | 属性值 |
| 零件包装代码 | LCC |
| 包装说明 | HQCCN, |
| 针数 | 68 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 1 V |
| 最小模拟输入电压 | -1 V |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | S-CQCC-N68 |
| 长度 | 24.13 mm |
| 最大线性误差 (EL) | 0.7812% |
| 标称负供电电压 | -5.2 V |
| 模拟输入通道数量 | 1 |
| 位数 | 6 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | HQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG |
| 认证状态 | Not Qualified |
| 采样速率 | 600 MHz |
| 座面最大高度 | 3.115 mm |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 24.13 mm |
| Base Number Matches | 1 |
| TS83006CE8 | TS83006ME8 | TS83006CE1B/C | JTS83006-1VA | TS83006VE8 | |
|---|---|---|---|---|---|
| 描述 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, 3.30 X 2.20 MM, DIE-34 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, Bipolar, CQCC68, HEAT SINK, HERMETIC SEALED, CERAMIC, LCC-68 |
| 零件包装代码 | LCC | LCC | LCC | DIE | LCC |
| 包装说明 | HQCCN, | HQCCN, | HQCCN, | DIE, | HQCCN, |
| 针数 | 68 | 68 | 68 | 34 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 1 V | 1 V | 1 V | 1 V | 1 V |
| 最小模拟输入电压 | -1 V | -1 V | -1 V | -1 V | -1 V |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 | R-XUUC-N34 | S-CQCC-N68 |
| 最大线性误差 (EL) | 0.7812% | 0.7812% | 0.7812% | 0.3906% | 0.7812% |
| 标称负供电电压 | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 6 | 6 | 6 | 6 | 6 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 34 | 68 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 25 °C | 85 °C |
| 最低工作温度 | - | -55 °C | - | 25 °C | -40 °C |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | HQCCN | HQCCN | HQCCN | DIE | HQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | UNCASED CHIP | CHIP CARRIER, HEAT SINK/SLUG |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | OTHER | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | QUAD | QUAD | QUAD | UPPER | QUAD |
| 长度 | 24.13 mm | 24.13 mm | 24.13 mm | - | 24.13 mm |
| 座面最大高度 | 3.115 mm | 3.115 mm | 3.115 mm | - | 3.115 mm |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
| 宽度 | 24.13 mm | 24.13 mm | 24.13 mm | - | 24.13 mm |
| Base Number Matches | 1 | 1 | 1 | - | - |
| 厂商名称 | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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