128KX8 STANDARD SRAM, 12ns, PDSO32, 0.400 INCH, SOJ-32
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | SOJ |
包装说明 | SOJ, |
针数 | 32 |
Reach Compliance Code | unknown |
最长访问时间 | 12 ns |
JESD-30 代码 | R-PDSO-J32 |
JESD-609代码 | e0 |
长度 | 20.955 mm |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
湿度敏感等级 | 2 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | COMMERCIAL |
座面最大高度 | 3.7592 mm |
最大供电电压 (Vsup) | 3.63 V |
最小供电电压 (Vsup) | 2.97 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
Base Number Matches | 1 |
CY7C1019CV33-12VC | CY7C1019CV33-10ZXC | CY7C1019CV33-12BVXI | CY7C1019CV33-15ZXC | CY7C1019CV33-10VC | CY7C1019CV33-15ZXI | CY7C1019CV33-15VC | CY7C1019CV33-12ZC | CY7C1019CV33-12VI | |
---|---|---|---|---|---|---|---|---|---|
描述 | 128KX8 STANDARD SRAM, 12ns, PDSO32, 0.400 INCH, SOJ-32 | 128KX8 STANDARD SRAM, 10ns, PDSO32, LEAD FREE, TSOP2-32 | 128KX8 STANDARD SRAM, 12ns, PBGA48, 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48 | 128KX8 STANDARD SRAM, 15ns, PDSO32, LEAD FREE, TSOP2-32 | 128KX8 STANDARD SRAM, 10ns, PDSO32, 0.400 INCH, SOJ-32 | 128KX8 STANDARD SRAM, 15ns, PDSO32, LEAD FREE, TSOP2-32 | 128KX8 STANDARD SRAM, 15ns, PDSO32, 0.400 INCH, SOJ-32 | 128KX8 STANDARD SRAM, 12ns, PDSO32, TSOP2-32 | 128KX8 STANDARD SRAM, 12ns, PDSO32, 0.400 INCH, SOJ-32 |
是否无铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SOJ | TSOP2 | BGA | TSOP2 | SOJ | TSOP2 | SOJ | TSOP2 | SOJ |
包装说明 | SOJ, | LEAD FREE, TSOP2-32 | 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48 | LEAD FREE, TSOP2-32 | SOJ, | LEAD FREE, TSOP2-32 | 0.400 INCH, SOJ-32 | TSOP2-32 | 0.400 INCH, SOJ-32 |
针数 | 32 | 32 | 48 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 12 ns | 10 ns | 12 ns | 15 ns | 10 ns | 15 ns | 15 ns | 12 ns | 12 ns |
JESD-30 代码 | R-PDSO-J32 | R-PDSO-G32 | R-PBGA-B48 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-J32 |
JESD-609代码 | e0 | e3 | e1 | e3 | e0 | e3 | e0 | e0 | e0 |
长度 | 20.955 mm | 20.95 mm | 8 mm | 20.95 mm | 20.955 mm | 20.95 mm | 20.955 mm | 20.95 mm | 20.955 mm |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
湿度敏感等级 | 2 | 3 | 3 | 3 | 2 | 3 | 2 | 3 | 2 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 48 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | TSOP2 | VFBGA | TSOP2 | SOJ | TSOP2 | SOJ | TSOP2 | SOJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 235 | NOT SPECIFIED |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 3.7592 mm | 1.2 mm | 1 mm | 1.2 mm | 3.7592 mm | 1.2 mm | 3.7592 mm | 1.2 mm | 3.7592 mm |
最大供电电压 (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
最小供电电压 (Vsup) | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN | TIN SILVER COPPER | TIN | TIN LEAD | TIN | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | J BEND | GULL WING | BALL | GULL WING | J BEND | GULL WING | J BEND | GULL WING | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 0.75 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | 20 | 20 | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.16 mm | 10.16 mm | 6 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
厂商名称 | - | - | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
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