Switching Controller, Current-mode, 1A, 500kHz Switching Freq-Max, BIPolar, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 25 V |
| 最小输入电压 | 12 V |
| 标称输入电压 | 15 V |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最大输出电流 | 1 A |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.286 mm |
| 表面贴装 | YES |
| 切换器配置 | SINGLE |
| 最大切换频率 | 500 kHz |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| SG1844L/DESC-TR | SG1844L/883B-TR | SG1844F/DESC-TR | SG1845L/883B-TR | |
|---|---|---|---|---|
| 描述 | Switching Controller, Current-mode, 1A, 500kHz Switching Freq-Max, BIPolar, CQCC20, CERAMIC, LCC-20 | Switching Controller, Current-mode, 1A, 500kHz Switching Freq-Max, BIPolar, CQCC20, CERAMIC, LCC-20 | Switching Controller, Current-mode, 1A, 500kHz Switching Freq-Max, BIPolar, CDFP10, CERAMIC, DFP-10 | Switching Controller, Current-mode, 1A, 500kHz Switching Freq-Max, BIPolar, CQCC20, CERAMIC, LCC-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QLCC | QLCC | DFP | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DFP, FL10,.3 | QCCN, LCC20,.35SQ |
| 针数 | 20 | 20 | 10 | 20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
| 最大输入电压 | 25 V | 25 V | 25 V | 25 V |
| 最小输入电压 | 12 V | 12 V | 12 V | 12 V |
| 标称输入电压 | 15 V | 15 V | 15 V | 15 V |
| JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | R-CDFP-F10 | S-CQCC-N20 |
| 长度 | 8.89 mm | 8.89 mm | 7.37 mm | 8.89 mm |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 10 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 最大输出电流 | 1 A | 1 A | 1 A | 1 A |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | DFP | QCCN |
| 封装等效代码 | LCC20,.35SQ | LCC20,.35SQ | FL10,.3 | LCC20,.35SQ |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | MIL-STD-883 Class B | 38535Q/M;38534H;883B | MIL-STD-883 Class B |
| 座面最大高度 | 2.286 mm | 2.286 mm | 1.7 mm | 2.286 mm |
| 表面贴装 | YES | YES | YES | YES |
| 切换器配置 | SINGLE | SINGLE | SINGLE | SINGLE |
| 最大切换频率 | 500 kHz | 500 kHz | 500 kHz | 500 kHz |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | NO LEAD | FLAT | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | DUAL | QUAD |
| 宽度 | 8.89 mm | 8.89 mm | 6.22 mm | 8.89 mm |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 |
| JESD-609代码 | e0 | e0 | - | e0 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 端子面层 | TIN LEAD | TIN LEAD | - | TIN LEAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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