Switching Controller, Current-mode, 1A, 500kHz Switching Freq-Max, BIPolar, CQCC20, HERMETIC SEALED, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 25 V |
| 最小输入电压 | 11 V |
| 标称输入电压 | 15 V |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最大输出电流 | 1 A |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.286 mm |
| 表面贴装 | YES |
| 切换器配置 | SINGLE |
| 最大切换频率 | 500 kHz |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| SG1844L-TR | SG1844J-TR | SG1845J-TR | SG1844Y-TR | SG1845Y-TR | SG1845L-TR | |
|---|---|---|---|---|---|---|
| 描述 | Switching Controller, Current-mode, 1A, 500kHz Switching Freq-Max, BIPolar, CQCC20, HERMETIC SEALED, CERAMIC, LCC-20 | Switching Controller, Current-mode, 1A, CDIP14, DIP-14 | Switching Controller, Current-mode, 1A, CDIP14, DIP-14 | Switching Controller, Current-mode, 1A, CDIP8, DIP-8 | Switching Controller, Current-mode, 1A, CDIP8, DIP-8 | Switching Controller, Current-mode, 1A, 500kHz Switching Freq-Max, BIPolar, CQCC20, HERMETIC SEALED, CERAMIC, LCC-20 |
| 包装说明 | QCCN, LCC20,.35SQ | DIP, | DIP, | DIP, | DIP, | QCCN, LCC20,.35SQ |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
| 最大输入电压 | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V |
| 最小输入电压 | 11 V | 12 V | 12 V | 12 V | 12 V | 8.3 V |
| 标称输入电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| JESD-30 代码 | S-CQCC-N20 | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T8 | R-CDIP-T8 | S-CQCC-N20 |
| 长度 | 8.89 mm | 19.62 mm | 19.62 mm | 9.905 mm | 9.905 mm | 8.89 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 14 | 14 | 8 | 8 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 最大输出电流 | 1 A | 1 A | 1 A | 1 A | 1 A | 1 A |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | DIP | DIP | DIP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 座面最大高度 | 2.286 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.286 mm |
| 表面贴装 | YES | NO | NO | NO | NO | YES |
| 切换器配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 8.89 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm |
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