HC/UH SERIES, HEX 2-INPUT NAND GATE, PDSO20
| 参数名称 | 属性值 |
| 包装说明 | SOP, |
| Reach Compliance Code | unknown |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G20 |
| 长度 | 12.8 mm |
| 逻辑集成电路类型 | NAND GATE |
| 功能数量 | 6 |
| 输入次数 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 传播延迟(tpd) | 46 ns |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |

| SN74HC804DWR | SN54HC804FK | SN74HC804DW | SN74HC804N | SNJ54HC804FK | SN54HC804J | SNJ54HC804J | |
|---|---|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, HEX 2-INPUT NAND GATE, PDSO20 | HC/UH SERIES, HEX 2-INPUT NAND GATE, CQCC20 | NAND Gate, HC/UH Series, 6-Func, 2-Input, CMOS, PDSO20 | NAND Gate, HC/UH Series, 6-Func, 2-Input, CMOS, PDIP20 | NAND Gate, HC/UH Series, 6-Func, 2-Input, CMOS, CQCC20 | HC/UH SERIES, HEX 2-INPUT NAND GATE, CDIP20 | NAND Gate, HC/UH Series, 6-Func, 2-Input, CMOS, CDIP20 |
| 包装说明 | SOP, | QCCN, | SOP, | DIP, | QCCN, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDSO-G20 | S-CQCC-N20 | R-PDSO-G20 | R-PDIP-T20 | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 |
| 长度 | 12.8 mm | 8.89 mm | 12.8 mm | 24.325 mm | 8.89 mm | 24.195 mm | 24.195 mm |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | SOP | QCCN | SOP | DIP | QCCN | DIP | DIP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 传播延迟(tpd) | 46 ns | 56 ns | 46 ns | 46 ns | 56 ns | 56 ns | 56 ns |
| 认证状态 | COMMERCIAL | COMMERCIAL | Not Qualified | Not Qualified | Not Qualified | COMMERCIAL | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.03 mm | 2.65 mm | 5.08 mm | 2.03 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | NO LEAD | GULL WING | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 7.5 mm | 8.89 mm | 7.5 mm | 7.62 mm | 8.89 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
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