HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | not_compliant |
ECCN代码 | 3A001.A.2.C |
系列 | HC/UH |
JESD-30 代码 | S-CQCC-N20 |
长度 | 8.89 mm |
负载电容(CL) | 150 pF |
逻辑集成电路类型 | BUS DRIVER |
最大频率@ Nom-Sup | 21000000 Hz |
最大I(ol) | 0.0078 A |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 2/6 V |
传播延迟(tpd) | 345 ns |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
座面最大高度 | 2.03 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 8.89 mm |
Base Number Matches | 1 |
SNJ54HC534FK | SNJ54HC534FKR | SNJ54HC534WR | SNJ54HC534W | SN54HC534FKR | SN54HC534W | SN54HC534WR | SNJ54HC534J | |
---|---|---|---|---|---|---|---|---|
描述 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20 | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDIP20, 0.300 INCH, CERAMIC, DIP-20 |
零件包装代码 | QLCC | QLCC | DFP | DFP | QLCC | DFP | DFP | DIP |
包装说明 | QCCN, LCC20,.35SQ | QCCN, | DFP, | DFP, FL20,.3 | QCCN, | DFP, FL20,.3 | DFP, | DIP, DIP20,.3 |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | not_compliant | unknown | unknown | not_compliant | unknown | unknown | unknown | not_compliant |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F20 | R-GDFP-F20 | S-CQCC-N20 | R-GDFP-F20 | R-GDFP-F20 | R-GDIP-T20 |
长度 | 8.89 mm | 8.89 mm | 13.09 mm | 13.09 mm | 8.89 mm | 13.09 mm | 13.09 mm | 24.195 mm |
负载电容(CL) | 150 pF | 150 pF | 150 pF | 150 pF | 150 pF | 150 pF | 150 pF | 150 pF |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | QCCN | DFP | DFP | QCCN | DFP | DFP | DIP |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | IN-LINE |
传播延迟(tpd) | 345 ns | 345 ns | 345 ns | 345 ns | 345 ns | 345 ns | 345 ns | 345 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.03 mm | 2.03 mm | 2.54 mm | 2.54 mm | 2.03 mm | 2.54 mm | 2.54 mm | 5.08 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | NO LEAD | NO LEAD | FLAT | FLAT | NO LEAD | FLAT | FLAT | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
宽度 | 8.89 mm | 8.89 mm | 6.92 mm | 6.92 mm | 8.89 mm | 6.92 mm | 6.92 mm | 7.62 mm |
厂商名称 | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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