电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

LCGHV6T20SW

产品描述SNAP ACTING/LIMIT SWITCH, SPST, MOMENTARY, 8.36mm, THROUGH HOLE-STRAIGHT, ROHS COMPLIANT
产品类别机电产品    开关   
文件大小198KB,共4页
制造商C&K
标准  
下载文档 详细参数 全文预览

LCGHV6T20SW概述

SNAP ACTING/LIMIT SWITCH, SPST, MOMENTARY, 8.36mm, THROUGH HOLE-STRAIGHT, ROHS COMPLIANT

LCGHV6T20SW规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
ECCN代码EAR99
执行器行程8.36 mm
执行器类型LEVER, LOW FORCE
主体宽度6.1 mm
主体高度9.32 mm
主体长度或直径19.84 mm
触点(交流)最大额定R负载5A@250VAC
最大触点电流(交流)5 A
最大触点电压(交流)250 V
电气寿命6000 Cycle(s)
制造商序列号LC
安装特点THROUGH HOLE-STRAIGHT
最大操作力0.29 N
最高工作温度85 °C
最低工作温度-25 °C
最大预行程7.01 mm
表面贴装NO
开关动作MOMENTARY
开关功能SPST
开关类型SNAP ACTING/LIMIT SWITCH
端接类型SOLDER
Base Number Matches1

文档预览

下载PDF文档
LC Series
Subminiature Precision Snap-acting Switches
Features/Benefits
Compact design
Long life and high electrical capacity
Quick connect, wire lead or PC mounting
Wide variety of actuator styles
Typical Applications
Motorized equipment
Sump pump
Thermostatic controls
Specifications
CONTACT RATING: From low level* to 10.1 AMPS @ 250 V AC.
ELECTRICAL LIFE: 100,000 cycles
INSULATION RESISTANCE: 1,000 M
οηµ
min.
DIELECTRIC STRENGTH: 1,000 Vrms min. @ sea level.
OPERATING TEMPERATURE: –17ºF to 185ºF (–25ºC to 85ºC).
OPERATING FORCE: From 142 to 170 grams at actuator button.
Forces are less at free end of lever actuators; (see OPERATING
FORCE and ACTUATOR option sections).
MOUNTING: 2-56 screws, torque 2.3 in/lbs max.
* Low Level=conditions where no arcing occurs during switching, i.e., 0.4 VA max. @
20 V AC or DC max.
NOTE:
Specifications and materials listed above are for switches with standard options.
For information on specific and custom switches, consult Customer Service center.
Materials
SWITCH HOUSING: Thermoplastic polyester or high temperature
thermoplastic (PTS) (UL 94V-0).
ACTUATOR BUTTON: Thermoplastic polyester (UL 94V-0).
SPRING: Copper alloy.
PIVOT: Copper alloy.
MOVABLE CONTACTS: Fine silver for ratings greater than 1 AMP
@ 125 V AC. Fine silver with 24K gold plate for 1 AMP @
125 V AC or less.
STATIONARY CONTACTS: Fine silver welded on copper alloy for
ratings greater than 1 AMP @ 125 V AC. Gold alloy welded
on copper alloy for ratings less than 1 AMP @ 125 V AC.
TERMINALS: Copper alloy.
TERMINAL SEAL: Epoxy.
J
Snap-acting
Build-A-Switch
To order, simply select desired option from each category and place in the appropriate box. Available options are shown and
described on pages J-18 through J-20. For additional options not shown in catalog, consult Customer Service Center.
L
Series
LC
SP, Mom.
Operating Force
GG
5 oz./142 grams
GD
3.3 oz./94 grams
GH
6 oz./170 grams
C
Electrical Rating
F5
1 A, 125, V AC, 30 V DC
L9
5 A, 1/3 HP, 125, 250 V AC
M1
10.1 A, 1/3 HP, 125, 25O V AC
V6
5 A, 1/3 HP, 125, 250 V AC
X1
1 A, 125 V AC, 3O V DC
Actuator
P00
Pin plunger
A10
.28" lever roller, high force
A25
.61" lever roller, low force
T10
.29" lever, high force
T13
.22" simulated roller, high force
T20
.38" lever, low force
T23
.32" simulated roller, low force
T25
.67" lever, low force
Terminations
E
Solder
H
.110" quick connect
J
Wire lead
L
Left formed PC thru-hole
R
Right formed PC thru-hole
S
PC Thru-hole
Circuitry
C
SPDT
W
SPST N.C.
Y
SPST N.O.
Electrical Life
NONE
6,000 operations
U
Extended 100,000 operations
Seal
NONE
(STD.) No seal
E
Epoxy seal
Dimensions are shown: Inches (mm)
Specifications and dimensions subject to change
J–17
www.ck-components.com
详解:一体化监控摄像机市场竞争点到底在哪
对于一体化摄像机,一直以来有几种不同的理解,譬如:一体化半球摄像机、一体化球型摄像机、一体化云台摄像机、镜头内嵌型一体机。 有指半球型一体机、快速球型一体机、结合云台的一体化 ......
jovetech 工业自动化与控制
水军课堂:关于枚举类型的那些事儿
:pleased:在咱们的EEWORLD论坛里隐藏着一支队伍庞大的水军,相信常来的网友们都有所听说。今天,咱们的一名水兵正在学习C语言枚举类型方面的知识点,他有点困惑,于是发起了一个小问题,引来了 ......
okhxyyo 编程基础
汽车电子
本人在读大三的一名学生,我学的是电子信息工程专业,以后想从事汽车电子方面的工作,但是不知道从何学起,跪求各位大神给点意见,给我指条路,谢谢!...
龙哥还是个小白 汽车电子
哪位兄弟用过 STM8L151K4T6 吗?这片的DAC稳定吗
或者推荐一个STM32/STM8带DAC的单片机?最好10块以内的 ...
半亩先生 stm32/stm8
(转)利用Kintex-7 FPGA 设计19nm 闪存 PCIe SSD
原文地址 借助赛灵思7 系列器件,这款基于PCI Express 的固态磁盘设计同时获得速度和性能提升。以NAND 闪存存储器为基础的固态磁盘(SSD)技术与传统的机械驱动器存储系统相比, 吞吐量更高 ......
白丁 FPGA/CPLD
STM32的两个.bin文件如何合并?
STM的两个.bin文件,一个是用于IAP的,一个是用户程序,想将这两个.bin文件合并为一个,然后烧写到芯片中。有什么合并工具或方法吗?...
kjjkioi stm32/stm8

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 275  1597  862  325  1077  39  57  2  41  12 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved