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NM93CS56LZN

产品描述EEPROM, 128X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8
产品类别存储    存储   
文件大小124KB,共14页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
下载文档 详细参数 选型对比 全文预览

NM93CS56LZN概述

EEPROM, 128X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8

NM93CS56LZN规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码DIP
包装说明DIP, DIP8,.3
针数8
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性DATA RETENTION=40 YEARS
最大时钟频率 (fCLK)0.25 MHz
数据保留时间-最小值40
耐久性1000000 Write/Erase Cycles
JESD-30 代码R-PDIP-T8
JESD-609代码e0
长度9.817 mm
内存密度2048 bit
内存集成电路类型EEPROM
内存宽度16
功能数量1
端子数量8
字数128 words
字数代码128
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128X16
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP8,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行SERIAL
峰值回流温度(摄氏度)NOT SPECIFIED
电源3/5 V
认证状态Not Qualified
座面最大高度5.08 mm
串行总线类型MICROWIRE
最大待机电流0.000001 A
最大压摆率0.001 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
最长写入周期时间 (tWC)15 ms
写保护HARDWARE/SOFTWARE
Base Number Matches1

文档预览

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NM93CS06LZ/CS46LZ/CS56LZ/CS66LZ 256-/1024-/2048-/4096-Bit Serial EEPROM with Extended
Voltage (2.7V to 5.5V) and Data Protect ( MICROWIRE
Bus Interface)
NM93CS06LZ/CS46LZ/CS56LZ/CS66LZ
March 1997
NM93CS06LZ/CS46LZ/CS56LZ/CS66LZ
256-/1024-/2048-/4096-Bit Serial EEPROM with Extended
Voltage (2.7V to 5.5V) and Data Protect (MICROWIRE
Bus Interface)
General Description
The NM93CS06LZ/CS46LZ/CS56LZ/CS66LZ devices are
256/1024/2048/4096 bits, respectively, of non-volatile elec-
trically erasable memory divided into 16/64/128/256 x 16-bit
registers (addresses). The NM93CSxxLZ Family functions in
an extended voltage operating range and is fabricated using
Fairchild Semiconductor’s floating gate CMOS technology
for high reliability, high endurance and low power consump-
tion. N registers (N≤16, N≤64, N≤128, N≤256) can be pro-
tected against data modification by programming the Protect
Register with the address of the first register to be protected
against data modification. (All registers greater than, or
equal to, the selected address are then protected from fur-
ther change.) Additionally, this address can be “locked” into
the device, making all future attempts to change data impos-
sible.
These devices are available in both SO and TSSOP pack-
ages for small space considerations.
The serial interface that control these EEPROMs is MI-
CROWIRE compatible, providing simple interfacing to stan-
dard microcontrollers and microprocessors. There are a total
of 10 instructions, 5 which operate on the EEPROM memory
and 5 which operate on the Protect Register. The memory in-
structions are READ, WRITE, WRITE ALL, WRITE EN-
ABLE, and WRITE DISABLE. The Protect register instruc-
tions are PRREAD, PRWRITE, PRCLEAR, PRDISABLE and
PRENABLE.
Features
n
n
n
n
n
n
n
n
n
n
n
n
n
2.7V to 5.5V operation in all modes
Less than 1.0 µA standby current
Sequential register read
Write protection in a user-defined section of memory
Typical active current of 200 µA
Direct write: no erase before program
Reliable CMOS floating gate technology
MICROWIRE compatible serial I/O
Self-timed programming cycle
Device status indication during programming mode
40 years data retention
Endurance: 10
6
changes
Packages available: 8-pin SO, 8-pin DIP, 8-Pin TSSOP
Block Diagram
DS011807-1
© 1997 Fairchild Semiconductor Corporation
DS011807
www.fairchildsemi.com
1
PrintDate=1997/08/29 PrintTime=12:23:19 10402 ds011807 Rev. No. 5 cmserv
Proof
1

NM93CS56LZN相似产品对比

NM93CS56LZN NM93CS66LZEN NM93CS56LZEN NM93CS56LZEMT8 NM93CS66LZVN NM93CS66LZN NM93CS66LZEMT8 NM93CS56LZM8 NM93CS56LZVN NM93CS66LZMT8
描述 EEPROM, 128X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 256X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 128X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 128X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 EEPROM, 256X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 256X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 256X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 EEPROM, 128X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SO-8 EEPROM, 128X16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 256X16, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 DIP DIP DIP SOIC DIP DIP SOIC SOIC DIP SOIC
包装说明 DIP, DIP8,.3 PLASTIC, DIP-8 DIP, DIP8,.3 TSSOP, TSSOP8,.25 PLASTIC, DIP-8 PLASTIC, DIP-8 PLASTIC, TSSOP-8 SOP, SOP8,.25 DIP, DIP8,.3 PLASTIC, TSSOP-8
针数 8 8 8 8 8 8 8 8 8 8
Reach Compliance Code unknown compliant unknown unknown compliant compliant compliant unknown unknown compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
其他特性 DATA RETENTION=40 YEARS DATA RETENTION=40 YEARS DATA RETENTION=40 YEARS DATA RETENTION=40 YEARS DATA RETENTION=40 YEARS DATA RETENTION=40 YEARS DATA RETENTION=40 YEARS DATA RETENTION=40 YEARS DATA RETENTION=40 YEARS DATA RETENTION=40 YEARS
最大时钟频率 (fCLK) 0.25 MHz 0.25 MHz 0.25 MHz 0.25 MHz 0.25 MHz 0.25 MHz 0.25 MHz 0.25 MHz 0.25 MHz 0.25 MHz
数据保留时间-最小值 40 40 40 40 40 40 40 40 40 40
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 代码 R-PDIP-T8 R-PDIP-T8 R-PDIP-T8 R-PDSO-G8 R-PDIP-T8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 9.817 mm 9.817 mm 9.817 mm 4.4 mm 9.817 mm 9.817 mm 4.4 mm 4.9 mm 9.817 mm 4.4 mm
内存密度 2048 bit 4096 bit 2048 bit 2048 bit 4096 bit 4096 bit 4096 bit 2048 bit 2048 bit 4096 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 16 16 16 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8 8 8 8
字数 128 words 256 words 128 words 128 words 256 words 256 words 256 words 128 words 128 words 256 words
字数代码 128 256 128 128 256 256 256 128 128 256
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 85 °C 85 °C 125 °C 70 °C 85 °C 70 °C 125 °C 70 °C
最低工作温度 - -40 °C -40 °C -40 °C -40 °C - -40 °C - -40 °C -
组织 128X16 256X16 128X16 128X16 256X16 256X16 256X16 128X16 128X16 256X16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP DIP DIP TSSOP DIP DIP TSSOP SOP DIP TSSOP
封装等效代码 DIP8,.3 DIP8,.3 DIP8,.3 TSSOP8,.25 DIP8,.3 DIP8,.3 TSSOP8,.25 SOP8,.25 DIP8,.3 TSSOP8,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm 5.08 mm 5.08 mm 1.2 mm 5.08 mm 5.08 mm 1.2 mm 1.75 mm 5.08 mm 1.2 mm
串行总线类型 MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE MICROWIRE
最大待机电流 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A
最大压摆率 0.001 mA 0.001 mA 0.001 mA 0.001 mA 0.001 mA 0.001 mA 0.001 mA 0.001 mA 0.001 mA 0.001 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 NO NO NO YES NO NO YES YES NO YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE COMMERCIAL INDUSTRIAL COMMERCIAL AUTOMOTIVE COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING
端子节距 2.54 mm 2.54 mm 2.54 mm 0.65 mm 2.54 mm 2.54 mm 0.65 mm 1.27 mm 2.54 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 7.62 mm 7.62 mm 7.62 mm 3 mm 7.62 mm 7.62 mm 3 mm 3.9 mm 7.62 mm 3 mm
最长写入周期时间 (tWC) 15 ms 15 ms 15 ms 15 ms 15 ms 15 ms 15 ms 15 ms 15 ms 15 ms
写保护 HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
厂商名称 - - - Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild
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