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MR27T6402L-XXXMA: 产品描述MASK ROM, 4MX16, 90ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44; 产品类别存储存储; 文件大小262KB，共12页; 制造商LAPIS Semiconductor Co Ltd

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MR27T6402L-XXXMA概述

MASK ROM, 4MX16, 90ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44

MR27T6402L-XXXMA规格参数

参数名称	属性值
零件包装代码	SOIC
包装说明	0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44
针数	44
Reach Compliance Code	unknown
ECCN代码	EAR99
最长访问时间	90 ns
备用内存宽度	8
JESD-30 代码	R-PDSO-G44
长度	28.15 mm
内存密度	67108864 bit
内存集成电路类型	MASK ROM
内存宽度	16
功能数量	1
端子数量	44
字数	4194304 words
字数代码	4000000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	4MX16
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP44,.63
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	PARALLEL
电源	3/3.3 V
认证状态	Not Qualified
座面最大高度	3.1 mm
最大待机电流	0.00001 A
最大压摆率	0.02 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
宽度	13 mm
Base Number Matches	1

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FEDR27T6402L-002-03

Issue Date: Jan. 06, 2009

MR27T6402L

4M–Word

×

16–Bit or 8M–Word

×

8–Bit

P2ROM

PIN CONFIGURATION (TOP VIEW)

FEATURES

· 4,194,304-word

×

16-bit / 8,388,608-word

×

8-bit

electrically switchable configuration

· Access time

2.7 V to 3.6 V power supply 90 ns MAX

3.0 V to 3.6 V power supply 70 ns MAX

· Operating current 20 mA MAX (5MHz)

· Standby current

10 µA MAX

· Input/Output TTL compatible

· Three-state output

PACKAGES

· MR27T6402L-xxxMA

44-pin plastic SOP (SOP44-P-600-1.27-K)

· MR27T6402L-xxxTN

48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)

· MR27T6402L-xxxLY

48-ball BGA (P-TFBGA48-6.4x10.0-0.80)

A21

A18

A17

A7

A6

A5

A4

A3

A2

A1

A0

CE#

V

SS

OE#

D0

D8

D1

D9

D2

D10

D3

D11

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

44

A20

43

A19

42

A8

41

A9

40

A10

39

A11

38

A12

37

A13

36

A14

35

A15

34

A16

33

BYTE#

32

V

SS

31

D15/A–1

30

D7

29

D14

28

D6

27

D13

26

D5

25

D12

24

D4

23

V

CC

44SOP

P2ROM ADVANCED TECHNOLOGY

P2ROM stands for Production Programmed ROM. This

exclusive LAPIS Semiconductor technology utilizes factory

test equipment for programming the customers code into the

P2ROM prior to final production testing.

Advancements in this technology allows production costs to be

equivalent to MASKROM and has many advantages and added

benefits over the other non-volatile technologies, which

include the following;

· Short lead time,

since the P2ROM is programmed at the

final stage of the production process, a large P2ROM

inventory "bank system" of un-programmed packaged

products are maintained to provide an aggressive lead-time

and minimize liability as a custom product.

· No mask charge,

since P2ROMs do not utilize a custom

mask for storing customer code, no mask charges apply.

· No additional programming charge,

unlike Flash and

OTP that require additional programming and handling

costs, the P2ROM already has the code loaded at the factory

with minimal effect on the production throughput. The cost

is included in the unit price.

· Custom Marking is

available at no additional charge.

· Pin Compatible with Mask ROM

and some FLASH

products.

A15

A14

A13

A12

A11

A10

A9

A8

A19

A20

NC

NC

A21

NC

NC

A18

A17

A7

A6

A5

A4

A3

A2

A1

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

48

A16

47

BYTE#

46

V

SS

45

D15/A–1

44

D7

43

D14

42

D6

41

D13

40

D5

39

D12

38

D4

37

V

CC

36

D11

35

D3

34

D10

33

D2

32

D9

31

D1

30

D8

29

D0

28

OE#

27

V

SS

26

CE#

25

A0

48TSOP(Type-I)

1/12

MR27T6402L-XXXMA相似产品对比

	MR27T6402L-XXXMA	MR27T6402L-XXXLY	MR27T6402L-XXXTN
描述	MASK ROM, 4MX16, 90ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44	MASK ROM, 4MX16, 90ns, CMOS, PBGA48, 6.40 X 10 MM, 0.80 MM PITCH, TFBGA-48	MASK ROM, 4MX16, 90ns, CMOS, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
零件包装代码	SOIC	BGA	TSOP1
包装说明	0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44	6.40 X 10 MM, 0.80 MM PITCH, TFBGA-48	12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
针数	44	48	48
Reach Compliance Code	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99
最长访问时间	90 ns	90 ns	90 ns
备用内存宽度	8	8	8
JESD-30 代码	R-PDSO-G44	R-PBGA-B48	R-PDSO-G48
长度	28.15 mm	10 mm	18.4 mm
内存密度	67108864 bit	67108864 bit	67108864 bit
内存集成电路类型	MASK ROM	MASK ROM	MASK ROM
内存宽度	16	16	16
功能数量	1	1	1
端子数量	44	48	48
字数	4194304 words	4194304 words	4194304 words
字数代码	4000000	4000000	4000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C
组织	4MX16	4MX16	4MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	TFBGA	TSSOP
封装等效代码	SOP44,.63	BGA48,6X8,32	TSSOP48,.8,20
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL
电源	3/3.3 V	3/3.3 V	3/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3.1 mm	1.2 mm	1.2 mm
最大待机电流	0.00001 A	0.00001 A	0.00001 A
最大压摆率	0.02 mA	0.02 mA	0.02 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V
表面贴装	YES	YES	YES
技术	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	BALL	GULL WING
端子节距	1.27 mm	0.8 mm	0.5 mm
端子位置	DUAL	BOTTOM	DUAL
宽度	13 mm	6.415 mm	12 mm
Base Number Matches	1	1	1

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