电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HDSM2-400SL8F3-0.5

产品描述400 CONTACT(S), FEMALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, RECEPTACLE
产品类别连接器    连接器   
文件大小303KB,共4页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
下载文档 详细参数 全文预览

HDSM2-400SL8F3-0.5概述

400 CONTACT(S), FEMALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, RECEPTACLE

HDSM2-400SL8F3-0.5规格参数

参数名称属性值
Objectid1719497833
Reach Compliance Codeunknown
YTEOL7.87
其他特性STANDRD: MIL-DTL-55302, POLARIZED
主体宽度0.36 inch
主体深度0.695 inch
主体长度5.8 inch
主体/外壳类型RECEPTACLE
连接器类型TELECOM AND DATACOM CONNECTOR
联系完成配合GOLD (50) OVER COPPER
联系完成终止GOLD (50) OVER COPPER
触点性别FEMALE
触点模式STAGGERED
触点样式RND PIN-SKT
DIN 符合性NO
介电耐压600V V
耐用性500 Cycles
空壳NO
滤波功能NO
IEC 符合性NO
绝缘电阻5000000000 Ω
绝缘体材料LIQUID CRYSTAL POLYMER
JESD-609代码e4
MIL 符合性YES
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装选项1#2-56 UNC
安装选项2THREADED
安装方式STRAIGHT
安装类型BOARD AND PANEL
装载的行数4
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
极化密钥POLARIZED KEY
额定电流(信号)3 A
外壳面层NICKEL
外壳材料ALUMINUM ALLOY
端子节距0.22 mm
端接类型SURFACE MOUNT
触点总数400

文档预览

下载PDF文档
Rectangular Connectors
High Density Standard Module (HDSM) Connectors
Features
I
Designed for surface
mounting on both daughter
board and mother board for
increased circuit density
Basic design offers 38, 78,
120, 152, 200, 304, and 400
contact designs
High reliability twist pin and
socket per MIL-DTL-83513
and MIL-DTL-55302
Connector permits lateral
movement of daughter
board to accommodate
clamping of the heatsink
Plated through-hole
mounting available
Available with flying leads
Extender card option
available
Typical mating force for 304
contacts is 38 pounds
Designed to withstand vapor
phase soldering
Two rotatable (six position)
polarizing keys are provided
accommodating 36 possible
combinations
Jackscrew hardware
available; consult
Tyco Electronics
Different modular inserts
may be specified to include
coax (Pixi/Con), fiber optic
or other special contacts
Inserts may be partially or
fully loaded and installed in
the connector shell in
various configurations
The MICRODOT HDSM
connector is designed for
4 row .050 [1.27] pitch
density with a special low
force twist pin that meets
all requirements of MIL-
DTL-55302 and MIL-DTL-
83513. This high density
connector allows the use of
construction to double the
packaging density with
surface mount capability.
I
I
I
Rectangular
Connectors
I
I
I
I
I
I
2
I
I
Performance Data Summary
Electrical
Contacts
— Pin 24 AWG twist pin,
Socket #24 AWG, Wire range 24 AWG to
32 AWG solid and stranded.
Contact Resistance (voltage drop)
25 millivolts max. at 3 amps, 25° ± 3° C.
Current Rating
— 3 amps max. per
contact
Dielectric Withstanding Voltage
Volts RMS 60 Hz at room ambient:
600 V for solder pots at sea level.
150 V for solder pots at 70,000 ft.
[21,336m]
500 V for wire terminations at sea level.
200 V for wire terminations at 70,000 ft.
Insulation Resistance
— 5,000
megohms min. at room ambient.
Magnetic Permeability
— 2 mµ max.
Materials and Finishes
Contacts
— Copper alloy plated with
.000050 [0.00127] gold over copper
flash per MIL-G-45204, Type II.
Metal Shell
Insulator — Liquid Crystal Polymer
(LCP) per ASTM D5138 or
Polyphenylene Sulfide per
MIL-M-24519
Body Shell — Aluminum alloy plated
Nickel, electroless per MIL-C-26074.
I
Environmental
Temperature Range
-67°F to 257°F [-55° C to +125° C].
Vibration
— No discontinuity in
excess of 1 micro sec. when tested in
accordance with MIL-STD-1344,
Method 2005, test Condition IV.
Insulator Retention
— Inserts will
withstand a 50 lb. per square inch load
in either direction.
Shock
— No discontinuity in excess of
1 micro sec. when tested in accordance
with MIL-STD-1344, Method 2004, test
Condition E.
Mechanical
Contact Spacing
— .050 [1.27] centers
Contact Engagement &
Separation
— 5.0 oz max. [1.39N]
(eng.) 0.5 oz. min. [.14N] 3.5 oz. typ.
[.97N] (sep.) force.
Durability
— No mechanical or electri-
cal defects detrimental to the function of
the connectors after 500 cycles of mat-
ing and unmating. (Caution: Mating
force increases during durability cycling
may be noted).
Humidity
— After exposure to humidi-
ty as specified by MIL-STD-1344,
Method 1002, Type II, IR shall be 1
megohm min. immediately following
step 7a of Method 1002 and 1000
megohms min. after 24 hours of condi-
tioning per Method 1002.
Salt Spray
— Connectors shall meet
the performance requirements of contact
resistance, mating and unmating forces,
and contact retention after being subject-
ed to the 48-hour 5% solution salt spray
test per MIL-STD-1344, Method 1001,
Condition B.
Crimp Termination Tensile
Strength
— *Unassembled contacts
with crimped stranded wire terminations.
Wires will not pull out of contacts when
the following axial loads are applied:
24 AWG, 5 lbs., 26 AWG, 4 lbs.,
28 AWG, 3 lbs.
51
Catalog 1308638
Revised 8-05
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
简单问题
wince的image在解压后,所有的内容都是常驻内存吗? 更新注册表和数据库应该需要读写flash吧? 但是写回flash时,写到哪里?它们不可能重新自己压缩进image吧。下次开机时,image中的注册表 ......
lfaitq 嵌入式系统
AD7746/AD7747
第一次调试AD7746,一直未调试通,谁做过相关的驱动代码,劳烦发下参考,谢谢。 ...
米兰的徐奥铁匠 ADI 工业技术
求购二手【ST三合一开发板】一块
请报价,最好可以在淘宝网交易...
tuzi2 stm32/stm8
当控制板接近主回路板信号遇到干扰导致电感会叫,求指点一二
最近在做一车载充电,当控制板接近主回路板,并且电流增大到一定值的时候。主回路上的大电感会叫,导致不敢继续增加电流,把控制板远离主回路板时候,效果会好点,哪位大侠遇到过类似问题,大功 ......
youluo 模拟电子
[先楫HPM6750测评之八]细说SPI外设遇到的小曲折
自从上次的贴子调试不通SPI DMA后,一直搁置到现在,官方也刚好发布了V0.11.0版本,这回又重拾了SPI DMA。 很奇怪的是,把官方的SPI DMA移植过来之后,一直都是不成功,也没法触发到DMA完成 ......
RCSN 国产芯片交流
中断问题。。。麻烦各位老师帮我看看怎么回事,谢谢。
不知道怎么回事,流水灯没有按照我预期的1S移动一次,而是以很快的速度在变换,麻烦各位老师看看问题出在什么地方,万分感激!!! #include #include #define uchar unsigned char uchar a ......
FQZhen 51单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 624  2325  216  1706  1410  24  15  28  52  31 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved