D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec
MUR260
Preferred Device
SWITCHMODEt
Power Rectifier
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
http://onsemi.com
•
•
•
•
•
•
Ultrafast 50 Nanosecond Recovery Times
175°C Operating Junction Temperature
Low Forward Voltage
Low Leakage Current
High Temperature Glass Passivated Junction
These are Pb−Free Devices*
ULTRAFAST RECTIFIER
2.0 AMPERES, 600 VOLTS
Mechanical Characteristics:
•
Case: Epoxy, Molded
•
Weight: 0.4 Gram (Approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•
Shipped in Plastic Bags; 1,000 per Bag
•
Available Tape and Reel; 5,000 per Reel, by Adding a “RL’’ Suffix to
the Part Number
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (Note 1)
(Square Wave Mounting Method #3 Per Note 3)
Non-Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
Operating Junction Temperature and Storage
Temperature Range
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FSM
Value
600
−
2.0 @
T
A
= 60°C
35
Unit
V
A
MUR260
YYWW
G
G
PLASTIC
AXIAL LEAD
CASE 59
MARKING DIAGRAM
A
A
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
T
J
, T
stg
−65 to
+175
°C
THERMAL CHARACTERISTICS
Characteristics
Maximum Thermal Resistance,
Junction−to−Ambient
Symbol
R
qJA
Value
See
Note 3
Unit
°C/W
MUR260
ORDERING INFORMATION
Device
Package
Axial Lead**
Axial Lead**
Axial Lead**
Axial Lead**
Shipping
†
1000 Units/Bag
1000 Units/Bag
5000/Tape & Reel
5000/Tape & Reel
MUR260G
MUR260RL
MUR260RLG
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
**This package is inherently Pb−Free.
Preferred
devices are recommended choices for future use
and best overall value.
1
July, 2006 − Rev. 4
Publication Order Number:
MUR260/D
MUR260
ELECTRICAL CHARACTERISTICS
Characteristics
Maximum Instantaneous Forward Voltage (Note 2)
(I
F
= 2.0 Amp, T
J
= 150°C)
(I
F
= 2.0 Amp, T
J
= 25°C)
Maximum Instantaneous Reverse Current (Note 2)
(Rated dc Voltage, T
J
= 150°C)
(Rated dc Voltage, T
J
= 25°C)
Maximum Reverse Recovery Time
(I
F
= 1.0 Amp, di/dt = 50 Amp/ms)
(I
F
= 0.5 Amp, I
R
= 1.0 Amp, I
REC
= 0.25 A)
Maximum Forward Recovery Time
(I
F
= 1.0 A, di/dt = 100 A/ms, I
REC
to 1.0 V)
2. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
Symbol
v
F
1.15
1.35
i
R
150
5.0
t
rr
75
50
t
fr
50
ns
ns
mA
Value
Unit
V
10
10
I F , INSTANTANEOUS FORWARD CURRENT (AMPS)
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
125°C
75°C
25°C
V
F
@ 150°C
1.0
V
F
@ 150°C
1.0
125°C
75°C
25°C
0.1
0.1
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
V
F
, INSTANTANEOUS VOLTAGE (VOLTS)
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
V
F,
INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Maximum Forward Voltage
Figure 2. Typical Forward Voltage
http://onsemi.com
2
MUR260
100
T
J
= 150°C
IR, REVERSE CURRENT (
m
A)
125°C
10
75°C
IR, REVERSE CURRENT (
m
A)
10
1.0
100
I
R
@ 150°C
125°C
75°C
1.0
0.1
0.01
25°C
25°C
0.1
0
20
40
60
80
100
120
140
160
180
200
V
R
, REVERSE VOLTAGE (VOLTS)
0.001
0
75
150
225
300
375
450
525
600
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 3. Maximum Reverse Current
Figure 4. Typical Reverse Current
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
5.0
PF(AV), AVERAGE POWER DISSIPATION (WATTS)
SQUARE WAVE
3.0
dc
4.0
3.0
2.0
2.0
dc
1.0
1.0
SQUARE WAVE
0
0
50
100
150
200
0
0
0.5
1.0
1.5
2.0
2.5
3.0
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
T
A
, AMBIENT TEMPERATURE (°C)
Figure 5. Current Derating
Figure 6. Power Dissipation
50
T
J
= 25°C
C, CAPACITANCE (pF)
30
20
10
7.0
5.0
0
10
20
30
40
50
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 7. Typical Capacitance
http://onsemi.com
3
MUR260
NOTE 3 — AMBIENT MOUNTING DATA
Data shown for thermal resistance, junction−to−ambient
(R
qJA
) for the mountings shown is to be used as typical
guideline values for preliminary engineering or in case the
tie point temperature cannot be measured.
TYPICAL VALUES FOR R
qJA
IN STILL AIR
Mounting
Method
1
2
R
qJA
3
Lead
1/8
52
67
Length, L
1/4
1/2
65
72
80
87
50
Units
°C/W
°C/W
°C/W
MOUNTING METHOD 1
L
L
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
MOUNTING METHOD 2
L
L
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
Vector Pin Mounting
MOUNTING METHOD 3
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
L = 3/8
″
Board Ground Plane
P.C. Board with
1−1/2
″
X 1−1/2
″
Copper Surface
http://onsemi.com
4
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
