IC PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 14-BIT DAC, PQCC28, PLASTIC, LCC-28, Digital to Analog Converter
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | QLCC |
包装说明 | PLASTIC, LCC-28 |
针数 | 28 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY, OFFSET BINARY |
输入格式 | PARALLEL, WORD |
JESD-30 代码 | S-PQCC-J28 |
JESD-609代码 | e0 |
长度 | 11.5062 mm |
最大线性误差 (EL) | 0.0061% |
位数 | 14 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC28,.5SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 12/15,GND/-0.3 V |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大稳定时间 | 2 µs |
标称安定时间 (tstl) | 0.8 µs |
最大压摆率 | 4 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 11.5062 mm |
Base Number Matches | 1 |
AD7535KP-REEL | AD7535KNZ | AD7535TQ/883B | AD7535JNZ | AD7535JP-REEL | |
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描述 | IC PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 14-BIT DAC, PQCC28, PLASTIC, LCC-28, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 14-BIT DAC, PDIP28, PLASTIC, DIP-28, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 14-BIT DAC, CDIP28, CERDIP-28, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 14-BIT DAC, PDIP28, PLASTIC, DIP-28, Digital to Analog Converter | 14-Bit 4-Quadrant Multiplying (Current Output) DAC with Byte-wide Parallel Interface |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 | 不符合 |
零件包装代码 | QLCC | DIP | DIP | DIP | QLCC |
包装说明 | PLASTIC, LCC-28 | DIP, | CERDIP-28 | DIP, | QCCJ, LDCC28,.5SQ |
针数 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | not_compliant | compliant | not_compliant | compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | EAR99 |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
JESD-30 代码 | S-PQCC-J28 | R-PDIP-T28 | R-GDIP-T28 | R-PDIP-T28 | S-PQCC-J28 |
JESD-609代码 | e0 | e3 | e0 | e3 | e0 |
最大线性误差 (EL) | 0.0061% | 0.0061% | 0.006% | 0.0122% | 0.0122% |
位数 | 14 | 14 | 14 | 14 | 14 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | DIP | DIP | DIP | QCCJ |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT APPLICABLE | 225 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 5.08 mm | 5.72 mm | 5.08 mm | 4.57 mm |
最大稳定时间 | 2 µs | 2 µs | 1.5 µs | 2 µs | 2 µs |
表面贴装 | YES | NO | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | MATTE TIN | TIN LEAD | MATTE TIN | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED | NOT APPLICABLE | NOT SPECIFIED |
宽度 | 11.5062 mm | 15.24 mm | 15.24 mm | 15.24 mm | 11.5062 mm |
长度 | 11.5062 mm | 36.705 mm | - | 36.705 mm | 11.5062 mm |
封装等效代码 | LDCC28,.5SQ | - | DIP28,.6 | - | LDCC28,.5SQ |
电源 | 12/15,GND/-0.3 V | - | 12/15,GND/-0.3 V | - | 12/15,GND/-0.3 V |
标称安定时间 (tstl) | 0.8 µs | 0.8 µs | - | 0.8 µs | 0.8 µs |
最大压摆率 | 4 mA | - | 4 mA | - | 4 mA |
Base Number Matches | 1 | 1 | 1 | - | - |
是否无铅 | - | 不含铅 | - | 不含铅 | 含铅 |
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