16Mx64 SDRAM DIMM based on 16Mx16, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | DIMM |
| 包装说明 | DIMM, DIMM168 |
| 针数 | 168 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 访问模式 | SINGLE BANK PAGE BURST |
| 最长访问时间 | 6 ns |
| 其他特性 | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | 100 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-XDMA-N168 |
| 内存密度 | 1073741824 bi |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 168 |
| 字数 | 16777216 words |
| 字数代码 | 16000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16MX64 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIMM |
| 封装等效代码 | DIMM168 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 8192 |
| 自我刷新 | YES |
| 最大待机电流 | 0.008 A |
| 最大压摆率 | 0.76 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| M366S1654CTS-L1H | M366S1654CTS | VBFZ-1690+ | ATS-12E-55-C2-R0 | M366S1654CTS-L7C | M366S1654CTS-L7A | M366S1654CTS-L1L | M366S1654CTS-C1H | LTST-C281KRKT | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 16Mx64 SDRAM DIMM based on 16Mx16, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD | 16Mx64 SDRAM DIMM based on 16Mx16, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD | Bandpass Filter | pushPIN HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:LEFT-TABBED,BLUE,T766 | 16Mx64 SDRAM DIMM based on 16Mx16, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD | 16Mx64 SDRAM DIMM based on 16Mx16, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD | 16Mx64 SDRAM DIMM based on 16Mx16, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD | 16Mx64 SDRAM DIMM based on 16Mx16, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD | Meet ROHS, Green Product. |
| 是否Rohs认证 | 不符合 | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 厂商名称 | SAMSUNG(三星) | - | - | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | - |
| 零件包装代码 | DIMM | - | - | - | DIMM | DIMM | DIMM | DIMM | - |
| 包装说明 | DIMM, DIMM168 | - | - | - | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | - |
| 针数 | 168 | - | - | - | 168 | 168 | 168 | 168 | - |
| Reach Compliance Code | compli | - | - | - | compli | compli | compli | compli | - |
| ECCN代码 | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 访问模式 | SINGLE BANK PAGE BURST | - | - | - | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | - |
| 最长访问时间 | 6 ns | - | - | - | 5.4 ns | 5.4 ns | 6 ns | 6 ns | - |
| 其他特性 | AUTO/SELF REFRESH | - | - | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - |
| 最大时钟频率 (fCLK) | 100 MHz | - | - | - | 133 MHz | 133 MHz | 100 MHz | 100 MHz | - |
| I/O 类型 | COMMON | - | - | - | COMMON | COMMON | COMMON | COMMON | - |
| JESD-30 代码 | R-XDMA-N168 | - | - | - | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | - |
| 内存密度 | 1073741824 bi | - | - | - | 1073741824 bi | 1073741824 bi | 1073741824 bi | 1073741824 bi | - |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE | - | - | - | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | - |
| 内存宽度 | 64 | - | - | - | 64 | 64 | 64 | 64 | - |
| 湿度敏感等级 | 1 | - | - | - | 1 | 1 | 1 | 1 | - |
| 功能数量 | 1 | - | - | - | 1 | 1 | 1 | 1 | - |
| 端口数量 | 1 | - | - | - | 1 | 1 | 1 | 1 | - |
| 端子数量 | 168 | - | - | - | 168 | 168 | 168 | 168 | - |
| 字数 | 16777216 words | - | - | - | 16777216 words | 16777216 words | 16777216 words | 16777216 words | - |
| 字数代码 | 16000000 | - | - | - | 16000000 | 16000000 | 16000000 | 16000000 | - |
| 工作模式 | SYNCHRONOUS | - | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 70 °C | - | - | - | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 组织 | 16MX64 | - | - | - | 16MX64 | 16MX64 | 16MX64 | 16MX64 | - |
| 输出特性 | 3-STATE | - | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 封装主体材料 | UNSPECIFIED | - | - | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | DIMM | - | - | - | DIMM | DIMM | DIMM | DIMM | - |
| 封装等效代码 | DIMM168 | - | - | - | DIMM168 | DIMM168 | DIMM168 | DIMM168 | - |
| 封装形状 | RECTANGULAR | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | MICROELECTRONIC ASSEMBLY | - | - | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - |
| 峰值回流温度（摄氏度） | 225 | - | - | - | 225 | 225 | 225 | 225 | - |
| 电源 | 3.3 V | - | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 刷新周期 | 8192 | - | - | - | 8192 | 8192 | 8192 | 8192 | - |
| 自我刷新 | YES | - | - | - | YES | YES | YES | YES | - |
| 最大待机电流 | 0.008 A | - | - | - | 0.008 A | 0.008 A | 0.008 A | 0.008 A | - |
| 最大压摆率 | 0.76 mA | - | - | - | 0.88 mA | 0.8 mA | 0.76 mA | 0.76 mA | - |
| 最大供电电压 (Vsup) | 3.6 V | - | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 3 V | - | - | - | 3 V | 3 V | 3 V | 3 V | - |
| 标称供电电压 (Vsup) | 3.3 V | - | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 表面贴装 | NO | - | - | - | NO | NO | NO | NO | - |
| 技术 | CMOS | - | - | - | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | - | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子形式 | NO LEAD | - | - | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
| 端子节距 | 1.27 mm | - | - | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
| 端子位置 | DUAL | - | - | - | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
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