Fast Page DRAM, 2MX8, 70ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | TSOP |
包装说明 | TSOP2, TSOP28,.46 |
针数 | 28 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE |
最长访问时间 | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
长度 | 18.41 mm |
内存密度 | 16777216 bit |
内存集成电路类型 | FAST PAGE DRAM |
内存宽度 | 8 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 28 |
字数 | 2097152 words |
字数代码 | 2000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2MX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装等效代码 | TSOP28,.46 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 2048 |
座面最大高度 | 1.2 mm |
自我刷新 | NO |
最大待机电流 | 0.001 A |
最大压摆率 | 0.1 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
Base Number Matches | 1 |
MSM5117800C-70TS-K | MSM5117800C-50TS-L | MSM5117800C-60JS | MSM5117800C-50JS | MSM5117800C-70TS-L | MSM5117800C-50TS-K | MSM5117800C-60TS-L | MSM5117800C-70JS | |
---|---|---|---|---|---|---|---|---|
描述 | Fast Page DRAM, 2MX8, 70ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28 | Fast Page DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, REVERSE, PLASTIC, TSOP2-28 | Fast Page DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Fast Page DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 | Fast Page DRAM, 2MX8, 70ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, REVERSE, PLASTIC, TSOP2-28 | Fast Page DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP2-28 | Fast Page DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, REVERSE, PLASTIC, TSOP2-28 | Fast Page DRAM, 2MX8, 70ns, CMOS, PDSO28, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | TSOP | TSOP | SOJ | SOJ | TSOP | TSOP | TSOP | SOJ |
包装说明 | TSOP2, TSOP28,.46 | TSOP2, TSOP28,.46 | SOJ, SOJ28,.44 | SOJ, SOJ28,.44 | TSOP2, TSOP28,.46 | TSOP2, TSOP28,.46 | TSOP2, TSOP28,.46 | SOJ, SOJ28,.44 |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 70 ns | 50 ns | 60 ns | 50 ns | 70 ns | 50 ns | 60 ns | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm |
内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | TSOP2 | SOJ | SOJ | TSOP2 | TSOP2 | TSOP2 | SOJ |
封装等效代码 | TSOP28,.46 | TSOP28,.46 | SOJ28,.44 | SOJ28,.44 | TSOP28,.46 | TSOP28,.46 | TSOP28,.46 | SOJ28,.44 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
座面最大高度 | 1.2 mm | 1.2 mm | 3.75 mm | 3.75 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.75 mm |
自我刷新 | NO | NO | NO | NO | NO | NO | NO | NO |
最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
最大压摆率 | 0.1 mA | 0.12 mA | 0.11 mA | 0.12 mA | 0.1 mA | 0.12 mA | 0.11 mA | 0.1 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | J BEND | J BEND | GULL WING | GULL WING | GULL WING | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
厂商名称 | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
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