LTCC QUADRATURE
HYBRID COUPLERS
DA T A S HE E T
HDP3F
6.21.2010
FEATURES
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•
•
•
•
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•
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APPLICATIONS
Power Amplifiers
Signal Distribution Networks
Antenna Feeds
Switch Networks
High Power Combiners/Splitters
Phase Shifters
Low Profile Surface Mount Package
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•
High Power
Low Case Junction Resistance
•
Low Insertion Loss
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Excellent Amplitude and Phase Balance
High Isolation
•
RoHS Compliant
Tape and Reel available for High Volume Production
100% RF Tested
GENERAL DESCRIPTION
The HDP3F is a high performance 3dB hybrid coupler in a surface mount package. This low profile coupler handles up
to 200 watts of CW power. The HDP3F is designed for those demanding applications where low loss, excellent
amplitude and phase balance are required.
The HDP3F is manufactured with materials that have thermal expansion characteristics compatible with industry
standard board materials like RO3003, RO4350, FR4 and others. The couplers are available in a RoHS compliant finish
and packaged in tape and reel.
ELECTRICAL SPECIFICATIONS*
Frequency
MHz
2300-2700
Isolation
dB (min)
25
Insertion
Loss
dB (max)
0.13
VSWR
(max)
1.20
Amplitude
Balance
dB (max)
± 0.15
Phase
Balance
degrees (max)
±3
Power
Handling **
Watts CW
200
Operating
Temperature
°
C
-55 to +125
Specification Notes:
* Measured on Florida RF Labs test fixture. Specifications are subject to change without notice.
** Power rating is specified at 95˚C base temperature
1
emct.com • rflabs.com • 772-286-9300
AS 9100, ISO 9001, ISO 14001, OHSAS 18001 Certified
LTCC QUADRATURE
HYBRID COUPLERS
DA T A S HE E T
HDP3F
COUPLER PIN CONFIGURATION AND MECHANICAL OUTLINE
6.21.2010
PORTS
P1
P2
P3
P4
P1
-
ISO
-90°
0°
P2
ISO
-
0°
-90°
P3
-90°
0°
-
ISO
P4
0°
-90°
ISO
-
0.560 [14.22]
P1
P2
0.075 [1.90]
P2
0.430 [10.92]
P1
0.350 [8.89]
0.220 [5.59]
P4
P3
P3
0.065 [1.65]
0.039 [1.00]
P4
COMMONLY USED ATTACHMENT MATERIALS
Material
Gold-Tin Solder
Lead-Free Solder
Lead-Free Solder
Lead-Free Solder
Sn63 Solder
Conductive Epoxy
Composition
80% Gold / 20% Tin
99.3% Tin – 0.7% Copper
96.5% Tin / 3.5% Silver
96.5% Tin / 3% Silver / 0.5% Copper
63% Tin / 37% Lead
Silver Filled
Thermal Conductivity
( Watts/cm/°C )
°
0.58
N/A
0.33
N/A
0.49
0.01 to 0.29
Melting Temperature
(
°
C )
280
227
221
217 - 220
183
N/A
2
emct.com • rflabs.com • 772-286-9300
AS 9100, ISO 9001, ISO 14001, OHSAS 18001 Certified
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