Serial In Serial Out, 4000/14000/40000 Series, 1024-Bit, Right Direction, True Output, CMOS, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | DIP |
包装说明 | DIP, DIP16,.3 |
针数 | 16 |
Reach Compliance Code | unknown |
计数方向 | RIGHT |
系列 | 4000/14000/40000 |
JESD-30 代码 | R-CDIP-T16 |
JESD-609代码 | e0 |
长度 | 20.32 mm |
负载电容(CL) | 15 pF |
逻辑集成电路类型 | SERIAL IN SERIAL OUT |
位数 | 1024 |
功能数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class C |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
最小 fmax | 1 MHz |
Base Number Matches | 1 |
MM4026D | AM4027DM | MM5027N | AM5027DC | |
---|---|---|---|---|
描述 | Serial In Serial Out, 4000/14000/40000 Series, 1024-Bit, Right Direction, True Output, CMOS, CDIP16, HERMETIC SEALED, SIDE BRAZED, DIP-16 | Serial In Serial Out, 4000/14000/40000 Series, 2048-Bit, Right Direction, True Output, CMOS, CDIP8, HERMETIC SEALED, SIDE BRAZED, DIP-8 | Serial In Serial Out, 2048-Bit, Right Direction, True Output, CMOS, PDIP8, PLASTIC, DIP-8 | Serial In Serial Out, 2048-Bit, Right Direction, True Output, CMOS, CDIP8, HERMETIC SEALED, SIDE BRAZED, DIP-8 |
零件包装代码 | DIP | DIP | DIP | DIP |
包装说明 | DIP, DIP16,.3 | DIP, | DIP, | HERMETIC SEALED, SIDE BRAZED, DIP-8 |
针数 | 16 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
计数方向 | RIGHT | RIGHT | RIGHT | RIGHT |
JESD-30 代码 | R-CDIP-T16 | R-CDIP-T8 | R-PDIP-T8 | R-CDIP-T8 |
长度 | 20.32 mm | 13.208 mm | 9.779 mm | 13.208 mm |
负载电容(CL) | 15 pF | 15 pF | 15 pF | 15 pF |
逻辑集成电路类型 | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT |
位数 | 1024 | 2048 | 2048 | 2048 |
功能数量 | 2 | 1 | 1 | 1 |
端子数量 | 16 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
最小 fmax | 1 MHz | 1 MHz | 3 MHz | 3 MHz |
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