Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> KS512MRT-806C

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KS512MRT-806C: 产品描述Flash Memory Drive, CMOS, PBGA52, 23 X 21 MM, BGA-52; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小604KB，共30页; 制造商Cactus Technologies

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KS512MRT-806C概述

Flash Memory Drive, CMOS, PBGA52, 23 X 21 MM, BGA-52

KS512MRT-806C规格参数

参数名称	属性值
包装说明	BGA,
Reach Compliance Code	unknown
其他特性	SEATED HT-CALCULATED
外部数据总线宽度	2
主机数据传输速率最大值	20 MBps
JESD-30 代码	R-PBGA-B52
长度	23 mm
端子数量	52
最高工作温度	85 °C
最低工作温度	-25 °C
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY
座面最大高度	2.75 mm
最大供电电压	3.6 V
最小供电电压	2.7 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子形式	BALL
端子节距	2 mm
端子位置	BOTTOM
宽度	21 mm
uPs/uCs/外围集成电路类型	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
Base Number Matches	1

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Industrial Grade

-806 Series

SD Card and SDChip™

Product Manual

Corporate Headquarters

Suite C, 15/F, Capital Trade Center

62 Tsun Yip Street, Kwun Tong

Kowloon, Hong Kong

Cactus Technologies Limited

Industrial Grade -806 SD Card & SDChip

Product Manaul

v2.1

The information in this manual is believed to be accurate at the time of publication but is subject to change without notice.

Cactus Technologies Limited shall not be liable for technical or editorial errors or omissions contained herein; nor for

incidental or consequential damages resulting from the furnishing, performance, or use of this material.

Cactus Technologies

makes no warranty, representation or guarantee regarding the suitability of its products for any particular

purpose, nor does Cactus Technologies

assume any liability arising out of the application or use of its products, and

specifically disclaims any and all liability, including without limitation consequential or incidental damages.

Cactus Technologies

products are not designed, intended or authorized for use as components in systems intended for surgical

implant into the body or in other applications intended to support or sustain life or for any application where the failure of a

Cactus Technologies

product can result in personal injury or death. Users of Cactus Technologies

products for such

unintended and unauthorized applications shall assume all risk of such use and shall indemnify and hold Cactus

Technologies

and its officers, employees, subsidiaries, affiliates and distributors harmless against all claims, costs, damages,

expenses and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such

unintended and unauthorized use, even if such claim alleges that Cactus Technologies

was negligent regarding the design or

manufacture of the part.

All parts of the Cactus Technologies

documentation are protected by copyright law and all rights are reserved. This

documentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any electronic

medium or machine-readable form without prior consent, in writing, from Cactus Technologies, Limited.

Cactus Technologies

and the Cactus logo are registered trademarks of Cactus Technologies Limited.

Cactus Technologies Limited

Industrial Grade -806 SD Card & SDChip

Product Manaul

v2.1

KS512MRT-806C相似产品对比

	KS512MRT-806C	KS512MRT-806	KS256MRT-806C	KS256MRT-806	KS128MRT-806	KS128MRT-806C
描述	Flash Memory Drive, CMOS, PBGA52, 23 X 21 MM, BGA-52	Flash Memory Drive, CMOS, PACKAGE-9	Flash Memory Drive, CMOS, PBGA52, 23 X 21 MM, BGA-52	Flash Memory Drive, CMOS, PACKAGE-9	Flash Memory Drive, CMOS, PACKAGE-9	Flash Memory Drive, CMOS, PBGA52, 23 X 21 MM, BGA-52
包装说明	BGA,	DIE,	BGA,	DIE,	DIE,	BGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
外部数据总线宽度	2	4	2	4	4	2
主机数据传输速率最大值	20 MBps	20 MBps	20 MBps	20 MBps	20 MBps	20 MBps
JESD-30 代码	R-PBGA-B52	R-XUUC-N9	R-PBGA-B52	R-XUUC-N9	R-XUUC-N9	R-PBGA-B52
长度	23 mm	32 mm	23 mm	32 mm	32 mm	23 mm
端子数量	52	9	52	9	9	52
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
封装主体材料	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY
封装代码	BGA	DIE	BGA	DIE	DIE	BGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY	UNCASED CHIP	GRID ARRAY	UNCASED CHIP	UNCASED CHIP	GRID ARRAY
座面最大高度	2.75 mm	2.25 mm	2.75 mm	2.25 mm	2.25 mm	2.75 mm
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子形式	BALL	NO LEAD	BALL	NO LEAD	NO LEAD	BALL
端子位置	BOTTOM	UPPER	BOTTOM	UPPER	UPPER	BOTTOM
宽度	21 mm	24 mm	21 mm	24 mm	24 mm	21 mm
uPs/uCs/外围集成电路类型	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
Base Number Matches	1	1	1	1	1	1

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