Standard SRAM, 32KX8, 10ns, CMOS, PDSO28,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | compliant |
| 最长访问时间 | 10 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 8 |
| 端子数量 | 28 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP28,.53,22 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.01 A |
| 最小待机电流 | 4.5 V |
| 最大压摆率 | 0.17 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.55 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| AP9A128-10TC | AP9A128-10VI | AP9A128-8TC | AP9A128-10VC | AP9A129-10TC | AP9A128-8VC | AP9A129-8TC | |
|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28, | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28, | Standard SRAM, 32KX8, 8ns, CMOS, PDSO28, | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28, | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28, | Standard SRAM, 32KX8, 8ns, CMOS, PDSO28, | Standard SRAM, 32KX8, 8ns, CMOS, PDSO28, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最长访问时间 | 10 ns | 10 ns | 8 ns | 10 ns | 10 ns | 8 ns | 8 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-G28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOJ | LSOP | SOJ | LSOP | SOJ | TSSOP |
| 封装等效代码 | TSSOP28,.53,22 | SOJ28,.4 | TSSOP28,.53,22 | SOJ28,.4 | TSSOP28,.53,22 | SOJ28,.4 | TSSOP28,.53,22 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.01 A | 0.025 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
| 最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | 0.17 mA | 0.19 mA | 0.17 mA | 0.17 mA | 0.17 mA | 0.17 mA | 0.17 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | J BEND | GULL WING | J BEND | GULL WING | J BEND | GULL WING |
| 端子节距 | 0.55 mm | 1.27 mm | 0.055 mm | 1.27 mm | 0.055 mm | 1.27 mm | 0.55 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| 包装说明 | - | - | TSOP-28 | SOP-28 | TSOP-28 | SOP-28 | - |
| 长度 | - | - | 11.8 mm | 17.907 mm | 11.8 mm | 17.907 mm | - |
| 功能数量 | - | - | 1 | 1 | 1 | 1 | - |
| 座面最大高度 | - | - | 1.2 mm | 3.556 mm | 1.2 mm | 3.556 mm | - |
| 最大供电电压 (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 宽度 | - | - | 7.95 mm | 7.518 mm | 7.95 mm | 7.518 mm | - |
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