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TSS901EMCP883

产品描述Serial I/O Controller, 3 Channel(s), 25MBps, CMOS, DIE
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小602KB,共28页
制造商Atmel (Microchip)
下载文档 详细参数 全文预览

TSS901EMCP883概述

Serial I/O Controller, 3 Channel(s), 25MBps, CMOS, DIE

TSS901EMCP883规格参数

参数名称属性值
零件包装代码DIE
包装说明DIE,
Reach Compliance Codeunknown
地址总线宽度8
边界扫描YES
最大时钟频率25 MHz
最大数据传输速率25 MBps
外部数据总线宽度32
JESD-30 代码X-XUUC-N
低功率模式YES
串行 I/O 数3
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料UNSPECIFIED
封装代码DIE
封装形状UNSPECIFIED
封装形式UNCASED CHIP
认证状态Not Qualified
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式NO LEAD
端子位置UPPER
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches1

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TSS901E
Intelligent and Flexible IEEE 1355 communication
controller for space
Description and Applications
The TSS901E provides an interface between a Data-
Strobe link - according to the IEEE Std 1355-1995
specification carrying a simple interprocessor
communication protocol - and a data processing node
consisting of a CPU and a communication and data
memory.
The TSS901E offers hardware supported execution of
the major parts of the interprocessor communication
protocol: data transfer between two nodes of a multi-
processor system is performed with minimal host CPU
intervention. The TSS901E can execute simple
commands to provide basic features for system control
functions; a provision of fault tolerant features exists as
well.
Although the TSS901E initial exploitation is for use in
multi-processor systems where the high speed links
standardisation is an important issue and where reliability
is a requirement, it could be used in applications such
as heterogeneous systems or modules without any
communication feature like special image compression
chips, some signal processors, application specific
programmable logic or mass memory.
The TSS901E may also be used in single board systems
where standardised high speed interfaces are needed and
systems containing "non-intelligent" modules such as A/
D-converter or sensor interfaces which can be assembled
with the TSS901E thanks to the "control by link" feature.
Features
q
3 identical bidirectional link channels allowing full
duplex communication under selectable transmit rate
from 1.25 up to 200 Mbit/s in each direction
a COmmunication Memory Interface (COMI)
provides autonomous accesses to a communication
memory which are controlled by an arbitration unit,
allowing two TSS901E to share one Dual Port Ram
without external arbitration
the scalable databus width (8/16/32 bit) allows
flexible integration with any CPU type
little or big endian mode is configurable
a HOst Control Interface (HOCI) gives read/write
accesses to the TSS901E configuration registers and
to the DS-link channels for the controlling CPU
q
device control via one of the three links allows its
use in systems without a local controller
link disconnect detection and parity check at token
(data and control) level; possible checksum
generation for packet level check
power saving mode relying on automatic transmit
rate reduction
a user’s manual of the TSS901E (also called
SMCS332) is available at:
http://www.omimo.be/companies/dasa_000.htm
q
q
q
q
q
q
q
The information contained herein is subject to change without notice.
No responsibility is assumed by Atmel Wireless & Microcontrollers
for using this publication and/or circuits described herein : nor for
any possible infringements of patents or other rights of third parties
which may result from its use.
Rev. B - July 29, 1999
1
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