FR101G-FR107G
Technical Data
Data Sheet N0442, Rev. A
Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Amperes
FAST RECOVERY GLASS PASSIVATED RECTIFIERS
Features
FR101G THRU FR107G
DO-41
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
Fast switching for high efficiency
Low reverse leakage
High forward surge current capability
High temperature soldering guaranteed: 260 C/10
seconds,0.375”(9.5mm) lead length, 5 lbs. (2.3kg) tension
Glass passivated chip junction
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
Circuit Diagram
Mechanical Data
Case: JEDEC DO-41 molded plastic body
Terminals: Plated axial leads, solderable per
MIL-STD-202, Method 208
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.34 grams
Maximum Ratings and Electrical Characteristics
@T
A
=25°C unless otherwise specified
Characteristic
Maximum repetitive peak reverse voltage
Maximum DC blocking voltage
Maximum RMS voltage
Maximum average forward rectified current
0.375”(9.5mm) lead length at @T
A
=55°C
Peak forward surge current 8.3ms single half sine-
wave superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
At Rated DC Blocking Voltage
@T
A
= 25°C
@T
A
= 100°C
Symbol
V
RRM
V
DC
V
RMS
I
(AV)
I
FSM
V
F
I
RM
t
rr
C
J
R
θJA
T
J
, T
STG
150
15
40
-65 to +150
FR
FR
FR
101G 102G 103G
50
35
5
100
3
70
1
200
7
140
FR
104G
2
400
1
280
1.0
30
1.3
5.0
100
250
500
FR
105G
4
600
2
420
FR
FR
106G 107G
6
800
4
560
8
1000
5
700
Units
1
V
1
V
A
A
V
µA
ns
pF
°C/W
°C
Maximum reverse recovery time (Note 1)
Typical Junction Capacitance (Note 2)
Typical Thermal Resistance Junction to
Ambient (Note 3)
Operating junction and storage temperature range
Note: 1. Reverse recovery condition IF=0.5A, IR=1.0A, Irr=0.25A
2. Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3. Thermal resistance from junction to ambient at 0.375”(9.5mm)lead length, P.C.B. mounted
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FR101G-FR107G
Technical Data
Data Sheet N0442, Rev. A
Ratings and Characteristics Curves
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FR101G-FR107G
Technical Data
Data Sheet N0442, Rev. A
Mechanical Dimensions DO-41
SYMBOL
A
B
C
D
Millimeters
Min.
25.4
4.06
0.71
2.00
Max.
-
5.21
0.864
2.72
Inches
Min.
1.000
0.160
0.028
0.079
Max.
-
0.205
0.034
0.107
Ordering Information
Device
FR101G-FR107G
Marking Diagram
Shipping
5000pcs / tape
Where XXXXX is YYWWL
FR101G
SSG
YY
WW
L
= Part Name
= SSG
= Year
= Week
= Lot Number
Package
DO-41
(Pb-Free)
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
Cautions:Molding resin
Epoxy resin UL:94V-0
Carrier Tape Specification DO-41
Millimeters
Min.
4.50
50.9
-
5.60
-
-
SYMBOL
A
B
Z
T
E
IL1-L2I
Max.
5.50
53.9
1.20
6.40
0.80
1.0
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FR101G-FR107G
Technical Data
Data Sheet N0442, Rev. A
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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