Standard SRAM, 64KX1, 20ns, PDSO24, 0.300 INCH, SOJ-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | SOJ |
| 包装说明 | 0.300 INCH, SOJ-24 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 20 ns |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | R-PDSO-J24 |
| JESD-609代码 | e0 |
| 长度 | 15.88 mm |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 1 |
| 湿度敏感等级 | 3 |
| 负电源额定电压 | -4.5 V |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 组织 | 64KX1 |
| 输出特性 | OPEN-EMITTER |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ24,.34 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 电源 | -4.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.76 mm |
| 最大待机电流 | 0.00012 A |
| 最小待机电流 | 4.2 V |
| 最大压摆率 | 0.12 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| IDT100490S20Y | IDT100490S12P | IDT100490S10P | IDT100490S15P | IDT100490S20P | IDT100490S20D | IDT100490S8P | |
|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 64KX1, 20ns, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 64KX1, 12ns, PDIP22, 0.300 INCH, PLASTIC, DIP-22 | Standard SRAM, 64KX1, 10ns, PDIP22, 0.300 INCH, PLASTIC, DIP-22 | Standard SRAM, 64KX1, 15ns, PDIP22, 0.300 INCH, PLASTIC, DIP-22 | Standard SRAM, 64KX1, 20ns, PDIP22, 0.300 INCH, PLASTIC, DIP-22 | Standard SRAM, 64KX1, 20ns, CDIP22, 0.300 INCH, CERDIP-22 | Standard SRAM, 64KX1, 8ns, PDIP22, 0.300 INCH, PLASTIC, DIP-22 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOJ | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | 0.300 INCH, SOJ-24 | DIP, DIP22,.3 | DIP, DIP22,.3 | DIP, DIP22,.3 | DIP, DIP22,.3 | DIP, DIP22,.3 | DIP, DIP22,.3 |
| 针数 | 24 | 22 | 22 | 22 | 22 | 22 | 22 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 20 ns | 12 ns | 10 ns | 15 ns | 20 ns | 20 ns | 8 ns |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PDSO-J24 | R-PDIP-T22 | R-PDIP-T22 | R-PDIP-T22 | R-PDIP-T22 | R-GDIP-T22 | R-PDIP-T22 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 15.88 mm | 26.797 mm | 26.797 mm | 26.797 mm | 26.797 mm | 28.321 mm | 26.797 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 负电源额定电压 | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 22 | 22 | 22 | 22 | 22 | 22 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 组织 | 64KX1 | 64KX1 | 64KX1 | 64KX1 | 64KX1 | 64KX1 | 64KX1 |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | SOJ | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | SOJ24,.34 | DIP22,.3 | DIP22,.3 | DIP22,.3 | DIP22,.3 | DIP22,.3 | DIP22,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 电源 | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.76 mm | 4.191 mm | 4.191 mm | 4.191 mm | 4.191 mm | 5.08 mm | 4.191 mm |
| 最大待机电流 | 0.00012 A | 0.00012 A | 0.00012 A | 0.00012 A | 0.00012 A | 0.00012 A | 0.00012 A |
| 最小待机电流 | 4.2 V | 4.2 V | 4.2 V | 4.2 V | 4.2 V | 4.2 V | 4.2 V |
| 最大压摆率 | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA |
| 表面贴装 | YES | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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