Flash, 1MX16, 90ns, PBGA48, 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48 |
| 针数 | 48 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 90 ns |
| 启动块 | BOTTOM |
| 命令用户界面 | YES |
| 通用闪存接口 | YES |
| 数据轮询 | YES |
| JESD-30 代码 | R-PBGA-B48 |
| 长度 | 6 mm |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 部门数/规模 | 512 |
| 端子数量 | 48 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA48,6X11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.8 V |
| 编程电压 | 1.8 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.73 mm |
| 部门规模 | 2K |
| 最大待机电流 | 0.00004 A |
| 最大压摆率 | 0.025 mA |
| 最大供电电压 (Vsup) | 1.95 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 切换位 | YES |
| 类型 | NOR TYPE |
| 宽度 | 5 mm |
| Base Number Matches | 1 |
| SST39WF1601-90-4C-MBQE | SST39WF1601-90-4C-B3KE | SST39WF1601-90-4I-MBQE | SST39WF1601-90-4I-B3KE | SST39WF1602-90-4C-MBQE | SST39WF1602-90-4I-MBQE | |
|---|---|---|---|---|---|---|
| 描述 | Flash, 1MX16, 90ns, PBGA48, 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48 | Flash, 1MX16, 90ns, PBGA48, 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | Flash, 1MX16, 90ns, PBGA48, 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48 | Flash, 1MX16, 90ns, PBGA48, 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | Flash, 1MX16, 90ns, PBGA48, 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48 | Flash, 1MX16, 90ns, PBGA48, 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48 | 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48 | 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48 | 5 X 6 MM, ROHS COMPLIANT, MO-225, WFBGA-48 |
| 针数 | 48 | 48 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 90 ns | 90 ns | 90 ns | 90 ns | 90 ns | 90 ns |
| 启动块 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | TOP | TOP |
| 命令用户界面 | YES | YES | YES | YES | YES | YES |
| 通用闪存接口 | YES | YES | YES | YES | YES | YES |
| 数据轮询 | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
| 长度 | 6 mm | 8 mm | 6 mm | 8 mm | 6 mm | 6 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 部门数/规模 | 512 | 512 | 512 | 512 | 512 | 512 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C |
| 组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | TFBGA | VFBGA | TFBGA | VFBGA | VFBGA |
| 封装等效代码 | BGA48,6X11,20 | BGA48,6X8,32 | BGA48,6X11,20 | BGA48,6X8,32 | BGA48,6X11,20 | BGA48,6X11,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 编程电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.73 mm | 1.2 mm | 0.73 mm | 1.2 mm | 0.73 mm | 0.73 mm |
| 部门规模 | 2K | 2K | 2K | 2K | 2K | 2K |
| 最大待机电流 | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A |
| 最大压摆率 | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
| 最大供电电压 (Vsup) | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 切换位 | YES | YES | YES | YES | YES | YES |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 5 mm | 6 mm | 5 mm | 6 mm | 5 mm | 5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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