ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH DIRECTION CONTROL |
| 系列 | ACT |
| JESD-30 代码 | R-GDIP-T20 |
| 长度 | 24.51 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 74ACT245DC | 74ACT245MSAX | 74ACT245MSA | 74ACT245DCQR | |
|---|---|---|---|---|
| 描述 | ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO20, EIAJ, PLASTIC, SSOP-20 | ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO20, EIAJ, PLASTIC, SSOP-20 | ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 |
| 零件包装代码 | DIP | SSOP | SSOP | DIP |
| 包装说明 | DIP, | SSOP, SSOP20,.3 | SSOP, SSOP20,.3 | DIP, |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
| 系列 | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-GDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-GDIP-T20 |
| 长度 | 24.51 mm | 7.2 mm | 7.2 mm | 24.51 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | SSOP | SSOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE |
| 传播延迟（tpd） | 9 ns | 9 ns | 9 ns | 9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.05 mm | 2.05 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 0.65 mm | 0.65 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 5.3 mm | 5.3 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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