SN74HC379D3
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | SOP, SOP16,.25 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-PDSO-G16 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| SN74HC379D3 | SN74HC378D3 | SN74HC378NP3 | SN74HC379NP3 | SN74HC379N3 | SN74HC379J3 | SN74HC379J4 | SN74HC379JP4 | SN74HC378FN3 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SN74HC379D3 | SN74HC378D3 | SN74HC378NP3 | SN74HC379NP3 | SN74HC379N3 | SN74HC379J3 | SN74HC379J4 | SN74HC379JP4 | SN74HC378FN3 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | S-PQCC-J20 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 功能数量 | 4 | 6 | 6 | 4 | 4 | 4 | 4 | 4 | 6 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | DIP | DIP | DIP | DIP | DIP | DIP | QCCJ |
| 封装等效代码 | SOP16,.25 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 表面贴装 | YES | YES | NO | NO | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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