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TS68950CP

产品描述MODEM-SUPPORT CIRCUIT, PDIP24, PLASTIC, DIP-24
产品类别无线/射频/通信    电信电路   
文件大小509KB,共47页
制造商ST(意法半导体)
官网地址http://www.st.com/
下载文档 详细参数 选型对比 全文预览

TS68950CP概述

MODEM-SUPPORT CIRCUIT, PDIP24, PLASTIC, DIP-24

TS68950CP规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码DIP
包装说明PLASTIC, DIP-24
针数24
Reach Compliance Codenot_compliant
JESD-30 代码R-PDIP-T24
JESD-609代码e0
负电源额定电压-5 V
功能数量1
端子数量24
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP24,.6
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源+-5 V
认证状态Not Qualified
最大压摆率0.03 mA
标称供电电压5 V
表面贴装NO
技术CMOS
电信集成电路类型MODEM-SUPPORT CIRCUIT
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度15.24 mm
Base Number Matches1

文档预览

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TS75C96
V.32, V.29, V.27ter, V.22bis, V.22, V.23,
BELL 212A, BELL 103 MODEM CHIP SET
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ADVANCE DATA
CCITT V.32, V.22bis, V.22, V.21, V.23,
Bell 212A, Bell 103 COMPATIBLE MODEM
CHIP SET
CCITT V.29, V.27ter FOR FAX APPLICA-
TIONS
INTEGRATED IMPLEMENTATION ON THREE
DSP AND THREE MAFE CHIPS
FULL DUPLEX OPERATION FROM 9600 TO
300bps
FULL IMPLEMENTATION OF THE V.32 AND
V.22bis HANDSHAKE
V.29/4800bps AND V.27ter SHORT TRAIN SE-
QUENCES
DYNAMIC RANGE : 43dB
TWO SATELLITE HOPS AND FREQUENCY
OFFSET CAPABILITIES (10Hz) FOR THE
FAR END ECHO CANCELLER IN V.32 MODE
TRELLIS ENCODING AND VITERBI DECOD-
ING
12.5% ROLL-OFF RAISED COSINE TRANS-
MITTER PULSE SHAPING
HIGH PERFORMANCE PASSBAND FRAC-
TIONALLY SPACED ADAPTIVE EQUALIZER
SIGNAL QUALITY MONITORING
PARALLEL INTERFACE TO STANDARD MI-
CROPROCESSORS
SERIAL DATA TRANSMIT CAPABILITY
V.14 AND V.54 IMPLEMENTATION
LOW POWER MODE AVAILABLE (PLCC)
BIT RATE DATA CLOCKS PROVIDED FOR
SYNCHRONOUS DATA TRANSFER
FULL DIAGNOSTIC CAPABILITY
DTMF GENERATION
CALL PROGRESS TONE DETECTION
PROGRAMMABLE FILTERS FOR ”AUTO-
BAUD” IMPLEMENTATION
SOFTWARE LICENSE AND DEVELOPMENT
TOOLS AVAILABLE FOR EASY CUSTOMIZA-
TION
TOTAL POWER CONSUMPTION BELOW
1.5W
DESCRIPTION
The SGS-THOMSON Microelectronics TS75C96
chip set is a highly integrated modem engine, which
can operate in full duplex from 9600 to 300bps. The
modem hardware consists of three analog front
end (MAFE) chips, three DSP processor chips and
additionalmemory chips plus the V.14 serial output
converter.The three SGS-THOMSON analog front
end chips (TS68950/1/2)are the transmit interface,
the receive interface and the clock generator re-
spectively.The modem signal processing functions
are implemented on three ST18930 programmable
digital signal processors.
DIP24
(Plastic Package)
DIP28
(Plastic Package)
DIP48
(Plastic Package)
PLCC28
(Plastic Chip Carrier)
PLCC52
(Plastic Chip Carrier)
See Order Codes on Page 4
February 1995
This is advance information on a new product now in development or undergoing evaluation. Details are subject to change without no tice.
1/47

TS68950CP相似产品对比

TS68950CP TS7538CP TS75C960CFN-S TS75C960CP-S TS75C961CFN-S TS75C961CP-S TS75C962CP-S
描述 MODEM-SUPPORT CIRCUIT, PDIP24, PLASTIC, DIP-24 9.6kbps DATA, MODEM-SUPPORT CIRCUIT, PDIP28, PLASTIC, DIP-28 9.6kbps DATA, MODEM, PQCC52, PLASTIC, LCC-52 9.6kbps DATA, MODEM, PDIP48, PLASTIC, DIP-48 9.6kbps DATA, MODEM, PQCC52, PLASTIC, LCC-52 9.6kbps DATA, MODEM, PDIP48, PLASTIC, DIP-48 9.6kbps DATA, MODEM, PDIP48, PLASTIC, DIP-48
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 DIP DIP LCC DIP LCC DIP DIP
包装说明 PLASTIC, DIP-24 PLASTIC, DIP-28 PLASTIC, LCC-52 PLASTIC, DIP-48 PLASTIC, LCC-52 PLASTIC, DIP-48 PLASTIC, DIP-48
针数 24 28 52 48 52 48 48
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
JESD-30 代码 R-PDIP-T24 R-PDIP-T28 S-PQCC-J52 R-PDIP-T48 S-PQCC-J52 R-PDIP-T48 R-PDIP-T48
JESD-609代码 e0 e0 e0 e0 e0 e0 e0
功能数量 1 1 1 1 1 1 1
端子数量 24 28 52 48 52 48 48
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP DIP QCCJ DIP QCCJ DIP DIP
封装形状 RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE IN-LINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO YES NO YES NO NO
电信集成电路类型 MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT MODEM MODEM MODEM MODEM MODEM
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL QUAD DUAL QUAD DUAL DUAL
宽度 15.24 mm 15.24 mm 19.1262 mm 15.24 mm 19.1262 mm 15.24 mm 15.24 mm
其他特性 - DATA RATE MIN:300BPS DATA RATE MIN:300BPS DATA RATE MIN:300BPS DATA RATE MIN:300BPS DATA RATE MIN:300BPS DATA RATE MIN:300BPS
数据速率 - 9.6 Mbps 9.6 Mbps 9.6 Mbps 9.6 Mbps 9.6 Mbps 9.6 Mbps
厂商名称 - - ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体) ST(意法半导体)
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