FIFO, 512X18, 17ns, Synchronous, CMOS, CQFP68
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | QFP, QFP68(UNSPEC) |
Reach Compliance Code | unknown |
最长访问时间 | 17 ns |
最大时钟频率 (fCLK) | 20 MHz |
JESD-609代码 | e0 |
内存密度 | 9216 bit |
内存集成电路类型 | OTHER FIFO |
内存宽度 | 18 |
端子数量 | 68 |
字数 | 512 words |
字数代码 | 512 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 512X18 |
封装主体材料 | CERAMIC |
封装代码 | QFP |
封装等效代码 | QFP68(UNSPEC) |
封装形式 | FLATPACK |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.07 A |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子位置 | QUAD |
Base Number Matches | 1 |
PDM42215L50GM | PDM42205L20GM | PDM42205L15GM | PDM42225L15GM | PDM42215L15GM | PDM42215L25GM | PDM42215L30GM | |
---|---|---|---|---|---|---|---|
描述 | FIFO, 512X18, 17ns, Synchronous, CMOS, CQFP68 | FIFO, 256X18, 11ns, Synchronous, CMOS, CPGA68 | FIFO, 256X18, 9ns, Synchronous, CMOS, CPGA68 | FIFO, 1KX18, 9ns, Synchronous, CMOS, CQFP68 | FIFO, 512X18, 9ns, Synchronous, CMOS, CQFP68 | FIFO, 512X18, 13ns, Synchronous, CMOS, CQFP68 | FIFO, 512X18, 15ns, Synchronous, CMOS, CQFP68 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | QFP, QFP68(UNSPEC) | PGA, PGA68,11X11 | PGA, PGA68,11X11 | QFP, QFP68(UNSPEC) | QFP, QFP68(UNSPEC) | QFP, QFP68(UNSPEC) | QFP, QFP68(UNSPEC) |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 17 ns | 11 ns | 9 ns | 9 ns | 9 ns | 13 ns | 15 ns |
最大时钟频率 (fCLK) | 20 MHz | 50 MHz | 66.7 MHz | 66.7 MHz | 66.7 MHz | 40 MHz | 33 MHz |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
字数 | 512 words | 256 words | 256 words | 1024 words | 512 words | 512 words | 512 words |
字数代码 | 512 | 256 | 256 | 1000 | 512 | 512 | 512 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 512X18 | 256X18 | 256X18 | 1KX18 | 512X18 | 512X18 | 512X18 |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | QFP | PGA | PGA | QFP | QFP | QFP | QFP |
封装等效代码 | QFP68(UNSPEC) | PGA68,11X11 | PGA68,11X11 | QFP68(UNSPEC) | QFP68(UNSPEC) | QFP68(UNSPEC) | QFP68(UNSPEC) |
封装形式 | FLATPACK | GRID ARRAY | GRID ARRAY | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.07 A | 0.07 A | 0.07 A | 0.07 A | 0.07 A | 0.07 A | 0.07 A |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | PIN/PEG | PIN/PEG | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | QUAD | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | QUAD | QUAD |
内存密度 | 9216 bit | - | - | 18432 bit | 9216 bit | 9216 bit | 9216 bit |
Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
厂商名称 | - | Paradigm Technology Inc | Paradigm Technology Inc | - | Paradigm Technology Inc | Paradigm Technology Inc | Paradigm Technology Inc |
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