电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

KM736S849T-60

产品描述ZBT SRAM, 256KX36, 3.5ns, CMOS, PQFP100
产品类别存储    存储   
文件大小200KB,共18页
制造商SAMSUNG(三星)
官网地址http://www.samsung.com/Products/Semiconductor/
下载文档 详细参数 选型对比 全文预览

KM736S849T-60概述

ZBT SRAM, 256KX36, 3.5ns, CMOS, PQFP100

KM736S849T-60规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
包装说明QFP, QFP100,.63X.87
Reach Compliance Codeunknown
最长访问时间3.5 ns
最大时钟频率 (fCLK)166 MHz
I/O 类型COMMON
JESD-30 代码R-PQFP-G100
JESD-609代码e0
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度36
湿度敏感等级3
端子数量100
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX36
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码QFP
封装等效代码QFP100,.63X.87
封装形状RECTANGULAR
封装形式FLATPACK
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源2.5 V
认证状态Not Qualified
最大待机电流0.02 A
最小待机电流2.38 V
最大压摆率0.35 mA
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.635 mm
端子位置QUAD
处于峰值回流温度下的最长时间40
Base Number Matches1

文档预览

下载PDF文档
KM736S849
KM718S949
Document Title
256Kx36 & 512Kx18 Pipelined NtRAM
TM
256Kx36 & 512Kx18-Bit Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
History
1. Initial document.
1. Changed speed bin from 167MHz to 150MHz
2. Changed DC Parameters;
I
CC
: from 400mA to 450mA , ISB : from 60mA to 20mA
I
SB2
: from 50mA to 85mA
1. Changed speed bin from 150MHz to 167MHz
2. Changed Power from 3.3V to 2.5V
3. Changed N.C pins to Power and ZZ Pin #14, #16, #64, #66
4. Changed some control pin names.
from CEN to CKE, from BWEx to BWx
5. Modify absolute maximum ratings
V
DD
; from 4.0V to 3.6V, V
IN
; from 4.6V to 3.6V
6. Changed DC parameters
I
SB
; from 20mA to 80mA, I
SB2
; from 85mA to 10mA
V
OL
; from 0.4V to 0.2V, V
OH
; from 2.4V to 2.0V
V
IL
; from 0.8V to 0.7V, V
IH
; from 2.0V to 1.7V
7. A
DD
the sleep mode timing and characteristics
CKE controlled timing and CS controlled timing
1. Removed speed bin 167MHz
2.Changed AC parameters
t
HZOE
; from 4.0 to 3.5 , t
HZC
;from 4.0 to 3.5 at -75
t
HZOE
; from 5.0 to 3.5 , t
HZC
;from 5.0 to 3.5 , t
CL/H
; 4.0 to 3.0 at -10
3.Modify Sleep Mode Waveform.
Changed Sleep Mode Electrical Characteristics .
t
PDS
;from Max 2cycle to Min 2cycle
t
PUS
; from Max 2cycle to Min 2cycle
1.Modify from ADV to ADV at timing.
2.A
DD
the Trade Mark( NtRAM
TM
)
1. Changed DC parameters
I
SB1
; from 10mA to 20mA, I
SB2
; from 10mA to 20mA
1. Changed t
CD
,t
OE
from 4.0ns to 4.2ns at -75.
1. Changed DC condition at Icc and parameters
I
CC
; from 420mA to 320mA at -67 , from 370mA to 300mA at -75
from 300mA to 250mA at -10.
I
SB
; from 70mA to 60mA at -67 , from 60mA to 50mA at -75
from 50mA to 40mA at -10.
1.Changed V
OL
Max value from 0.2V to 0.4V .
1. Add 119BGA(7x17 Ball Grid Array Package) .
1. Final spec release
1. Add t
CYC
167Mhz.
Draft Date
September. 1997
November. 1997
Remark
Preliminary
Preliminary
0.2
March. 11. 1998
Preliminary
0.3
April. 11. 1998
Preliminary
0.4
June. 02. 1998
Preliminary
0.5
Aug. 19. 1998
Preliminary
0.6
0.7
Sep. 28. 1998
Nov. 10. 1998
Preliminary
Preliminary
0.8
0.9
1.0
2.0
Dec. 23. 1998
Mar. 03. 1999
April. 01. 1999
Oct. 30. 1999
Preliminary
Preliminary
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
November 1999
Rev 3.0

KM736S849T-60相似产品对比

KM736S849T-60 KM718S949T-60
描述 ZBT SRAM, 256KX36, 3.5ns, CMOS, PQFP100 ZBT SRAM, 512KX18, 3.5ns, CMOS, PQFP100
是否无铅 含铅 含铅
是否Rohs认证 不符合 不符合
包装说明 QFP, QFP100,.63X.87 QFP, QFP100,.63X.87
Reach Compliance Code unknown unknown
最长访问时间 3.5 ns 3.5 ns
最大时钟频率 (fCLK) 166 MHz 166 MHz
I/O 类型 COMMON COMMON
JESD-30 代码 R-PQFP-G100 R-PQFP-G100
JESD-609代码 e0 e0
内存密度 9437184 bit 9437184 bit
内存集成电路类型 ZBT SRAM ZBT SRAM
内存宽度 36 18
湿度敏感等级 3 3
端子数量 100 100
字数 262144 words 524288 words
字数代码 256000 512000
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C
组织 256KX36 512KX18
输出特性 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QFP QFP
封装等效代码 QFP100,.63X.87 QFP100,.63X.87
封装形状 RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLATPACK
并行/串行 PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260
电源 2.5 V 2.5 V
认证状态 Not Qualified Not Qualified
最大待机电流 0.02 A 0.02 A
最小待机电流 2.38 V 2.38 V
最大压摆率 0.35 mA 0.35 mA
标称供电电压 (Vsup) 2.5 V 2.5 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING
端子节距 0.635 mm 0.635 mm
端子位置 QUAD QUAD
处于峰值回流温度下的最长时间 40 40

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 928  250  1756  2852  36  49  20  38  59  51 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved