SBYV26C
Vishay Semiconductors
Glass Passivated Ultrafast Rectifier
Major Ratings and Characteristics
I
F(AV)
V
RRM
I
FSM
t
rr
V
F
T
j
max.
1.0 A
600 V
30 A
30 ns
1.3 V
175 °C
®
*Glass Encapsulation
technique is covered by
Patent No. 3,996,602,
brazed-lead assembly
to Patent No. 3,930,306
*
nted
Pate
DO-204AL (DO-41)
Features
•
•
•
•
•
•
•
•
•
Cavity-free glass-passivated junction
Ideal for printed circuit boards
Ultrafast reverse recovery time
Low forward voltage drop
Low leakage current
Low switching losses, high efficiency
High forward surge capability
Meets environmental standard MIL-S-19500
Solder Dip 260 °C, 40 seconds
Mechanical Data
Case:
DO-204AL, molded plastic over glass body
Epoxy meets UL-94V-0 Flammability rating
Terminals:
Matte tin plated leads, solderable per
J-STD-002B and JESD22-B102D
E3 suffix for commercial grade
Polarity:
Color band denotes cathode end
Typical Applications
For use in high frequency rectification and freewheel-
ing application in switching mode converters and
inverters for consumer, computer and Telecommuni-
cation
Maximum Ratings
T
A
= 25 °C unless otherwise specified
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 0.375" (9.5 mm)
lead length at T
L
= 85 °C (See Fig. 1)
Peak forward surge current 10 ms single half sine-wave
superimposed on rated load
Non repetitive peak reverse energy
(1)
Operating junction and storage temperature range
Notes: (1) Peak reverse energy measured with 8/20 µs surge
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
E
RSM
T
J
, T
STG
Value
600
420
600
1.0
30
5.0
- 65 to + 175
Unit
V
V
V
A
A
mJ
°C
Document Number 88735
22-Jul-05
www.vishay.com
1
SBYV26C
Vishay Semiconductors
Electrical Characteristics
T
A
= 25 °C unless otherwise specified
Parameter
Minimum avalanche
breakdown voltage
Maximum instantaneous
forward voltage
Maximum DC reverse current
at rated DC blocking voltage
Max. reverse recovery time
Maximum junction
capacitance
Maximum reverse recovery
current slope
at 100 µA
at 1.0 A
T
J
= 25 °C
T
J
= 175 °C
T
A
= 25 °C
T
A
= 165 °C
at I
F
= 0.5 A, I
R
= 1.0 A, I
rr
= 0.25 A
at 4.0 V, 1 MHz
at I
F
= 1 A, V
R
= 30 V, di
f
/dt = - 1 A/µs
Test condition
Symbol
V
BR
V
F
I
R
t
rr
C
J
di
r
/dt
Value
600
2.5
1.3
5.0
150
30
45
7.0
Unit
V
V
µA
ns
pF
A/µs
Thermal Characteristics
T
A
= 25 °C unless otherwise specified
Parameter
Typical thermal resistance
(1,2)
Notes:
(1) Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, mounted on P.C.B.
with 0.5 x 0.5" (12 x 12 mm) copper pads
(2) Thermal resistance from junction to lead at 0.375" (9.5 mm) lead length with both leads attached to heatsink
Symbol
R
θJA
R
θJL
Value
70
16
Unit
°C/W
Ratings and Characteristics Curves
(T
A
= 25
°C
unless otherwise noted)
1.2
100
Lead mounted on
heatsink
Average Forward Rectified Current (A)
1.0
0.8
T
A
0.6
Peak Forward Surge Current (A)
T
L
T
J
= T
J
max.
10ms Single Half Sine-Wave
10
0.4
Mounted on P.C.B.
0.2
0
0
25
50
75
100
125
150
175
1
1
10
100
Temperature (°C)
Number of Cycles at 50 H
Z
Figure 1. Maximum Forward Current Derating Curve
Figure 2. Maximum Non-Repetitive Peak Forward Surge Current
www.vishay.com
2
Document Number 88735
22-Jul-05
SBYV26C
Vishay Semiconductors
100
100
T
J
= 25°C
f = 1.0 MH
Z
Vsig = 50mVp-p
Instantaneous Forward Current (A)
10
T
J
= 165°C
T
J
= 125°C
Junction Capacitance (pF)
1
10
T
J
= 25°C
0.1
Pulse Width = 300
μs
1% Duty Cycle
0.01
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1
0.1
1
10
100
Instantaneous Forward Voltage (V)
Reverse Voltage (V)
Figure 3. Typical Instantaneous Forward Characteristics
Figure 5. Typical Junction Capacitance
Instantaneous Reverse Leakage Current
(μA)
100
100
10
T
J
= 165°C
1
T
J
= 125°C
Transient Thermal Impedance (°C/W)
80
100
10
0.1
0.01
T
J
= 25°C
0.001
0
20
40
60
1
0.01
0.1
1
10
100
Percent of Rated Peak Reverse Voltage (%)
t, Pulse Duration (sec.)
Figure 4. Typical Reverse Leakage Characteristics
Figure 6. Typical Transient Thermal Impedance
Package outline dimensions in inches (millimeters)
DO-204AL (DO-41)
1.0 (25.4)
MIN.
0.107 (2.7)
0.080 (2.0)
DIA.
0.205 (5.2)
0.160 (4.1)
1.0 (25.4)
MIN.
0.034 (0.86)
0.028 (0.71)
DIA.
Document Number 88735
22-Jul-05
www.vishay.com
3
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