6N134,* 81028, HCPL-563X, HCPL-663X,
HCPL-565X, 5962-98001, HCPL-268K,
HCPL-665X, 5962-90855, HCPL-560X
Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers
Data Sheet
*See matrix for available extensions.
Description
These units are single, dual and quad channel, hermeti-
cally sealed optocouplers. The products are capable of
operation and storage over the full military temperature
range and can be purchased as either standard product
or with full MIL-PRF-38534 Class Level H or K testing or
from the appropriate DLA Drawing. All devices are man-
ufactured and tested on a MIL-PRF-38534 certified line
and are included in the DLA Qualified Manufacturers
List QML-38534 for Hybrid Microcircuits. Quad channel
devices are available by special order in the 16 pin DIP
through hole packages.
Features
Dual marked with device part number and DLA
drawing number
Manufactured and tested on a MIL-PRF-38534
Certified Line
QML-38534, Class H and K
Five hermetically sealed package configurations
Performance guaranteed over full military
temperature range: -55°C to +125°C
High speed: 10 Mbd typical
CMR: > 10,000 V/μs typical
1500 Vdc withstand test voltage
2500 Vdc withstand test voltage for HCPL-565X
High radiation immunity
6N137, HCPL-2601, HCPL-2630/31 function
compatibility
Reliability data
TTL circuit compatibility
Functional Diagram
V
CC
V
E
V
OUT
GND
Applications
Multiple channel devices available
Truth Table
(Positive Logic)
Multichannel Devices
Input
On (H)
Off (L)
Output
L
H
Single Channel DIP
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
L
H
H
H
Military and aerospace
High reliability systems
Transportation, medical, and life critical systems
Line receiver
Voltage level shifting
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Isolation for computer, communication, and test
equipment systems
The connection of a 0.1 μF bypass capacitor between V
CC
and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Each channel contains a GaAsP light emitting diode
which is optically coupled to an integrated high speed
photon detector. The output of the detector is an open
collector Schottky clamped transistor. Internal shields
provide a guaranteed common mode transient immuni-
ty specification of 1000 V/μs. For Isolation Voltage appli-
cations requiring up to 2500 Vdc, the HCPL-5650 family is
also available. Package styles for these parts are 8 and 16
pin DIP through hole (case outlines P and E respectively),
and 16 pin surface mount DIP flat pack (case outline F),
leadless ceramic chip carrier (case outline 2). Devices
may be purchased with a variety of lead bend and plat-
ing options. See Selection Guide Table for details. Stan-
dard Microcircuit Drawing (SMD) parts are available for
each package and lead style.
Because the same electrical die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operating conditions, electrical specifications, and per-
formance characteristics shown in the figures are iden-
tical for all parts. Occasional exceptions exist due to
package variations and limitations, and are as noted.
Additionally, the same package assembly processes and
materials are used in all devices. These similarities give
justification for the use of data obtained from one part
to represent other parts’ performance for reliability and
certain limited radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Withstand Test Voltage
Avago Part # & Options
16 Pin DIP
2
V
CC
, GND
1500 Vdc
6N134
[1]
6N134/883B
HCPL-268K
Gold Plate
Option #200
Option #100
Option #300
None
8102801EC
8102801EA
8102801UC
8102801UA
8102801TA
5962-
9800101KEC
9800101KEA
9800101KUC
9800101KUA
9800101KTA
8 Pin DIP
1
None
1500 Vdc
HCPL-5600
HCPL-5601
HCPL-560K
Gold Plate
Option #200
Option #100
Option #300
5962-
9085501HPC
9085501HPA
9085501HYC
9085501HYA
9085501HXA
5962-
9085501KPC
9085501KPA
9085501KYC
9085501KYA
9085501KXA
8 Pin DIP
2
V
CC
, GND
1500 Vdc
HCPL-5630
HCPL-5631
HCPL-563K
Gold Plate
Option #200
Option #100
Option #300
None
8102802PC
8102802PA
8102802YC
8102802YA
8102802ZA
5962-
9800102KPC
9800102KPA
9800102KYC
9800102KYA
9800102KZA
8 Pin DIP
2
V
CC
, GND
2500 Vdc
HCPL-5650
HCPL-5651
Gold Plate
Option #200
16 Pin Flat Pack
4
V
CC
, GND
1500 Vdc
HCPL-6650
HCPL-6651
HCPL-665K
Gold Plate
20 Pad LCCC
2
None
1500 Vdc
HCPL-6630
HCPL-6631
HCPL-663K
Solder Pads*
Through Hole Through Hole Through Hole Through Hole Unformed Leads Surface Mount
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped*
Butt Cut/Gold Plate
Gull Wing/Soldered*
Class H SMD Part #
Prescript for all below
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
None
8102805PC
8102805PA
None
8102804FC
81028032A
None
Class K SMD Part #
Prescript for all below
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
*Solder contains lead.
Note:
1. JEDEC registered part.
5962-
9800104KFC
9800103K2A
5962-
2
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
1
2
3
4
5
6
7
8
GND
V
O2
V
CC
V
O1
16
15
14
13
12
11
10
9
3
4
1
2
V
CC
V
E
V
OUT
8
7
6
5
1
2
3
4
V
CC
V
O1
V
O2
8
7
6
5
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
2
3
4
5
6
7
8
V
CC
V
O1
V
O2
V
O3
V
O4
GND
16
15
14
13
12
11
10
9
20 Pad LCCC
Surface Mount
2 Channels
15
V
CC2
19
20
2
3
GND
1
7
8
V
O2
GND
2
V
O1
V
CC1
13
12
10
GND
GND
Note:
All DIP and flat pack devices have common V
CC
and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic chip carrier)
package has isolated channels with separate V
CC
and ground connections. All diagrams are “top view.”
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
0.51 (0.020)
MIN.
;;;;;
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
2.29 (0.090)
2.79 (0.110)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
8.13 (0.320)
MAX.
4.45 (0.175)
MAX.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
Leaded Device Marking
Avago LOGO
Avago P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
* 50434
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE
[1]
* QUALIFIED PARTS ONLY
Leadless Device Marking
Avago LOGO
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
* XXXX
XXXXXX
XXX 50434
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
DLA SMD
[1]
DLA SMD
[1]
Avago CAGE CODE
[1]
* QUALIFIED PARTS ONLY
Notes
1. Qualified parts only
3
Outline Drawings (continued)
8 Pin DIP Through Hole, 1 and 2 Channels
8 Pin DIP Through Hole, 2 Channels
2500 Vdc Withstand Test Voltage
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
5.08 (0.200)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
7.36 (0.290)
7.87 (0.310)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
16 Pin Flat Pack, 4 Channels
20 Terminal LCCC Surface Mount, 2 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.78 (0.070)
2.03 (0.080)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
11.13 (0.438)
10.72 (0.422)
1.27 (0.050)
REF.
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.64
(0.025)
(20 PLCS)
0.51 (0.020)
1.78 (0.070)
2.03 (0.080)
0.46 (0.018)
0.36 (0.014)
2.85 (0.112)
MAX.
8.13 (0.320)
MAX.
0.31 (0.012)
0.23 (0.009)
1.52 (0.060)
2.03 (0.080)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
0.88 (0.0345)
MIN.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
4
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available
on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel prod-
uct in 8 and 16 pin DIP. DLA Drawing part numbers contain provisions for lead finish. All leadless chip carrier
devices are delivered with solder dipped terminals as a standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is avail-
able on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This option has
solder dipped leads.
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
300
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
1.07 (0.042)
1.32 (0.052)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Solder contains lead.
5
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