ADC Subsystem, 4-Bit, 1 Func, Parallel, 4 Bits Access, Bipolar, CDIP16,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | unknown |
| 最大模拟输入电压 | |
| 最小模拟输入电压 | -1 V |
| 转换器类型 | ADC SUBSYSTEM |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 1.6% |
| 标称负供电电压 | -5.2 V |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY, COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT |
| 输出格式 | PARALLEL, 4 BITS |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5,-5.2 V |
| 认证状态 | Not Qualified |
| 采样速率 | 25 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 筛选级别 | 38535Q/M;38534H;883B |
| 最大压摆率 | 65 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| TDC1044B9V | TDC1044B9C | TDC1044N9C | |
|---|---|---|---|
| 描述 | ADC Subsystem, 4-Bit, 1 Func, Parallel, 4 Bits Access, Bipolar, CDIP16, | ADC Subsystem, 4-Bit, 1 Func, Parallel, 4 Bits Access, Bipolar, CDIP16, | ADC Subsystem, 4-Bit, 1 Func, Parallel, 4 Bits Access, Bipolar, PDIP16, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknow |
| 最小模拟输入电压 | -1 V | -1 V | -1 V |
| 转换器类型 | ADC SUBSYSTEM | ADC SUBSYSTEM | ADC SUBSYSTEM |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 |
| 最大线性误差 (EL) | 1.6% | 1.6% | 1.6% |
| 标称负供电电压 | -5.2 V | -5.2 V | -5.2 V |
| 位数 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY, COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT | BINARY, 2'S COMPLEMENT BINARY, COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT | BINARY, 2\'S COMPLEMENT BINARY, COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT |
| 输出格式 | PARALLEL, 4 BITS | PARALLEL, 4 BITS | PARALLEL, 4 BITS |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 25 MHz | 25 MHz | 25 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE |
| 最大压摆率 | 65 mA | 50 mA | 50 mA |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | - |
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