Exceeding any one of these limits in continuous operation may reduce the mean-time- to-failure below the design goal.
2.
Exceeding any one of these limits may cause permanent damage.
BIN SELECTION
BIN#
IDSS
(mA)
1
300-
350
2
350-
400
3
400-
450
4
450-
500
5
500-
550
6
550-
600
BIN ACCURACY STATEMENT:
Due to the effects of temperature, dc loading and probe tip varnishing, the IDSS from the “on wafer” probing of any MwT
device may differ After it has been attached to a proper heat sink and tested in an RF or DC circuit. Because of the aforementioned effects, the IDSS
distribution may deviate as much as +/- 1 bin within the range identified on the label of Each die shipping container, and +/- 2 bins within the selected range.
ORDERING INFORMATION:
CHIP
– Model Number MwT-PH16A
When placing order or inquiring, please specify BIN range, wafer number, if known, and visual screening level required. For details of BIN Selection and Safe
Handling Procedure please see supplementary information in available PDF on our website
www.mwtinc.com.
Contact factory for availability of packages.
MicroWave Technology, Inc. an IXYS Company, 4268 Solar Way, Fremont, CA 94538