电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

GS81302T18GE-167T

产品描述DDR SRAM, 8MX18, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
产品类别存储    存储   
文件大小541KB,共36页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
标准  
下载文档 详细参数 全文预览

GS81302T18GE-167T概述

DDR SRAM, 8MX18, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

GS81302T18GE-167T规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码BGA
包装说明15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间0.5 ns
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B165
JESD-609代码e1
长度17 mm
内存密度150994944 bit
内存集成电路类型DDR SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量165
字数8388608 words
字数代码8000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织8MX18
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度15 mm
Base Number Matches1

文档预览

下载PDF文档
Preliminary
GS81302T08/09/18/36E-333/300/250/200/167
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• Simultaneous Read and Write SigmaDDR™ Interface
• Common I/O bus
• JEDEC-standard pinout and package
• Double Data Rate interface
• Byte Write (x36 and x18) and Nybble Write (x8) function
• Burst of 2 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation with self-timed Late Write
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with present 9Mb, 18Mb, 36Mb and 72Mb
devices
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
144Mb SigmaDDR
TM
-II
Burst of 2 SRAM
333 MHz–167 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
Bottom View
165-Bump, 15 mm x 17 mm BGA
1 mm Bump Pitch, 11 x 15 Bump Array
clock inputs, not differential inputs. If the C clocks are tied
high, the K clocks are routed internally to fire the output
registers instead.
Common I/O x36 and x18 SigmaDDR-II B2 RAMs always
transfer data in two packets. When a new address is loaded, A0
presets an internal 1 bit address counter. The counter
increments by 1 (toggles) for each beat of a burst of two data
transfer.
Common I/O x8 and x9 SigmaDDR-II B2 RAMs always
transfer data in two packets. When a new address is loaded,
the LSB is internally set to 0 for the first read or write transfer,
and incremented by 1 for the next transfer. Because the LSB
is tied off internally, the address field of a x8/x9 SigmaDDR-II
B4 RAM is always one address pin less than the advertised
index depth (e.g., the 16M x 8 has a 8M addressable index).
SigmaDDR™ Family Overview
The GS81302T08/09/18/36E are built in compliance with the
SigmaDDR-II SRAM pinout standard for Common I/O
synchronous SRAMs. They are 150,994,944-bit (144Mb)
SRAMs. The GS81302T08/09/18/36E SigmaDDR-II SRAMs
are just one element in a family of low power, low voltage
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
Clocking and Addressing Schemes
The GS81302T08/09/18/36E SigmaDDR-II SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and
C clock inputs. C and C are also independent single-ended
Parameter Synopsis
-333
tKHKH
tKHQV
3.0 ns
0.45 ns
-300
3.3 ns
0.45 ns
-250
4.0 ns
0.45 ns
-200
5.0 ns
0.45 ns
-167
6.0 ns
0.5 ns
Rev: 1.01a 6/2010
1/36
© 2007, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
SM2091E你们都用上了吗?效果怎样?
本帖最后由 钲铭科低功耗IC 于 2018-1-18 09:26 编辑 SM2091E你们都用上了吗?效果怎样? 随着IC的工艺技术不断进步,高压线性恒流驱动IC的稳定性已有了很大的提升。不但在 ......
钲铭科低功耗IC LED专区
TMS3705
最近在用TMS3705做读卡器! 有那位大侠用过这款芯片的啊!给小弟弟我指导指导,我跟本不知道他是怎么读卡的,数据已什么形式送到MCU? 球大侠给点资料...
lnhjsdf 微控制器 MCU
请问画高频电路pcb用什么软件好,还要注意什么?
老师数protell99画高频不好!...
流茫 PCB设计
ADI 最受欢迎的10款参考电路
如题,每款的具体介绍可见→https://ezchina.analog.com/thread/14817 Top 1:基于 16 位 8 通道DAS AD7606 的可扩展多通道 同步采样数据采集系统(DAS)的布局考虑此电路详细介绍针对采用多个 ......
春之歌 模拟电子
TI 公司DSP产品相关FAQ整理
问:请TI公司的DSP技术专家GeorgeShen先生和AccountManager王剑先生做一下自我介绍。(10:36:50 AM)答:大家好,这里是TI公司的盛戎华、王剣,很高兴和大家一起讨论TI的DSP产品。 Good morning! He ......
呱呱 DSP 与 ARM 处理器
噪音放大的各种原因
噪音放大原因➀ 与其他元件接触 在高密度贴装有多个电子元件及设备的电源电路基板中,若电感器与其他元件接触,则电感器的微小振动将会被放大,从而会听到啸叫。 噪音放大原因& ......
fish001 模拟与混合信号

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 48  2568  2347  1011  1111  1  52  48  21  23 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved