SN54HC125WR概述

HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, DFP-14

SN54HC125WR规格参数

参数名称	属性值
零件包装代码	DFP
包装说明	DFP,
针数	14
Reach Compliance Code	unknown
系列	HC/UH
JESD-30 代码	R-GDFP-F14
长度	9.21 mm
负载电容（CL）	150 pF
逻辑集成电路类型	BUS DRIVER
位数	1
功能数量	4
端口数量	2
端子数量	14
最高工作温度	125 °C
最低工作温度	-55 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DFP
封装形状	RECTANGULAR
封装形式	FLATPACK
传播延迟（tpd）	225 ns
认证状态	Not Qualified
座面最大高度	2.03 mm
最大供电电压 (Vsup)	6 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL
宽度	6.29 mm
Base Number Matches	1

SN54HC125WR相似产品对比

	SN54HC125WR	SN74HC125N-00	SN74HC125DBLE	SN54HC125FK-00	SN54HC125FKR	SN54HC125FK	SN74HC125N-10	ACT381T-42700KAFIBXXZL	SN74HC125IDRQ1	74HC125N
描述	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, DFP-14	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDIP14	Quadruple Bus Buffer Gates With 3-State Outputs 14-SSOP -40 to 85	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDIP14	TCXO	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, SOIC-14	DRIVER
包装说明	DFP,	DIP,	SSOP, SSOP14,.3	QCCN,	QCCN,	QCCN, LCC20,.35SQ	DIP,	-	SOP, SOP14,.25	,
Reach Compliance Code	unknown	unknown	not_compliant	unknown	unknown	not_compliant	unknown	-	unknow	unknow
系列	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	-	HC/UH	-
JESD-30 代码	R-GDFP-F14	R-PDIP-T14	R-PDSO-G14	S-CQCC-N20	S-CQCC-N20	S-CQCC-N20	R-PDIP-T14	-	R-PDSO-G14	-
长度	9.21 mm	19.305 mm	6.2 mm	8.89 mm	8.89 mm	8.89 mm	19.305 mm	-	8.65 mm	-
负载电容（CL）	150 pF	150 pF	150 pF	150 pF	150 pF	150 pF	150 pF	-	50 pF	-
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	-	BUS DRIVER	BUS DRIVER
位数	1	1	1	1	1	1	1	-	1	-
功能数量	4	4	4	4	4	4	4	-	4	-
端口数量	2	2	2	2	2	2	2	-	2	-
端子数量	14	14	14	20	20	20	14	-	14	-
最高工作温度	125 °C	85 °C	85 °C	125 °C	125 °C	125 °C	85 °C	-	85 °C	-
最低工作温度	-55 °C	-40 °C	-40 °C	-55 °C	-55 °C	-55 °C	-40 °C	-	-40 °C	-
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE	-
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	-	TRUE	-
封装主体材料	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-
封装代码	DFP	DIP	SSOP	QCCN	QCCN	QCCN	DIP	-	SOP	-
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	-	RECTANGULAR	-
封装形式	FLATPACK	IN-LINE	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	-	SMALL OUTLINE	-
传播延迟（tpd）	225 ns	38 ns	190 ns	45 ns	225 ns	225 ns	38 ns	-	190 ns	-
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
座面最大高度	2.03 mm	5.08 mm	2 mm	2.03 mm	2.03 mm	2.03 mm	5.08 mm	-	1.75 mm	-
最大供电电压 (Vsup)	6 V	6 V	6 V	6 V	6 V	6 V	6 V	-	6 V	-
最小供电电压 (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V	2 V	-	2 V	-
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-	5 V	-
表面贴装	YES	NO	YES	YES	YES	YES	NO	-	YES	-
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS	-
温度等级	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	MILITARY	INDUSTRIAL	-	INDUSTRIAL	-
端子形式	FLAT	THROUGH-HOLE	GULL WING	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	-	GULL WING	-
端子节距	1.27 mm	2.54 mm	0.65 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	-	1.27 mm	-
端子位置	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL	-	DUAL	-
宽度	6.29 mm	7.62 mm	5.3 mm	8.89 mm	8.89 mm	8.89 mm	7.62 mm	-	3.9 mm	-

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