Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(V
CC
= 2.25V to 5.5V, V
BATT
= 3V,
RESET
not asserted, T
A
= -40°C to +85°C, for MAX16039PLA31+T, T
A
= -55°C to +85°C, unless
otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Operating Voltage Range
Supply Current
SYMBOL
CONDITIONS
V
CC
= 2.8V
I
CC
No load, V
CC
> V
TH
V
CC
= 3.6V
V
CC
= 5.5V
T
A
= +25°C
Supply Current in Battery
Backup Mode
V
BATT
= 2.8V,
V
CC
= 0V,
excluding I
OUT
(V
BATT
+ 0.2V) < V
CC
< 5.5V
T
A
= -40°C to +85°C
T
A
= -55°C
(MAX16039PLA31+T
only)
T
A
= +25°C
T
A
= -40°C to +85°C
-0.1
-0.3
MIN
0
13
16
22
TYP
MAX
5.5
30
35
50
1
2
µA
10
+0.02
+0.02
3.1
3.7
4.6
V
BATT
- 0.2
V
BATT
- 0.15
V
BATT
- 0.15
0
-40
mV
V
Ω
µA
UNITS
V
V
CC
, V
BATT
No load (Note 2)
BATT Standby Current (Note 3)
I
BATT
µA
V
CC
= 4.75V, V
CC
> V
TH
, I
OUT
= 150mA
V
CC
to OUT On-Resistance
R
ON
V
CC
= 3.15V, V
CC
> V
TH
, I
OUT
= 65mA
V
CC
= 2.5V, V
CC
> V
TH
, I
OUT
= 25mA
Output Voltage in Battery
Backup Mode
Battery-Switchover Threshold
V
BATT
= 4.50V, V
CC
= 0V, I
OUT
= 20mA
V
OUT
V
BATT
= 3.15V, V
CC
= 0V, I
OUT
= 10mA
V
BATT
= 2.5V, V
CC
= 0V, I
OUT
= 5mA
V
SW
V
CC
- V
BATT
,
V
CC
< V
TH
V
CC
rising
V
CC
falling
www.maximintegrated.com
Maxim Integrated
│
2
MAX16033–MAX16040
Low-Power Battery-Backup
Circuits in Small μDFN Packages
Electrical Characteristics (continued)
(V
CC
= 2.25V to 5.5V, V
BATT
= 3V,
RESET
not asserted, T
A
= -40°C to +85°C, for MAX16039PLA31+T, T
A
= -55°C to +85°C, unless
otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
RESET OUTPUT
MAX160_ _ _L_46
MAX160_ _ _L_44
Reset Threshold
V
TH
MAX160_ _ _L_31
MAX160_ _ _L_29
MAX160_ _ _L_26
MAX160_ _ _L_23
V
CC
Falling Reset Delay
Reset Active Timeout Period
RESET
Output Low Voltage
RESET
Output High Voltage
RESET
Output Leakage
Current
POWER-FAIL COMPARATOR
PFI Input Threshold
PFI Hysteresis
PFI Input Current
PFO
Output Low Voltage
V
OL
V
OH
V
PFI
= 0V or V
CC
Output asserted
V
CC
>
2.1V, I
SINK
= 1.6mA
V
CC
>
1.2V, I
SINK
= 100µA
0.8 x
V
CC
1
4
0.3 x V
CC
0.7 x V
CC
20
1
V
CC
= 3.3V
100
120
165
-100
V
PFI
V
PFI
falling
1.185
1.235
1
+100
0.3
0.4
1.285
V
%
nA
V
t
RP
V
OL
V
OH
I
LKG
RESET
asserted
I
SINK
= 1.6mA, V
CC
≥
2.1V
I
SINK
= 100µA, V
CC
>
1.2V
0.8 x
V
CC
1
V
CC
falling at 10V/ms
140
4.50
4.25
3.00
2.85
2.55
2.25
4.63
4.38
3.08
2.93
2.63
2.32
25
280
0.3
0.4
4.75
4.50
3.15
3.00
2.70
2.38
µs
ms
V
V
µA
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAX160_ _L only (push-pull),
RESET
not
asserted, I
SOURCE
= 500µA, V
CC
>
V
TH(MAX)
MAX160_ _P only (open drain), not asserted
PFO
Output High Voltage
PFO
Leakage Current
PFO
Delay Time
MAX160_ _L only (push-pull), V
CC
>
V
TH(MAX),
I
SOURCE
= 500µA, output not
asserted
MAX160_ _P only (open drain), V
PFO
= 5.5V,
not asserted
V
PFI
+ 100mV to V
PFI
- 100mV
V
µA
µs
MANUAL RESET (MAX16033/MAX16037)
MR
Input Voltage
Pullup Resistance to V
CC
Minimum Pulse Width
Glitch Immunity
MR
to Reset Delay
V
IL
V
IH
V
kΩ
µs
ns
ns
www.maximintegrated.com
Maxim Integrated
│
3
MAX16033–MAX16040
Low-Power Battery-Backup
Circuits in Small μDFN Packages
Electrical Characteristics (continued)
(V
CC
= 2.25V to 5.5V, V
BATT
= 3V,
RESET
not asserted, T
A
= -40°C to +85°C, for MAX16039PLA31+T, T
A
= -55°C to +85°C, unless
otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Watchdog Timeout Period
Minimum WDI Input Pulse Width
WDI Input Voltage
WDI Input Current
BATTON (MAX16035/MAX16039)
Output Voltage
Output Short-Circuit Current
RESETIN (MAX16036/MAX16040)
RESETIN Threshold
RESETIN Input Current
RESETIN to Reset Delay
CEIN
Leakage Current
CEIN
to
CEOUT
Resistance
CEOUT
Short-Circuit Current
CEIN
to
CEOUT
Propagation
Delay (Note 4)
CEOUT
Output-Voltage High
RESET
to
CEOUT
Delay
Note
Note
Note
Note
1:
2:
3:
4:
(V
RTH
+ 100mV) to (V
RTH
- 100mV)
RESET
asserted
RESET
not asserted, V
CC
= V
TH(MAX),
V
CEIN
= V
CC
/2, I
SINK
= 10mA
RESET
asserted, V
CEOUT
= 0V
50Ω source impedance driver, V
CC
= 4.75V
C
LOAD
= 50pF
V
CC
= 3.15V
V
CC
= 5V, V
CC
>
V
BATT
, I
SOURCE
= 100µA
V
CC
= 0V, V
BATT
>
2.2V, I
SOURCE
= 1µA
0.7 x V
CC
V
BATT
- 0.1
1
1
1.5
2
CHIP-ENABLE GATING (MAX16033–MAX16036)
±1
100
2.0
7
9
µA
Ω
mA
ns
V
µs
V
RTH
1.185
1.235
0.01
1.5
1.285
25
V
nA
µs
V
OL
I
SINK
= 3.2mA, V
BATT
= 2.1V
Sink current, V
CC
= 5V
Source current, V
BATT
>
2V
10
60
30
120
0.4
V
mA
µA
SYMBOL
t
WD
t
WDI
V
IL
V
IH
0.7 x V
CC
-1.0
+1.0
(Note 4)
CONDITIONS
MIN
1.00
100
0.3 x V
CC
TYP
1.65
MAX
2.25
UNITS
s
ns
V
µA
WATCHDOG (MAX16034/MAX16038)
All devices are 100% production tested at T
A
= +25°C. All overtemperature limits are guaranteed by design.
SMT贴片机是表面贴装技术（Surface Mount Technology）中的重要设备，它的性能状态对电子制造的质量和效率有着决定性的影响。因此，对SMT贴片机的主要指标性能进行定期检测非常重要。以下是一些主要的检测项目： 定位精度：定位精度是SMT贴片机的核心性能指标，它直接影响到贴片的准确性。通常，我们通过重复测量贴片机在X、Y轴上的移动误差来检测其定位精度。 贴片速度：贴片速度...[详细]
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