CPZ19-CMPZ5235B THRU
CPZ19-CMPZ5261B
w w w. c e n t r a l s e m i .
c o m
Zener Diode Die
350mW, 6.8 THRU 47 VOLT
The CPZ19-CMPZ5235B thru CPZ19-CMPZ5261B are silicon Zener diodes ideal for all types of
commercial, industrial, entertainment, and computer applications.
MECHANICAL SPECIFICATIONS:
Die Size
Die Thickness
Anode Bonding Pad Size
Top Side Metalization
Back Side Metalization
Scribe Alley Width
Wafer Diameter
BACKSIDE CATHODE
R0
17.7 x 17.7 MILS
7.5 MILS
11 x 11 MILS
Al – 13,000Å
Au – 14,000Å
1.6 MILS
4 INCHES
36,642
UNITS
°C
Gross Die Per Wafer
SYMBOL
TJ, Tstg
MAXIMUM RATINGS:
Operating and Storage Junction Temperature
-65 to +150
ELECTRICAL CHARACTERISTICS:
(TA=25°C) VF=0.9V MAX @ IF=10mA (for all types)
Zener
Voltage
Type
MIN
V
CPZ19-CMPZ5235B
CPZ19-CMPZ5236B
CPZ19-CMPZ5237B
CPZ19-CMPZ5238B
CPZ19-CMPZ5239B
CPZ19-CMPZ5240B
CPZ19-CMPZ5241B
CPZ19-CMPZ5242B
CPZ19-CMPZ5243B
CPZ19-CMPZ5244B
CPZ19-CMPZ5245B
CPZ19-CMPZ5246B
CPZ19-CMPZ5247B
CPZ19-CMPZ5248B
6.460
7.125
7.790
8.265
8.645
9.500
10.45
11.40
12.35
13.30
14.25
15.20
16.15
17.10
VZ @ IZT
NOM
V
6.8
7.5
8.2
8.7
9.1
10
11
12
13
14
15
16
17
18
MAX
V
7.140
7.875
8.610
9.135
9.555
10.50
11.55
12.60
13.65
14.70
15.75
16.80
17.85
18.90
IZT
mA
20
20
20
20
20
20
20
20
9.5
9.0
8.5
7.8
7.4
7.0
Test
Current
Maximum
Zener
Impedance
ZZT @ IZT
Ω
5.0
6.0
8.0
8.0
10
17
22
30
13
15
16
17
19
21
ZZK @ IZK
Ω
750
500
500
600
600
600
600
600
600
600
600
600
600
600
mA
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
Maximum
Reverse
Current
IR
μA
3.0
3.0
3.0
3.0
3.0
3.0
2.0
1.0
0.5
0.1
0.1
0.1
0.1
0.1
@
VR
V
5.0
6.0
6.5
6.5
7.0
8.0
8.4
9.1
9.9
10
11
12
13
14
Maximum
Temperature
Coefficient
ΘV
Z
% / °C
+0.050
+0.058
+0.062
+0.065
+0.068
+0.075
+0.076
+0.077
+0.079
+0.082
+0.082
+0.083
+0.084
+0.085
Note: VZ Tolerance is ±5%.
R0 (22-November 2016)
CPZ19-CMPZ5235B THRU
CPZ19-CMPZ5261B
Zener Diode Die
350mW, 6.8 THRU 47 VOLT
w w w. c e n t r a l s e m i .
c o m
ELECTRICAL CHARACTERISTICS - Continued:
(TA=25°C) VF=0.9V MAX @ IF=10mA (for all types)
Zener
Voltage
Type
MIN
V
CPZ19-CMPZ5249B
CPZ19-CMPZ5250B
CPZ19-CMPZ5251B
CPZ19-CMPZ5252B
CPZ19-CMPZ5253B
CPZ19-CMPZ5254B
CPZ19-CMPZ5255B
CPZ19-CMPZ5256B
CPZ19-CMPZ5257B
CPZ19-CMPZ5258B
CPZ19-CMPZ5259B
CPZ19-CMPZ5260B
CPZ19-CMPZ5261B
18.05
19.00
20.90
22.80
23.75
25.65
26.60
28.50
31.35
34.20
37.05
40.85
44.65
VZ @ IZT
NOM
V
19
20
22
24
25
27
28
30
33
36
39
43
47
MAX
V
19.95
21.00
23.10
25.20
26.25
28.35
29.40
31.50
34.65
37.80
40.95
45.15
49.35
IZT
mA
6.6
6.2
5.6
5.2
5.0
4.6
4.5
4.2
3.8
3.4
3.2
3.0
2.7
Test
Current
Maximum
Zener
Impedance
ZZT @ IZT
Ω
23
25
29
33
35
41
44
49
58
70
80
93
105
ZZK @ IZK
Ω
600
600
600
600
600
600
600
600
700
700
800
900
1000
mA
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
Maximum
Reverse
Current
IR
μA
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
@
VR
V
14
15
17
18
19
21
21
23
25
27
30
33
36
Maximum
Temperature
Coefficient
ΘV
Z
% / °C
+0.086
+0.086
+0.087
+0.088
+0.089
+0.090
+0.091
+0.091
+0.092
+0.093
+0.094
+0.095
+0.095
Note: VZ Tolerance is ±5%.
R0 (22-November 2016)
CPZ19-CMPZ5235B THRU
CPZ19-CMPZ5261B
Typical Electrical Characteristics
w w w. c e n t r a l s e m i .
c o m
R0 (22-November 2016)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT:
Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM:
Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN:
Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR:
Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
SAWN WAFER ON METAL FRAME
WS:
Full wafer, sawn and mounted on metal frame,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WS)
R0 (7-December 2015)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2
nd
day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s
LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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